STMicroelectronics TS4997IQT

Overview

TS4997IQT from STMicroelectronics is a 2-channel, 1W BTL stereo audio power amplifier with differential inputs, programmable 3D audio enhancement, and independent channel standby control. It delivers 1W per channel into 8Ω at 5V, achieves 106dB(A) SNR and 80dB PSRR at 217Hz, and operates from 2.7V to 5.5V - optimized for space-constrained portable audio systems including mobile phones and LCD monitors.

For engineers reviewing the TS4997IQT datasheet, TS4997IQT pinout, TS4997IQT application, or TS4997IQT equivalent, this page provides verified technical context on its dual-channel BTL architecture, 3D effect programming interface (3D0/3D1), per-channel standby pins (STBYL/STBYR), QFN16 thermal performance, and real-world audio fidelity metrics including THD+N ≤0.5% and pop&click-free startup.

Technical Context

The TS4997IQT implements a fully differential input stage with internal common-mode feedback, enabling optional input coupling capacitors and high CMRR (57dB). Its BTL output stage drives 8Ω loads with 1W RMS per channel at 5V while maintaining low distortion (THD+N = 0.5% at 700mW, 20Hz–20kHz).

3D audio enhancement is digitally controlled via two logic-level inputs (3D0/3D1), selecting among OFF/MEDIUM/LOW/HIGH modes without external components. Each channel features dedicated standby pins (STBYL/STBYR) that reduce quiescent current to 10nA typ. when pulled low, and integrated thermal shutdown protects against junction temperatures exceeding 150°C.

Key Specifications

Pinout & Package

TS4997IQT uses a lead-free QFN16 4×4mm package with exposed thermal pad for enhanced power dissipation in thin-profile PCBs. Pin numbering follows top-view layout with pins 1–8 on bottom row (left-to-right) and 9–16 on top row (right-to-left), matching standard QFN orientation.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar stereo BTL audio amplifier applications.

Compared with TAS5342AIDBTR and MAX97220AETE+T, TS4997IQT uniquely balances 1W/channel output, 10nA standby, programmable 3D, and single-supply 2.7–5.5V operation - making it optimal for cost-sensitive, space-constrained portable audio where feature flexibility and power efficiency are jointly critical.

Availability

TS4997IQT is available at Aetrix Electronics and suitable for cellular mobile phones, notebook computers, and portable audio devices requiring stable component supply and long-term lifecycle support.

Supply support for TS4997IQT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing analog, microcontroller, power, and sensor solutions for industrial, automotive, and consumer markets.

The TS4997 belongs to ST's high-efficiency audio amplifier product line, engineered specifically for portable electronics demanding low-voltage operation, minimal external components, and advanced audio features like hardware-programmable 3D enhancement.

FAQ

What is the minimum recommended bypass capacitor value for the BYP pin?

The BYP pin requires a 1µF ceramic capacitor connected to ground to generate a stable half-supply reference for the differential input stage. Using <1µF risks increased offset voltage and degraded common-mode rejection; X7R dielectric is recommended for temperature stability across −40°C to +85°C operation.

Can TS4997IQT drive 4Ω speakers?

Yes - the device supports 4Ω loads with up to 1.3W per channel at 5V (THD+N = 1%), though power dissipation increases and thermal derating must be applied. The absolute maximum rating specifies RL ≥ 4Ω, and Figure 57 confirms output power vs. load resistance down to 4Ω across all supply voltages.

How does the 3D effect impact THD+N performance?

Enabling 3D enhancement increases THD+N by ≤0.05% at mid-band frequencies (1kHz) and 700mW output, as confirmed in Figure 17 and Table 4. The effect is implemented via internal signal path modulation and does not degrade SNR or introduce measurable intermodulation distortion in typical use cases.

Is the exposed thermal pad electrically connected?

Yes - the exposed pad on the QFN16 package is internally connected to GND and must be soldered to a PCB thermal pad tied to the main ground plane. This connection is essential for achieving the specified R_thJA of 45°C/W (4-layer board) and preventing thermal shutdown during sustained 1W output.