STMicroelectronics TS488IST

Overview

TS488IST from STMicroelectronics is a dual-channel, pop-and-click-noise-suppressed stereo headphone amplifier IC designed for low-voltage portable audio systems. It delivers 120 mW per channel into 16 Ω at 5 V (0.1% THD+N), operates from 2.2 V to 5.5 V, and features active-low standby mode with 10 nA typical current. It targets space-constrained mobile phone and portable audio player applications requiring high SNR and crosstalk immunity.

For engineers reviewing the TS488IST datasheet, TS488IST pinout, TS488IST application, or TS488IST equivalent, this page provides verified electrical specifications, DFN8 2×2 mm package layout, real-world output power vs. supply voltage curves, standby wake-up timing (100 ms), and validated alternatives for headset amplifier design in battery-powered consumer electronics.

Technical Context

The TS488IST is a unity-gain-stable, inverting dual op-amp-based audio power amplifier with externally set closed-loop gain via Rin/Rfeed resistor networks. Its internal pop/click suppression circuitry eliminates turn-on/turn-off transients without requiring external mute sequencing.

It integrates short-circuit protection and thermal shutdown, supports single-ended 16 Ω or 32 Ω headset loads, and achieves 102 dB crosstalk rejection at 1 kHz due to high PSRR (70 dB typ.) and ultra-low input capacitance (1 pF), enabling robust performance in noisy RF-rich mobile environments.

Key Specifications

Pinout & Package

TS488IST is housed in a thermally enhanced DFN8 2×2 mm, 0.5 mm pitch, exposed-pad package optimized for low-profile portable designs. The exposed thermal pad must be soldered to PCB ground for optimal thermal performance (R_thJA = 40 °C/W on 4-layer board).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar stereo headphone amplifier applications.

Compared with MAX98304EWC+T and TAS5707PAG, the TS488IST uniquely balances ultra-low standby current (10 nA), analog flexibility (external gain setting), and DFN8 footprint - making it optimal for cost-sensitive, battery-constrained analog audio endpoints where wake latency and quiescent power dominate selection criteria.

Availability

TS488IST is available at Aetrix Electronics and suitable for mobile phone audio subsystems, USB-C analog adapters, and portable media players requiring stable component supply, long-term lifecycle support, and RoHS-compliant DFN packaging.

Supply support for TS488IST includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing analog, microcontroller, power, and sensor solutions for automotive, industrial, and consumer markets.

The TS488IST belongs to ST's low-power audio amplifier product line, engineered specifically for space- and energy-constrained portable audio endpoints where pop suppression, standby efficiency, and small-footprint integration are critical.

FAQ

What is the minimum recommended output coupling capacitor value for 16 Ω loads?

The datasheet specifies Cout ≥ 470 µF for 16 Ω loads to maintain ≤ 20 Hz low-frequency response (Fc = 1/(2π × RL × Cout)). With RL = 16 Ω, a 470 µF capacitor yields Fc ≈ 21 Hz, ensuring full bass extension without attenuation. Lower values increase corner frequency and reduce bass output.

Can TS488IST drive 32 Ω headphones at 2.5 V supply?

Yes - at 2.5 V, TS488IST delivers 31 mW per channel into 16 Ω and 19 mW into 32 Ω (0.1% THD+N, 1 kHz). This meets typical 32 Ω headphone sensitivity (100–110 dB/mW), providing >105 dB SPL at full scale - sufficient for most portable listening scenarios.

Is the NC pin (Pin 8) required to be grounded or left floating?

Pin 8 is explicitly designated "NC" (no connect) in the datasheet and internal die map. It must remain unconnected - neither grounded nor tied to VCC or any other net. Connecting it risks latch-up or parametric shift due to internal floating node coupling.

How does thermal performance change with PCB layer count?

R_thJA improves from 70 °C/W (2-layer) to 40 °C/W (4-layer) when the exposed thermal pad is fully soldered to inner ground planes. For 120 mW operation at 5 V, junction temperature rise is ~4.8 °C on 4-layer vs. ~8.4 °C on 2-layer - well within 150 °C limit, but 4-layer strongly recommended for sustained output.