Taiwan Semiconductor Corporation TS6P03G D2G

Overview

TS6P03G from Taiwan Semiconductor is a 6A, 200V repetitive peak reverse voltage (V_RRM) quad-configuration standard bridge rectifier in TS-6P package, featuring glass passivated junctions, <0.1μA typical reverse leakage at 25°C, and 150A peak surge current capability; used in AC/DC front-end stages of industrial adapters and lighting power supplies.

For engineers reviewing the TS6P03G datasheet, TS6P03G pinout, TS6P03G application, or TS6P03G equivalent, key selection criteria include V_RRM = 200V, I_F = 6A, thermal resistance R_θJC = 1.8°C/W, AEC-Q101 qualification availability (TS6P03GH), and TS-6P mechanical compatibility with PCB-mounting torque ≤0.92 N·m.

Technical Context

The TS6P03G integrates four silicon diodes in a single-phase full-wave bridge configuration, enabling direct AC-to-DC conversion without external interconnection. Its glass passivated chip junction ensures stable reverse blocking under transient overvoltage conditions up to 200V, while the TS-6P case supports high thermal dissipation via metal tab mounting.

Rated for continuous forward current of 6A at case temperature ≤75°C, the device delivers 1.1V max forward voltage at 6A/25°C and maintains <500μA reverse current at 125°C - critical for efficiency and reliability in thermally constrained lighting and adapter designs.

Key Specifications

Pinout & Package

Package: TS-6P - molded plastic case with integral metal tab for thermal and mechanical anchoring; matte tin-plated leads compliant with J-STD-002 solderability; UL 94V-0 rated; weight 7.15g.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar bridge rectifier applications.

Compared with TS6P03G, GBU6K offers higher voltage headroom but sacrifices thermal performance and board space efficiency, while KBP206 reduces cost and size at the expense of current capacity and thermal robustness - making TS6P03G optimal for 6A/200V-balanced industrial and lighting applications.

Availability

TS6P03G is available at Aetrix Electronics and suitable for switching mode power supplies, industrial adapters, and LED lighting applications requiring stable component supply, consistent parametric performance, and long-term manufacturing continuity.

Supply support for TS6P03G includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Taiwan Semiconductor Corporation (TSC) is a vertically integrated analog and discrete semiconductor manufacturer headquartered in Hsinchu, Taiwan, specializing in rectifiers, TVS diodes, MOSFETs, and power ICs since 1979.

The TS6P series targets high-reliability AC/DC front-end conversion, emphasizing thermal robustness, safety certification readiness, and automotive-grade variants for industrial and lighting power systems.

FAQ

What is the maximum junction temperature rating for TS6P03G?

The TS6P03G has a maximum junction temperature (T_J) rating of +150°C, verified per absolute maximum ratings table. This allows operation in high-ambient environments such as enclosed LED drivers or industrial adapters. Thermal design must ensure that power dissipation - calculated using R_θJC = 1.8°C/W and measured case temperature - keeps T_J ≤150°C. The TS6P03G datasheet specifies derating curves confirming 6A current capability down to 75°C case temperature.

Is TS6P03G pin-compatible with other TS6P-xG variants?

Yes, all TS6P01G through TS6P07G share identical TS-6P package dimensions, pinout, and terminal assignments - only V_RRM differs (50V to 1000V). The TS6P03G uses the same AC1/AC2/+/-/Tab layout as TS6P02G (100V) and TS6P04G (400V), enabling direct PCB reuse across voltage grades without layout changes. Polarity marking and mechanical mounting torque (≤0.92 N·m) are also identical across the family.

Does TS6P03G meet automotive reliability standards?

The standard TS6P03G is not AEC-Q101 qualified, but its variant TS6P03GH is explicitly certified to AEC-Q101. TS6P03GH undergoes stress testing including temperature cycling, high-temperature reverse bias, and unbiased highly accelerated stress testing (uHAST) per AEC-Q101 Rev D. For automotive body electronics or infotainment power supplies, TS6P03GH - not TS6P03G - must be specified to meet qualification requirements.

What is the forward voltage drop of TS6P03G at full rated current?

The TS6P03G exhibits a maximum forward voltage drop of 1.1 V per conducting diode pair at I_F = 6A and T_J = 25°C, as specified in the electrical characteristics table. Since a full-wave bridge conducts through two diodes in series during each half-cycle, total conduction loss is approximately 2 × 1.1V × 6A = 13.2W at worst-case DC conditions. This value increases slightly at elevated junction temperatures.

How does the TS-6P package of TS6P03G support thermal management?

The TS-6P package of TS6P03G features an integral metal tab internally connected to the cathode (–) terminal, enabling direct thermal coupling to a heatsink or metal chassis. With R_θJC = 1.8°C/W, a 10W power dissipation yields only an 18°C junction-to-case rise. Mounting torque must not exceed 0.92 N·m to avoid die cracking, and the matte tin-plated leads ensure reliable solder wetting per J-STD-002 for consistent thermal interface quality.