Taiwan Semiconductor Corporation TS50P05GH

Overview

TS50P05GH from Taiwan Semiconductor is a 50A, 600V AEC-Q101-qualified standard quad bridge rectifier in TS-6P package, featuring glass-passivated junctions, <0.1μA typical reverse leakage at 25°C, 400A peak surge capability, and UL Recognized (E-326243) construction - used in automotive-grade SMPS and lighting power supplies.

For engineers reviewing the TS50P05GH datasheet, TS50P05GH pinout, TS50P05GH application, or TS50P05GH equivalent, key selection criteria include V_RRM = 600 V, I_F = 50 A, R_θJC = 0.56 °C/W, AEC-Q101 qualification status, and TS-6P mechanical compatibility with PCB-mount thermal management.

Technical Context

This device integrates four high-voltage diodes in a single-phase full-wave bridge configuration with glass-passivated silicon junctions for enhanced reliability under thermal cycling and humidity stress. Its 600 V repetitive peak reverse voltage and 420 V RMS reverse rating support universal-input AC/DC front-end designs.

The TS-6P package delivers low thermal resistance (0.56 °C/W junction-to-case) and meets JESD201 Class 2 whisker resistance, UL 94V-0 flammability, and matte tin-plated solderable leads per J-STD-002 - enabling robust mounting in automotive and industrial power modules.

Key Specifications

Pinout & Package

TS-6P is a 6-pin, isolated, molded plastic package with integrated heatsink tab (pin 1–2–3–4 = AC inputs; pin 5 = +DC output; pin 6 = –DC output). Leads are matte tin-plated and compliant with J-STD-002 solderability.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar bridge rectifier applications.

Compared with VS-50WQ06FN-M3 and MUR5060CT, TS50P05GH uniquely combines AEC-Q101 qualification, 50 A rating, 0.56 °C/W thermal resistance, and TS-6P surface-mount compatibility - making it the only option qualified for automotive lighting and high-power industrial rectification where reliability and thermal density are co-critical.

Availability

TS50P05GH is available at Aetrix Electronics and suitable for automotive LED drivers, industrial AC/DC adapters, commercial lighting ballasts, and UPS input stages requiring stable component supply with long-lifecycle assurance.

Supply support for TS50P05GH includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Taiwan Semiconductor Corporation (TSC) is a vertically integrated analog and power discrete manufacturer headquartered in Hsinchu, Taiwan, serving automotive, industrial, and consumer markets since 1979.

The TS50P series targets high-reliability AC/DC conversion in harsh environments, emphasizing AEC-Q101 qualification, thermal robustness, and UL safety recognition for front-end rectification in mission-critical power systems.

FAQ

What is the peak repetitive reverse voltage rating for TS50P05GH?

The TS50P05GH has a repetitive peak reverse voltage (V_RRM) of 600 V, verified per Taiwan Semiconductor's H2203 datasheet revision. This rating defines the maximum instantaneous reverse voltage the device can block repeatedly without breakdown. It supports applications with up to 400 V DC bus or 280 V_RMS AC input after rectification. The TS50P05GH must not be operated beyond this limit under normal or transient conditions.

Is TS50P05GH qualified to AEC-Q101 standards?

Yes, TS50P05GH is explicitly AEC-Q101 qualified, as confirmed by the "H" suffix in its ordering code and documented in the H2203 datasheet. This qualification covers stress tests including temperature cycling, high-temperature operating life, and unbiased highly accelerated stress testing. TS50P05GH is approved for use in automotive power electronics such as headlamp drivers and body control modules where reliability under thermal and mechanical stress is mandatory.

What is the thermal resistance from junction to case for TS50P05GH?

The junction-to-case thermal resistance (R_θJC) of TS50P05GH is 0.56 °C/W, measured under standard test conditions per the H2203 datasheet. This value reflects heat transfer efficiency from the silicon die to the external heatsink interface through the TS-6P package's metal tab. Designers use this parameter to calculate maximum allowable power dissipation at a given case temperature - for example, at 100°C case temperature, TS50P05GH supports ~89 W of steady-state power before reaching 150°C junction limit.

Does TS50P05GH have a specified forward voltage drop?

Yes, TS50P05GH has a maximum forward voltage drop (V_F) of 1.1 V per diode at I_F = 25 A and T_J = 25°C, per the H2203 datasheet's electrical specifications table. This value is measured under pulsed conditions (PW = 0.3 ms) to avoid self-heating. At full rated current (50 A), V_F increases due to resistive heating and typically reaches ~1.25–1.35 V depending on thermal management - a critical factor when calculating conduction losses in high-efficiency SMPS designs using TS50P05GH.

What packaging and taping options are available for TS50P05GH?

TS50P05GH is supplied in TS-6P package and packed in tubes containing 15 units per tube, as specified in the H2203 ordering information section. The "H" suffix confirms AEC-Q101 qualification and green (halogen-free) molding compound. No tape-and-reel or bulk packaging variants are listed for TS50P05GH in official documentation; alternate formats would require custom quoting and are not standard offerings. Tube packaging supports manual and semi-automated placement in low-to-medium volume production.