Taiwan Semiconductor Corporation TS25P01G D2G

Overview

TS25P01G from Taiwan Semiconductor is a 25A, 50V standard quad bridge rectifier in TS-6P package, featuring glass-passivated junctions, <0.1μA typical reverse leakage at 25°C, 350A peak surge capability, and UL Recognized (E-326243) construction - used in AC/DC front-end stages of industrial SMPS and lighting ballasts.

For engineers reviewing the TS25P01G datasheet, TS25P01G pinout, TS25P01G application, or TS25P01G equivalent, key selection criteria include repetitive peak reverse voltage (50 V), forward current rating (25 A), thermal resistance (0.6 °C/W), AEC-Q101 qualification status, and TS-6P mechanical compatibility with high-density PCB layouts.

Technical Context

The TS25P01G integrates four silicon diodes in a single-phase full-wave bridge configuration within a molded TS-6P package, enabling compact AC-to-DC conversion without external interconnects. Its glass-passivated junction ensures stable reverse characteristics across temperature and long-term reliability under repetitive surge stress.

Thermal performance is defined by a low junction-to-case resistance of 0.6 °C/W, supporting continuous 25A conduction at case temperatures up to 85°C when mounted on adequate copper area. Reverse current remains ≤10 μA at 25°C and ≤500 μA at 125°C under rated 50V reverse bias.

Key Specifications

Pinout & Package

TS-6P is a 6-pin, single-in-line (SIL) molded plastic package with matte tin-plated leads compliant with J-STD-002 solderability and JESD201 Class 2 whisker resistance. Polarity is marked on the device body per standard bridge orientation.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar bridge rectifier applications.

Compared with VS-25BQ05 and GBPC2505, the TS25P01G delivers superior thermal performance (0.6 °C/W), UL recognition for safety-critical systems, and optional AEC-Q101 qualification - making it preferred for space-constrained, thermally demanding, or automotive-adjacent applications requiring certified reliability.

Availability

TS25P01G is available at Aetrix Electronics and suitable for switching mode power supplies, LED lighting drivers, and industrial control transformers requiring stable component supply, consistent parametric performance, and long-term manufacturing continuity.

Supply support for TS25P01G includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Taiwan Semiconductor Corporation (TSC) is a vertically integrated analog and discrete semiconductor manufacturer headquartered in Hsinchu, Taiwan, specializing in power rectifiers, TVS diodes, MOSFETs, and bipolar transistors since 1979.

The TS25P series was developed to deliver high-surge, low-leakage bridge rectifiers in compact TS-6P packages for next-generation energy-efficient AC/DC converters targeting industrial, lighting, and automotive auxiliary power applications.

FAQ

What is the maximum junction temperature rating for TS25P01G?

The TS25P01G has a maximum junction temperature (TJ max) of +150°C, allowing reliable operation in high-ambient environments such as enclosed industrial power supplies or under-hood automotive auxiliary modules. This rating is validated per JEDEC standards and supports continuous 25A conduction when thermal design maintains case temperature ≤85°C. The TS25P01G datasheet specifies derating curves confirming usable current down to 0A at +150°C case temperature.

Does TS25P01G meet automotive qualification standards?

The base TS25P01G is not AEC-Q101 qualified; however, the variant TS25P01GH is explicitly qualified per AEC-Q101 Rev D for stress testing including HTGB, TCT, and ESD. TS25P01G shares identical electrical and thermal specs with TS25P01GH but lacks the automotive test documentation. For automotive applications, TS25P01GH must be specified - the "H" suffix denotes qualification, not a different die or package.

What is the forward voltage drop of TS25P01G at rated current?

At IF = 25.0A and TJ = 25°C, the TS25P01G exhibits a maximum forward voltage drop of 1.1 V per diode (i.e., 2.2 V total across the bridge). This value is measured under pulse conditions (PW = 0.3ms) and reflects conduction loss in high-current SMPS designs. At lower currents (e.g., 12.5A), VF drops to ≤1.0 V per diode, improving efficiency in partial-load operation.

How does the TS-6P package of TS25P01G compare to traditional bridge packages like KBPC or GBPC?

The TS-6P package of TS25P01G measures 17.5 × 8.5 × 4.5 mm and uses a single-in-line leadframe with six terminals, offering higher power density than through-hole GBPC-4 (22 × 18 mm) or KBPC-6 (28 × 20 mm). Its 0.6 °C/W RθJC is ~30% lower than typical GBPC packages, enabling better thermal performance in slim-profile adapters and densely packed control boards where airflow is limited.

Is TS25P01G RoHS and halogen-free compliant?

Yes, TS25P01G is fully RoHS compliant and halogen-free per IEC 61249-2-21, using molding compound and matte tin-plated leads that meet both environmental directives. The "G" suffix in TS25P01G explicitly denotes green (halogen-free) compound, and all materials declarations are available in TSC's official PPAP documentation. This compliance supports CE marking and WEEE compliance for global industrial and consumer equipment.