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Taiwan Semiconductor Corporation TS25P03G D2G

Part No.:
TS25P03G D2G
Manufacturer:
Taiwan Semiconductor Corporation
Category:
Bridge Rectifiers
Package:
4-SIP, TS-6P
Datasheet:
AetrixTS25P03G D2G.pdf
Description:
BRIDGE RECT 1P 200V 25A TS-6P
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,742

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Product details

Overview

TS25P03G from Taiwan Semiconductor is a 25A, 200V repetitive peak reverse voltage (VRRM) quad-configuration standard bridge rectifier in TS-6P package, featuring glass-passivated junctions, <0.1μA typical reverse leakage at 25°C, and 350A peak surge current capability; used in AC/DC front-end stages of industrial SMPS and lighting ballasts.

For engineers reviewing the TS25P03G datasheet, TS25P03G pinout, TS25P03G application, or TS25P03G equivalent, key selection criteria include VRRM=200V, IF=25A, IFSM=350A, RθJC=0.6°C/W, and TS-6P mechanical compatibility with high-power PCB layouts.

Technical Context

The TS25P03G integrates four silicon diodes in a single-phase full-wave bridge configuration, optimized for high-efficiency AC-to-DC conversion. Its glass-passivated chip junction ensures stable reverse blocking under thermal stress, while the TS-6P package enables direct heatsink mounting via case contact.

With a maximum junction temperature of 150°C and JESD201 Class 2 whisker resistance, the device supports automotive-grade reliability when specified with 'H' suffix; the TS25P03G variant operates at VR(RMS)=140V and delivers ≤1.1V forward voltage at 25A and 25°C.

Key Specifications

ParameterValue and Actual Design Meaning
VRRM200 V - Peak reverse blocking voltage per diode; defines maximum AC input voltage before breakdown
IF25 A - Continuous average forward current; sets thermal design baseline for heatsink sizing
IFSM350 A - Non-repetitive surge rating (8.3ms half-sine); determines fuse coordination and inrush withstand
RθJC0.6 °C/W - Junction-to-case thermal resistance; enables direct thermal path to heatsink without thermal interface material
IR @ 25°C<10 μA - Max reverse leakage per diode; critical for low-power standby and high-impedance bias networks
TJ max150 °C - Maximum operating junction temperature; constrains ambient + power dissipation limits

Pinout & Package

Package: TS-6P - molded plastic case with 6 leads, UL 94V-0 rated compound, matte tin-plated terminals, 7.15g mass, polarity marked on top surface.

Pin/TerminalCircuit RoleDesign Meaning
AC1AC Input Terminal 1One leg of AC input; connects to transformer secondary or EMI filter output
AC2AC Input Terminal 2Second leg of AC input; completes full-wave bridge input path
+ (Anode Common)Positive DC OutputFull-wave rectified positive rail; routed to bulk capacitor and PFC stage
– (Cathode Common)Negative DC OutputFull-wave rectified return path; serves as system ground reference
CaseThermal & Electrical GroundElectrically connected to cathode common (–); provides primary thermal conduction path to heatsink

Key Features

FeatureDesign Value
Glass-passivated junctionEnables stable reverse characteristics across –55°C to +150°C; eliminates need for conformal coating in humid environments
UL Recognized (E-326243)Validates safety compliance for end-equipment certification without additional system-level testing
JESD201 Class 2 whisker resistancePrevents tin whisker growth under thermal cycling; required for automotive and industrial control applications
RoHS & halogen-free (IEC 61249-2-21)Meets global environmental regulations and enables use in green manufacturing supply chains

Applications

Industrial SMPS Front-EndLED Driver Power Stage

Use Scenario: Rectifying 100–240VAC mains input in open-frame 300W industrial switch-mode power supplies.

IC Role / Device Role / Timing Role: Primary AC/DC conversion element; delivers unregulated DC bus to downstream PFC and DC/DC stages.

Use Value: 200V VRRM and 350A IFSM ensure robust operation during line surges and cold-start inrush.

Use Scenario: High-efficiency rectification in constant-current LED drivers for street lighting and high-bay fixtures.

IC Role / Device Role / Timing Role: Bridge rectifier in offline flyback or buck-boost topology; interfaces directly with EMI filter and bulk capacitor.

Use Value: Low 1.1V VF at 25A reduces conduction loss by >1.5W vs. legacy 35A bridges, improving thermal margin.

AC Adapter Secondary SideMotor Drive Auxiliary Supply

Use Scenario: Universal-input AC adapters (100–240VAC) powering industrial instrumentation and IoT gateways.

IC Role / Device Role / Timing Role: Mains-side rectifier feeding isolated flyback controller; operates continuously at 25A average load.

Use Value: 0.6°C/W RθJC allows direct heatsink mounting without thermal pads, simplifying mechanical design.

Use Scenario: Auxiliary 24V DC supply generation in 3-phase inverter drives for HVAC and pump control.

IC Role / Device Role / Timing Role: Standby rectifier for control logic power; powered from auxiliary winding on main inverter transformer.

Use Value: <10μA IR at 25°C minimizes no-load power draw, supporting Energy Star Tier 2 standby requirements.

Equivalent & Alternatives

The following parts are listed as comparable options for similar bridge rectifier applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
Vishay VS-25BQ020VRRM=200V, IF=25A, but TO-220AC package (single diode), requires external bridge assemblyHigher board area usage; needs 4 discrete diodes + layout routingSelect when existing TO-220 heatsink infrastructure exists and board space permits discrete implementation
ON Semiconductor GBPC2502VRRM=200V, IF=25A, GBPC-4 package; RθJC=1.2°C/W (double TS25P03G's thermal resistance)Limited thermal performance in high-ambient or sealed enclosuresChoose only if GBPC footprint is locked in legacy designs and derating to 15A is acceptable

Compared with VS-25BQ020 and GBPC2502, the TS25P03G delivers integrated quad-bridge functionality in TS-6P with superior thermal resistance (0.6°C/W), enabling higher continuous power density without forced air cooling or oversized heatsinks.

Availability

TS25P03G is available at Aetrix Electronics and suitable for industrial SMPS, LED driver power stages, AC adapter secondary sides, and motor drive auxiliary supplies requiring stable component supply and long-term manufacturability.

Supply support for TS25P03G includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Taiwan Semiconductor Corporation (TSC) is a vertically integrated analog and discrete semiconductor manufacturer headquartered in Hsinchu, Taiwan, serving industrial, automotive, and consumer markets since 1979.

The TS25P series targets high-reliability AC/DC conversion in harsh-environment applications, emphasizing thermal robustness, surge resilience, and regulatory compliance for power supply designers.

FAQ

What is the peak repetitive reverse voltage rating of the TS25P03G?

The TS25P03G has a peak repetitive reverse voltage (VRRM) rating of 200 V. This value is confirmed in the Absolute Maximum Ratings table for the TS25P03G variant and defines the maximum instantaneous reverse voltage the device can block repeatedly without breakdown. It corresponds to the "03" in the part number, indicating the 200V grade within the TS25P01G–TS25P07G family.

Does the TS25P03G meet automotive qualification standards?

The base TS25P03G is not AEC-Q101 qualified; however, the AEC-Q101 version is designated TS25P03GH (with 'H' suffix). The datasheet explicitly states AEC-Q101 qualification applies only to parts marked with 'H', and the TS25P03G without that suffix is intended for industrial and commercial applications where automotive-grade stress testing is not required.

What is the forward voltage drop of the TS25P03G at full rated current?

At IF = 25.0 A and TJ = 25°C, the TS25P03G exhibits a maximum forward voltage (VF) of 1.1 V per diode. This value is specified in the Electrical Specifications table under "Forward voltage per diode" and reflects worst-case conduction loss under nominal junction temperature conditions.

How is thermal management handled for the TS25P03G in high-power designs?

The TS25P03G uses its metal case as the primary thermal path, with a junction-to-case thermal resistance (RθJC) of 0.6°C/W. In practice, this means the case must be mounted directly to an external heatsink using the recommended 0.92 N·m torque; the cathode-common terminal (–) and case are electrically tied, so electrical isolation hardware must be used if the heatsink is grounded.

What packaging and marking information applies to the TS25P03G?

The TS25P03G is supplied in TS-6P package, marked with "TS25P03G" on the top surface, followed by date code (YWW) and factory code (F). It ships in tubes of 15 units. The "G" suffix denotes green (halogen-free) molding compound compliant with IEC 61249-2-21, and all terminals are matte tin-plated per J-STD-002 for reliable solderability.

TS25P03G D2G Specifications

Product attributes
Attribute value
Manufacturer:
Taiwan Semiconductor Corporation
Series:
-
Package/Case:
4-SIP, TS-6P
Packaging:
Tube
Product Status:
Discontinued at Digi-Key
Diode Type:
Single Phase
Technology:
Standard
Voltage - Peak Reverse (Max):
200 V
Current - Average Rectified (Io):
25 A
Voltage - Forward (Vf) (Max) @ If:
1.1 V @ 25 A
Current - Reverse Leakage @ Vr:
10 µA @ 200 V
Operating Temperature:
-55°C ~ 150°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Through Hole
Supplier Device Package:
TS-6P

TS25P03G D2G FAQ

1.How can I place an order for TS25P03G D2G through Aetrix?

Please submit a Request for Quotation (RFQ) for TS25P03G D2G on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for TS25P03G D2G reliable?

The price and inventory of TS25P03G D2G are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TS25P03G D2G is usually 5 days.

3.What payment methods are accepted for TS25P03G D2G?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TS25P03G D2G transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for TS25P03G D2G?

TS25P03G D2G orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your TS25P03G D2G order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for TS25P03G D2G?

For technical support, including TS25P03G D2G datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TS25P03G D2G requirements.

6.How does Aetrix verify that TS25P03G D2G is sourced from the original manufacturer or authorized distributors?

All TS25P03G D2G products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TS25P03G D2G meets industry standards.

7.What is the process for return or replacement of TS25P03G D2G?

All TS25P03G D2G units undergo pre-shipment inspection (PSI). If there is an issue with TS25P03G D2G, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The TS25P03G D2G part is unused and in its original packaging.

Return procedure for TS25P03G D2G:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

TS25P03G D2G Tags

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