Taiwan Semiconductor Corporation TS25P03G C2G

Overview

TS25P03G from Taiwan Semiconductor is a 25A, 200V repetitive peak reverse voltage (V_RRM) quad-configuration standard bridge rectifier in TS-6P package, featuring glass-passivated junctions, <0.1μA typical reverse leakage at 25°C, and 350A peak surge current capability-used in AC/DC front-end stages of industrial SMPS and lighting ballasts.

For engineers reviewing the TS25P03G datasheet, TS25P03G pinout, TS25P03G application, or TS25P03G equivalent, key selection criteria include V_RRM = 200V, I_F = 25A, R_θJC = 0.6°C/W, AEC-Q101 qualification availability (TS25P03GH), and TS-6P mechanical compatibility with high-density PCB layouts.

Technical Context

The TS25P03G integrates four silicon diodes in a single-phase full-wave bridge configuration, optimized for high-efficiency AC-to-DC conversion. Its glass-passivated junction ensures stable reverse blocking up to 200V and low IR drift across -55°C to +150°C operating range.

Thermally, it delivers 0.6°C/W junction-to-case resistance and supports 350A non-repetitive surge (8.3ms half-sine) without fusing-enabling robust operation under line transients in offline power supplies.

Key Specifications

Pinout & Package

TS-6P is a molded plastic dual-in-line package with 4 active terminals (AC1, AC2, +, –) and 2 mounting tabs. Leads are matte tin-plated, J-STD-002 solderable, and UL 94V-0 rated.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar bridge rectifier applications.

Compared with VS-25BQ020 and GBPC2502, the TS25P03G offers integrated quad-bridge topology in compact TS-6P with superior thermal resistance (0.6°C/W), enabling higher power density without external heatsinking in space-constrained SMPS designs.

Availability

TS25P03G is available at Aetrix Electronics and suitable for industrial SMPS, LED drivers, and universal-input adapters requiring stable component supply, long-lifecycle support, and RoHS/halogen-free compliance.

Supply support for TS25P03G includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Taiwan Semiconductor Corporation (TSC) is a vertically integrated analog and power discrete manufacturer headquartered in Hsinchu, Taiwan, serving industrial, computing, and automotive markets since 1979.

The TS25P series targets high-reliability AC/DC front-end rectification, emphasizing thermal robustness, surge resilience, and regulatory compliance for mission-critical power conversion systems.

FAQ

What is the maximum junction temperature rating for TS25P03G?

The TS25P03G has a maximum junction temperature (T_JMAX) of +150°C, verified per absolute maximum ratings table. This allows continuous operation in high-ambient environments such as enclosed LED drivers or industrial power supplies where case temperatures may reach 100°C. Derating curves confirm usable current capacity down to 15A at 125°C case temperature. The TS25P03G must be mounted on adequate copper area or heatsink to maintain T_J ≤150°C under full 25A load.

Does TS25P03G meet automotive reliability standards?

The base TS25P03G is not AEC-Q101 qualified; however, the variant TS25P03GH is explicitly certified to AEC-Q101. Both share identical electrical and thermal specs, but only TS25P03GH undergoes extended stress testing including temperature cycling, high-temperature reverse bias, and unbiased highly accelerated stress test (uHAST). For automotive body electronics or infotainment power supplies, TS25P03GH is the compliant option-TS25P03G remains suitable for industrial and commercial applications.

What is the forward voltage drop of TS25P03G at full rated current?

At I_F = 25A and T_J = 25°C, the TS25P03G exhibits a maximum forward voltage drop (V_F) of 1.1V per diode, resulting in ~2.2V total conduction loss across the bridge. This value is measured under pulse conditions (PW = 0.3ms) to avoid self-heating. At elevated junction temperatures (e.g., 125°C), V_F decreases slightly due to semiconductor physics, but system-level losses remain dominated by this 1.1V spec at room-temperature startup and light-load conditions.

How does the TS-6P package of TS25P03G compare to GBPC packages in thermal performance?

The TS25P03G in TS-6P achieves R_θJC = 0.6°C/W, significantly lower than typical GBPC-4 packages (e.g., GBPC2502 at ~1.2°C/W). This 2× improvement stems from TS-6P's optimized internal leadframe geometry and direct die-to-case thermal path. As a result, the TS25P03G dissipates the same 25A load with half the temperature rise across the junction-to-case interface-enabling smaller heatsinks or higher ambient operation without derating.

Is TS25P03G compatible with lead-free reflow soldering processes?

Yes, the TS25P03G uses matte tin-plated leads compliant with J-STD-002 for solderability, and its molding compound meets UL 94V-0 flammability rating. It supports standard lead-free reflow profiles (peak temperature ≤260°C, 60–90 seconds above 217°C) without delamination or bond wire damage. The device's 150°C T_JMAX and thermal design ensure no latent reliability degradation when processed per IPC-J-STD-020 guidelines.