Taiwan Semiconductor Corporation TS6P01G

Overview

TS6P01G from Taiwan Semiconductor is a 6A, 50V standard quad bridge rectifier in TS-6P package, featuring glass-passivated junctions, <10 µA reverse current at 25°C, 150A surge rating, and UL recognition (E-326243), used in AC/DC front-end stages of compact SMPS and LED drivers.

For engineers reviewing the TS6P01G datasheet, TS6P01G pinout, TS6P01G application, or TS6P01G equivalent, key selection criteria include V_RRM = 50 V, I_F = 6 A, I_FSM = 150 A, R_θJC = 1.8 °C/W, and TS-6P mechanical compatibility with high-density PCB layouts.

Technical Context

The TS6P01G integrates four silicon diodes in a single-phase full-wave bridge configuration with common-cathode/common-anode topology. Its glass-passivated junction ensures stable leakage performance (<10 µA @ 25°C) and robustness against humidity and contamination.

Thermally optimized for surface-mount or through-hole mounting, it delivers 1.8 °C/W junction-to-case resistance and supports continuous operation up to T_J = 150°C, with fusing I²t = 93.37 A²s under 8.3 ms surge conditions.

Key Specifications

Pinout & Package

Package: TS-6P - molded plastic case with matte tin-plated leads, UL 94V-0 rated, 7.15 g weight, designed for PCB mounting with 0.92 N·m max torque.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar bridge rectifier applications.

Compared with GBK606 (600 V, 6 A, GBK package) and KBL06 (600 V, 6 A, KBL package), TS6P01G offers lower R_θJC (1.8 vs ≥2.5 °C/W), tighter leakage (<10 µA), and TS-6P's optimized leadframe for automated assembly-making it preferable for thermally constrained, high-volume adapter designs.

Availability

TS6P01G is available at Aetrix Electronics and suitable for switching mode power supplies, LED lighting drivers, and USB-C wall adapters requiring stable component supply, consistent parametric performance, and long-term manufacturing continuity.

Supply support for TS6P01G includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Taiwan Semiconductor Corporation (TSC) is a vertically integrated analog and discrete semiconductor manufacturer headquartered in Hsinchu, Taiwan, serving industrial, computing, and consumer markets since 1979.

The TS6P series was developed specifically for high-efficiency, high-reliability AC/DC front-end rectification in compact power supplies-emphasizing thermal performance, low leakage, and regulatory compliance (UL, AEC-Q101, RoHS).

FAQ

What is the maximum junction temperature rating for TS6P01G?

The TS6P01G has a maximum junction temperature (T_J) rating of +150°C, allowing continuous operation in high-ambient environments such as enclosed LED drivers or industrial control power modules. This rating is validated under specified thermal conditions and must be maintained using appropriate PCB copper area or heatsinking to keep actual T_J within limit. The TS6P01G datasheet confirms this value in its Absolute Maximum Ratings table.

Does TS6P01G have AEC-Q101 qualification?

The base TS6P01G is not AEC-Q101 qualified; however, the variant TS6P01GH is explicitly qualified per AEC-Q101 Rev D for automotive applications. TS6P01G shares identical electrical and thermal specifications but lacks the extended reliability test documentation required for automotive use. For automotive designs, TS6P01GH must be specified and sourced separately.

What is the forward voltage drop of TS6P01G at full rated current?

At I_F = 6 A and T_J = 25°C, the TS6P01G exhibits a maximum forward voltage drop of 1.1 V per diode, as specified in the Electrical Specifications table. This value is measured under pulsed conditions (PW = 0.3 ms) and represents worst-case conduction loss in the bridge-critical for calculating total rectifier power dissipation in high-efficiency SMPS designs.

How does the TS-6P package of TS6P01G compare to KBP or GBU packages in thermal performance?

The TS6P01G's TS-6P package achieves R_θJC = 1.8 °C/W, significantly lower than typical KBP (≈3.5 °C/W) or GBU (≈2.5 °C/W) packages. This superior thermal resistance results from optimized internal leadframe geometry and die attach, enabling higher power density and reduced heatsink dependency-especially beneficial in slim-profile adapters where airflow is limited.

Is TS6P01G compliant with RoHS and halogen-free standards?

Yes, TS6P01G is fully RoHS compliant and halogen-free per IEC 61249-2-21. The molding compound contains no brominated flame retardants or chlorine-based additives, eliminating corrosive outgassing risks in sealed assemblies. This compliance is documented in TSC's material declarations and verified by third-party testing reports available upon request for TS6P01G.