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STMicroelectronics TS4855EIJT
- Part No.:
- TS4855EIJT
- Manufacturer:
- STMicroelectronics
- Category:
- Audio Amplifiers
- Package:
- 18-UFBGA, FCBGA
- Datasheet:
-
TS4855EIJT.pdf
- Description:
- IC AMP AB MONO 1.1W 18FLIPCHIP
- Quantity:
- Payment:
- Shipping:
Inventory:3,576
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Product details
Overview
TS4855EIJT from STMicroelectronics is a mono speaker + stereo headset audio driver IC with integrated 32-step digital volume control and SPI-configurable output modes. It delivers 1.1 W (typ.) into 8 Ω BTL speaker load at 1% THD+N (VCC = 5 V), 85 mW (typ.) per channel into 32 Ω BTL headset load at 0.5% THD+N, and operates from 3.0–5.0 V supply. Designed for mobile phone audio subsystems, it integrates speaker and headset drivers in a single flip-chip package.
For engineers reviewing the TS4855EIJT datasheet, TS4855EIJT pinout, TS4855EIJT application, or TS4855EIJT equivalent, key selection criteria include BTL output power capability at low THD+N, ultra-low shutdown current (0.1 µA typ.), thermal shutdown protection, SPI-controlled gain/output mode flexibility, and flip-chip package constraints for space-constrained handheld designs.
Technical Context
The TS4855EIJT implements dual-path analog signal routing: one path for mono speaker output (SPKRout) and two independent paths for stereo headset outputs (Rout/Lout), all operating in bridged-tied-load (BTL) configuration. Gain is digitally controlled via an 8-bit SPI interface with DATA[0:2] selecting among eight output modes and DATA[3:7] setting 32 discrete gain steps (±0.6 dB step accuracy).
It features three distinct input channels - Phone In IHF (high-pass filtered), Phone In HS (headset), and Rin/Lin (line-in) - each with confirmed input impedances (20 kΩ typ. for IHF, 50 kΩ typ. for HS/Rin/Lin) and programmable gain ranges (–40.5 to +6 dB for Phone In HS; –34.5 to +12 dB for Rin/Lin). Thermal shutdown activates at 150 °C (typ.), and pop-and-click suppression is implemented at circuit level.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Supply Voltage | 3.0–5.0 V - Enables direct integration with single-cell Li-ion battery systems without LDO pre-regulation. |
| Speaker Output Power | 1.1 W (typ.) into 8 Ω @ 1% THD+N, 5 V - Sufficient for loud, clear earpiece or small speaker playback in mobile handsets. |
| Headset Output Power | 85 mW (typ.) per channel into 32 Ω @ 0.5% THD+N, 5 V - Supports high-fidelity stereo headphone drive with low distortion. |
| Digital Volume Control | 32-step, SPI-controlled - Provides precise, noise-free attenuation without analog potentiometer drift or click artifacts. |
| Shutdown Current | 0.1 µA (typ.) - Minimizes battery drain during standby in always-on mobile devices. |
| Thermal Shutdown Threshold | 150 °C (typ.) - Protects die integrity under sustained high-power operation or poor PCB thermal design. |
| SPI Interface Speed | DC to 10 MHz - Allows fast configuration updates during audio mode switching (e.g., speaker → headset). |
Pinout & Package
TS4855EIJT uses a flip-chip package with 18 × 300 µm bumps. Pin functions are defined by physical bump location and match the TS4855IJT top-view layout.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| DATA | SPI serial data input | Latches LSB-first 8-bit command; controls output mode (bits 0–2) and gain (bits 3–7). |
| CLK | SPI clock input | Samples DATA on rising edge; supports up to 10 MHz for real-time audio path reconfiguration. |
| ENB | SPI enable (active-high) | Must transition high→low after 8 bits to latch data; enables deterministic timing for mode/gain updates. |
| SPKRout | Mono speaker BTL output | Differential output pair driving 4–16 Ω loads; requires no external coupling capacitors in BTL mode. |
| Rout / Lout | Stereo headset BTL outputs | Independent differential channels for right/left earpieces; each drives 16–32 Ω loads. |
| VCC | Power supply input | Accepts 3.0–5.0 V; internal regulation ensures stable biasing across battery discharge curve. |
| GND | Analog/digital ground reference | Single ground plane required; separation not supported - simplifies layout but demands careful return path design. |
| CB | Half-supply bypass capacitor terminal | Connects to 2.2 µF capacitor to generate internal virtual ground for BTL output stage. |
| Cin | Input coupling capacitor node | AC-couples audio source; forms high-pass filter with 50 kΩ input impedance (fc ≈ 7.2 Hz with 470 nF). |
Key Features
| Feature | Design Value |
|---|---|
| Integrated dual-path audio driver | Combines mono speaker + stereo headset amplification in one die - eliminates need for separate codecs or drivers in mobile baseband designs. |
| Ultra-low pop-and-click | Hardware-level suppression during power-up/down and mode transitions - meets EN 50371 acoustic noise requirements for handhelds. |
| Eight configurable output modes | Selects between mute, +12 dB boost, or mixed signal routing (e.g., Phone In HS + Rin/Lin) - enables flexible audio path management without external switches. |
| Flip-chip packaging | 18-bump, compact footprint - reduces PCB area by >40% vs. QFN equivalents and improves thermal conduction to board. |
| A-weighted SNR | 80 dB (typ.) - Ensures clean audio reproduction with minimal background hiss in quiet listening environments. |
Applications
| Mobile Handset Speaker Drive | Smartphone Stereo Headset Interface |
|---|---|
|
Use Scenario: Driving a mono 8 Ω ceramic speaker in a slim smartphone chassis during voice calls or media playback. IC Role / Device Role / Timing Role: Mono BTL speaker amplifier with programmable gain and thermal protection - handles peak power bursts while maintaining THD+N ≤ 1%. Use Value: Delivers 1.1 W RMS output at 5 V without external boost converter, reducing bill-of-materials and PCB space. |
Use Scenario: Delivering low-distortion stereo audio to 32 Ω wired headphones during music playback or video conferencing. IC Role / Device Role / Timing Role: Dual-channel BTL headset driver with independent gain control - maintains channel balance and minimizes crosstalk (< –70 dB). Use Value: Achieves 0.5% THD+N at 85 mW/channel, enabling Hi-Res Audio-compatible playback without external DAC buffering. |
| Multi-Source Audio Routing | Battery-Efficient Voice Call Subsystem |
|
Use Scenario: Dynamically switching between microphone input sources (e.g., headset mic vs. built-in mic) and routing to speaker/headset outputs. IC Role / Device Role / Timing Role: SPI-configurable signal router with eight output mode combinations - enables software-defined audio path selection in real time. Use Value: Eliminates need for external analog switches or multiplexers, reducing component count and signal path degradation. |
Use Scenario: Maintaining low-power voice call functionality during extended standby with rapid wake-up capability. IC Role / Device Role / Timing Role: Ultra-low shutdown current (0.1 µA typ.) and fast enable timing (ENB hold time = 20 ns) - preserves battery life while supporting instant audio activation. Use Value: Extends talk-time by >15% vs. comparable drivers with µA-range standby currents, critical for all-day mobile use. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar audio driver applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MAX98357AETE+T | Class D I²S-input amplifier; no integrated headset driver or SPI mode control; requires external DAC. | Targeted at speaker-only applications; lacks stereo BTL headset outputs and multi-source routing capability. | Select when system already includes high-performance DAC and only speaker drive is needed; avoid if headset support or flexible routing is required. |
| TAS5086PAG | 3-channel Class D amplifier with I²C control; higher power (2.8 W/ch), larger HTSSOP-28 package; no flip-chip option. | Designed for portable media players with larger form factors; lacks integrated phone-in signal conditioning and ultra-low shutdown current. | Prefer for higher-output applications where PCB area and battery life are less constrained; not suitable for space-limited mobile handset designs. |
Compared with MAX98357AETE+T and TAS5086PAG, TS4855EIJT uniquely integrates mono speaker + stereo headset drive, SPI-based multi-mode routing, and flip-chip packaging - making it the only solution that satisfies simultaneous space, power, and functional requirements of modern smartphone audio subsystems.
Availability
TS4855EIJT is available at Aetrix Electronics and suitable for mobile handset speaker drive, smartphone stereo headset interface, multi-source audio routing, and battery-efficient voice call subsystems requiring stable component supply across production lifecycles.
Supply support for TS4855EIJT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader specializing in analog, power, and microcontroller solutions for automotive, industrial, and consumer markets.
The TS4855 series belongs to ST's low-power audio driver product line, engineered specifically for space-constrained mobile communication devices requiring integrated speaker/headset amplification with minimal external components.
FAQ
What is the minimum recommended input coupling capacitor value for TS4855EIJT?
The input coupling capacitor (Cin) forms a high-pass filter with the device's 50 kΩ input impedance. For a –3 dB cutoff frequency of 7.2 Hz (suitable for full-bandwidth audio), a 470 nF capacitor is recommended. Lower values increase bass roll-off; values below 100 nF degrade low-frequency response below 30 Hz.
Does TS4855EIJT require external bootstrap or charge-pump circuitry?
No. TS4855EIJT uses an internal virtual ground generated via the CB pin (connected to a 2.2 µF capacitor) to enable true BTL operation without external charge pumps or bootstrap networks. This eliminates associated EMI, component count, and layout complexity typical of Class AB/BTL drivers.
Can TS4855EIJT drive 16 Ω headphones effectively?
Yes. At VCC = 5 V, TS4855EIJT delivers 100 mW (typ.) per channel into 16 Ω at 0.5% THD+N - exceeding the 85 mW spec for 32 Ω. Its output stage is stable down to 8 Ω, supporting wider headphone impedance ranges without oscillation or thermal derating.
Is the TS4855EIJT pinout compatible with TS4855IJT?
Yes. TS4855EIJT and TS4855IJT share identical flip-chip bump mapping, thermal pad configuration, and electrical pin functions. The "E" suffix denotes enhanced screening or qualification level; mechanical and functional compatibility is maintained for drop-in replacement in existing designs.
TS4855EIJT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Series:
- -
- Package/Case:
- 18-UFBGA, FCBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Type:
- Class AB
- Output Type:
- 1-Channel (Mono) with Stereo Headphones
- Max Output Power x Channels @ Load:
- 1.1W x 1 @ 8Ohm; 100mW x 2 @ 32Ohm
- Voltage - Supply:
- 3V ~ 5.5V
- Features:
- Depop, Mute, SPI, Standby, Thermal Protection, Volume Control
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 18-FlipChip
TS4855EIJT FAQ
1.How can I place an order for TS4855EIJT through Aetrix?
Please submit a Request for Quotation (RFQ) for TS4855EIJT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TS4855EIJT reliable?
The price and inventory of TS4855EIJT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TS4855EIJT is usually 5 days.
3.What payment methods are accepted for TS4855EIJT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TS4855EIJT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TS4855EIJT?
TS4855EIJT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TS4855EIJT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TS4855EIJT?
For technical support, including TS4855EIJT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TS4855EIJT requirements.
6.How does Aetrix verify that TS4855EIJT is sourced from the original manufacturer or authorized distributors?
All TS4855EIJT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TS4855EIJT meets industry standards.
7.What is the process for return or replacement of TS4855EIJT?
All TS4855EIJT units undergo pre-shipment inspection (PSI). If there is an issue with TS4855EIJT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TS4855EIJT part is unused and in its original packaging.
Return procedure for TS4855EIJT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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