Taiwan Semiconductor Corporation TS15P07G C2G

Overview

TS15P07G from Taiwan Semiconductor is a 15A, 1000V standard quad bridge rectifier in TS-6P package, featuring glass-passivated junctions, <0.1μA typical reverse leakage at 25°C, 240A peak surge capability, and UL Recognized (E-326243) construction. It is used in high-reliability AC/DC front-ends for industrial SMPS and lighting ballasts.

For engineers reviewing the TS15P07G datasheet, TS15P07G pinout, TS15P07G application, or TS15P07G equivalent, key selection criteria include rated VRRM (1000V), IFSM (240A), thermal resistance (0.8°C/W), AEC-Q101 qualification status, and TS-6P mechanical compatibility with PCB-mounting torque limits (0.92 N·m max).

Technical Context

The TS15P07G integrates four silicon diodes in a single-phase bridge configuration with common-cathode/common-anode topology. Its glass-passivated junction ensures stable reverse characteristics across -55°C to +150°C operating range and supports high-reliability operation under repetitive surge stress (239.04 A²s I²t rating).

Designed for surface-mount-compatible through-hole assembly, the TS-6P package uses matte tin-plated leads compliant with J-STD-002 solderability and JESD201 Class 2 whisker resistance. Polarity is marked on the case, and the molding compound meets UL 94V-0 flammability requirements.

Key Specifications

Pinout & Package

Package: TS-6P - 6-pin through-hole molded plastic package with integrated bridge topology; lead finish: matte tin; weight: 7.15 g; UL 94V-0 rated compound; mounting torque ≤ 0.92 N·m.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar bridge rectifier applications.

Compared with VS-15F100 and GBPC1510, the TS15P07G offers superior thermal performance (0.8°C/W), tighter reverse leakage control (<10 µA), and optional AEC-Q101 qualification-making it optimal for thermally demanding, high-reliability industrial and automotive-adjacent applications.

Availability

TS15P07G is available at Aetrix Electronics and suitable for industrial SMPS, LED drivers, AC-DC adapters, and lighting ballasts requiring stable component supply, long-lifecycle support, and traceable sourcing.

Supply support for TS15P07G includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Taiwan Semiconductor Corporation (TSC) is a vertically integrated analog and discrete semiconductor manufacturer headquartered in Hsinchu, Taiwan, serving global industrial, computing, and consumer markets since 1979.

The TS15P series is part of TSC's high-reliability bridge rectifier product line, engineered for robust AC/DC conversion in harsh thermal and electrical environments-including factory automation, outdoor lighting, and infrastructure power systems.

FAQ

What is the maximum junction temperature rating for TS15P07G?

The TS15P07G has a maximum junction temperature (T_J) of +150°C, verified across its full operating range from -55°C to +150°C. This rating enables reliable operation in enclosed industrial enclosures or high-ambient lighting fixtures. The device maintains specified electrical parameters-including V_F and I_R-up to this limit when thermal design respects the 0.8°C/W R_θJC specification. TS15P07G must be mounted with appropriate heatsinking to avoid exceeding TJ max under sustained 15 A load.

Does TS15P07G have AEC-Q101 qualification?

TS15P07G itself is not AEC-Q101 qualified; however, the AEC-Q101-compliant variant is TS15P07GH (with "H" suffix). The GH version undergoes additional stress testing per AEC-Q101 Rev D, including HTGB, HTRB, and temperature cycling. Both share identical electrical specs and TS-6P packaging, but only TS15P07GH is approved for automotive under-hood or cabin applications. TS15P07G remains suitable for industrial and commercial use where AEC-Q101 is not mandated.

What is the forward voltage drop of TS15P07G at rated current?

At 15.0 A forward current and 25°C junction temperature, the TS15P07G exhibits a maximum forward voltage drop (V_F) of 1.1 V per diode-equivalent to ~2.2 V total across the bridge's conducting path. This value is measured under pulse conditions (PW = 0.3 ms) to avoid self-heating effects. At elevated temperatures (e.g., 125°C), V_F decreases slightly due to negative temperature coefficient, improving conduction efficiency in thermally managed designs using TS15P07G.

How does the TS-6P package of TS15P07G differ from standard GBPC or KBPC packages?

The TS-6P package used by TS15P07G features a low-profile, 6-pin through-hole outline optimized for high thermal transfer and PCB space efficiency. Unlike larger GBPC or KBPC packages, TS-6P integrates the bridge die into a compact UL 94V-0 mold compound with a dedicated thermal slug (electrically isolated) and matte tin-plated leads. Its 0.8°C/W R_θJC is 20–30% lower than typical GBPC-4 or KBPC-10 equivalents, enabling higher power density without sacrificing thermal margin in TS15P07G-based designs.

What is the reverse leakage current specification for TS15P07G at 125°C?

At 125°C junction temperature and rated reverse voltage (1000 V), the TS15P07G specifies a maximum reverse leakage current (I_R) of 500 µA per diode-measured under 30 ms pulse conditions. This value reflects worst-case behavior under thermal stress and remains well below failure thresholds for most industrial applications. At 25°C, I_R is typically <0.1 µA and guaranteed ≤10 µA, confirming tight process control in TS15P07G manufacturing.