Taiwan Semiconductor Corporation TS25P02G C2G

Overview

TS25P02G from Taiwan Semiconductor is a 25A, 100V rated standard bridge rectifier in TS-6P package, featuring glass passivated junctions, <10µA reverse leakage at 25°C, 350A surge capability, and UL recognition (E-326243), deployed in AC/DC front-end stages of industrial adapters and lighting power supplies.

For engineers reviewing the TS25P02G datasheet, TS25P02G pinout, TS25P02G application, or TS25P02G equivalent, key selection criteria include repetitive peak reverse voltage (100 V), forward current rating (25 A), thermal resistance (0.6 °C/W), AEC-Q101 qualification status, and TS-6P mechanical compatibility with high-density PCB layouts.

Technical Context

This quad-configuration bridge rectifier integrates four silicon diodes in a single TS-6P molded package with matte tin-plated leads. It operates across -55°C to +150°C junction temperature range and delivers stable conduction under 8.3 ms half-sine surge conditions up to 350 A.

Thermal performance is defined by a low junction-to-case resistance of 0.6 °C/W, enabling efficient heat transfer to heatsinks or PCB copper planes. Reverse recovery behavior is not specified; the device is optimized for line-frequency and quasi-resonant SMPS applications rather than high-frequency switching.

Key Specifications

Pinout & Package

TS-6P is a 6-pin, single-in-line (SIL) molded plastic package with 4 active terminals (AC1, AC2, +, –) and 2 unused leads (marked as NC in internal die layout but physically present as structural supports). Leads are matte tin-plated and J-STD-002 solderable.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar bridge rectifier applications.

Compared with GBU25J and KBPC2510, TS25P02G offers superior thermal performance (0.6 °C/W vs. ≥1.0 °C/W), compact TS-6P footprint, and optional AEC-Q101 qualification-making it optimal for thermally dense, automotive-grade, or miniaturized AC/DC converters where layout area and reliability are critical.

Availability

TS25P02G is available at Aetrix Electronics and suitable for switching mode power supplies, LED lighting drivers, and industrial AC/DC adapters requiring stable component supply, long-life reliability, and RoHS/halogen-free compliance.

Supply support for TS25P02G includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Taiwan Semiconductor Corporation (TSC) is a vertically integrated analog and discrete semiconductor manufacturer headquartered in Hsinchu, Taiwan, specializing in power rectifiers, TVS diodes, MOSFETs, and bipolar transistors since 1979.

The TS25P series was developed to deliver high-surge, low-leakage bridge rectifiers for cost-sensitive yet reliability-critical industrial and lighting power applications, with emphasis on UL recognition, thermal efficiency, and PCB-mounting robustness.

FAQ

What is the maximum junction temperature rating for TS25P02G?

The TS25P02G has a maximum junction temperature (T_J) rating of +150°C, verified per absolute maximum ratings table in the official datasheet. This allows continuous operation in high-ambient environments such as enclosed LED luminaires or industrial control panels. Derating curves confirm usable current capacity down to 15 A at 100°C case temperature. The TS25P02G must be mounted with adequate copper pour or heatsinking to maintain T_J ≤ 150°C under full load.

Does TS25P02G meet automotive qualification standards?

The base TS25P02G is not AEC-Q101 qualified; however, the TS25P02GH variant-identical in electrical and thermal specs-is explicitly qualified per AEC-Q101 Rev D for stress testing including HTSL, TC, and HTRB. TS25P02G itself is widely used in non-safety-critical automotive auxiliary supplies (e.g., infotainment USB chargers), but TS25P02GH is required for under-hood or ADAS-related power modules where qualification is mandatory.

What is the forward voltage drop of TS25P02G at rated current?

Per electrical specifications, the TS25P02G exhibits a maximum forward voltage (V_F) of 1.1 V per diode at I_F = 25 A and T_J = 25°C (pulse test, PW = 0.3 ms). At lower currents (12.5 A), V_F is ≤1.0 V. This translates to ~2.2 V total bridge drop at full load, resulting in ~55 W conduction loss at 25 A-necessitating appropriate thermal design using the 0.6 °C/W R_θJC.

Is TS25P02G compatible with lead-free reflow soldering processes?

Yes, TS25P02G features matte tin-plated leads compliant with J-STD-002 for solderability, and its TS-6P molding compound meets UL 94V-0 flammability rating. The device supports standard lead-free reflow profiles (peak 260°C, 10 s max), and its construction tolerates thermal cycling without delamination or whisker growth (JESD 201 Class 2 certified). No special prebake or moisture sensitivity handling is required.

How does the TS-6P package differ from industry-standard KBPC or GBU packages?

The TS-6P package is a proprietary 6-pin single-in-line (SIL) outline with 2.54 mm lead pitch and 15.2 × 10.2 mm body-smaller than KBPC-4 (20 × 18.5 mm) and GBU-4 (22 × 18.5 mm). Unlike those dual-in-line packages, TS-6P places all four terminals on one side, enabling straight-through PCB routing and reduced board area. Its lower R_θJC (0.6 °C/W vs. ~1.0–1.5 °C/W) also improves thermal performance in space-constrained layouts.