Taiwan Semiconductor Corporation TS25P02G D2G

Overview

TS25P02G from Taiwan Semiconductor is a 25A, 100V repetitive peak reverse voltage (V_RRM) quad-configuration standard bridge rectifier in TS-6P package, featuring glass-passivated junctions, <0.1μA typical reverse leakage at 25°C, and 350A I_FSM surge capability - used in AC/DC front-end stages of industrial adapters and lighting power supplies.

For engineers reviewing the TS25P02G datasheet, TS25P02G pinout, TS25P02G application, or TS25P02G equivalent, key selection criteria include V_RRM = 100V, I_F = 25A average forward current, thermal resistance R_θJC = 0.6°C/W, AEC-Q101 qualification availability (TS25P02GH), and TS-6P mechanical compatibility with high-density PCB layouts.

Technical Context

The TS25P02G implements a monolithic quad-diode bridge configuration with glass-passivated silicon junctions, enabling stable operation up to T_J = 150°C and low IR drift across temperature. Its TS-6P package integrates four diodes into a single molded body with matte tin-plated leads compliant with J-STD-002 solderability.

Electrical behavior is defined by two critical operating points: V_F ≤ 1.0V at 12.5A/25°C and ≤1.1V at 25A/25°C; reverse current remains ≤10μA at rated 100V and 25°C, rising to ≤500μA at 125°C - supporting reliable blocking in SMPS input rectification where thermal management and leakage control are critical.

Key Specifications

Pinout & Package

TS-6P is a 6-pin, single-in-line (SIL) molded plastic package with integrated quad-diode bridge topology. Pin spacing conforms to JEDEC MS-012AC, lead finish is matte tin per J-STD-002, and weight is 7.15g.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar bridge rectifier applications.

Compared with VS-25B10 and GBPC2510, the TS25P02G offers superior thermal performance (R_θJC = 0.6°C/W), AEC-Q101 qualification option (TS25P02GH), and tighter V_F specification - making it preferred for space-constrained, thermally demanding, or automotive-adjacent industrial power designs.

Availability

TS25P02G is available at Aetrix Electronics and suitable for switching mode power supplies, industrial AC/DC adapters, and LED driver power supplies requiring stable component supply, consistent parametric performance, and long-term manufacturability.

Supply support for TS25P02G includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Taiwan Semiconductor Corporation (TSC) is a vertically integrated analog and discrete semiconductor manufacturer headquartered in Hsinchu, Taiwan, specializing in power rectifiers, TVS devices, and MOSFETs for industrial and automotive applications.

The TS25P series is designed specifically for high-current, high-reliability AC/DC front-end rectification - emphasizing thermal efficiency, surge robustness, and compliance-ready construction for global power electronics markets.

FAQ

What is the maximum junction temperature rating for TS25P02G?

The TS25P02G has a maximum junction temperature (T_J) rating of +150°C, with a minimum storage temperature of −55°C. This wide operating range supports deployment in thermally aggressive environments such as enclosed LED drivers or industrial control enclosures. Derating curves in the datasheet define safe I_F limits above 75°C case temperature. The TS25P02G must be mounted to maintain junction temperature within this limit under all operating conditions.

Is TS25P02G RoHS and halogen-free compliant?

Yes, the TS25P02G is RoHS compliant and halogen-free per IEC 61249-2-21. The molding compound contains no brominated flame retardants or chlorine-based additives, and lead content is below 1000 ppm. This compliance is verified through material declarations and third-party testing, enabling use in environmentally regulated markets including EU, Japan, and China.

Does TS25P02G have AEC-Q101 qualification?

The base TS25P02G is not AEC-Q101 qualified, but the variant TS25P02GH is fully AEC-Q101 qualified per Rev Q2203 documentation. AEC-Q101 qualification covers stress testing for temperature cycling, humidity bias, and high-temperature operating life - confirming suitability for automotive under-hood and infotainment power supply applications. Always specify "H" suffix when AEC-Q101 compliance is required.

What is the forward voltage drop of TS25P02G at full rated current?

The TS25P02G exhibits a maximum forward voltage drop (V_F) of 1.1 V at I_F = 25 A and T_J = 25°C, measured per diode under pulse conditions (PW = 0.3 ms). At elevated junction temperatures, V_F decreases slightly due to negative temperature coefficient - a characteristic confirmed in the device's forward characteristics curve (Fig.4). This value directly determines conduction losses in the rectifier stage.

How does the TS-6P package of TS25P02G compare to GBU-4K in thermal performance?

The TS25P02G in TS-6P package achieves R_θJC = 0.6°C/W, significantly lower than the GBU-4K package's typical R_θJC = 1.0°C/W. This 40% improvement in thermal resistance allows the TS25P02G to dissipate the same 25A load with ~24°C lower junction rise under identical heatsinking - enabling smaller heatsinks or higher ambient operation. Mechanical dimensions also differ: TS-6P is 10.16 mm wide versus GBU-4K's 12.7 mm.