Taiwan Semiconductor Corporation TS6P05G C2G

Overview

TS6P05G from Taiwan Semiconductor is a 6A, 600V repetitive peak reverse voltage (V_RRM) quad-configuration standard bridge rectifier in TS-6P package, featuring glass-passivated junctions, <10 µA reverse current at 25°C, and 150 A surge capability - used in AC/DC front-end stages of industrial SMPS and LED drivers.

For engineers reviewing the TS6P05G datasheet, TS6P05G pinout, TS6P05G application, or TS6P05G equivalent, key selection criteria include V_RRM = 600 V, I_F = 6 A continuous, R_θJC = 1.8 °C/W, and AEC-Q101 qualification eligibility (via H-suffix variant), critical for high-reliability power conversion designs.

Technical Context

This device integrates four diodes in a single-phase full-wave bridge configuration with common-cathode and common-anode terminals, enabling direct AC-to-DC rectification without external interconnection. Its glass-passivated chip junction ensures stable leakage performance across temperature, with IR ≤ 10 µA at 25°C and ≤ 500 µA at 125°C under rated reverse voltage.

The TS-6P package supports high thermal dissipation (R_θJC = 1.8 °C/W) and mechanical robustness via UL 94V-0 molding compound and matte tin-plated leads compliant with J-STD-002 solderability and JESD 201 Class 2 whisker resistance.

Key Specifications

Pinout & Package

Package: TS-6P - molded plastic case with 6 leads, UL 94V-0 rated, matte tin-plated, designed for through-hole mounting with 0.92 N·m max torque.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar bridge rectifier applications.

Compared with GBU6K and MB10F, TS6P05G offers superior thermal performance (1.8 °C/W), halogen-free compliance, and optional AEC-Q101 qualification - making it optimal for space-constrained, high-reliability, thermally demanding industrial and automotive-adjacent power supplies.

Availability

TS6P05G is available at Aetrix Electronics and suitable for industrial SMPS, LED driver power stages, and AC/DC adapter secondary circuits requiring stable component supply, consistent parametric performance, and long-term manufacturability.

Supply support for TS6P05G includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Taiwan Semiconductor Corporation (TSC) is a vertically integrated analog and power discrete manufacturer headquartered in Hsinchu, Taiwan, serving industrial, computing, and consumer markets since 1979.

The TS6P series targets high-reliability AC/DC conversion, emphasizing rugged packaging, thermal efficiency, and regulatory compliance - specifically engineered for mission-critical rectification in harsh-environment power systems.

FAQ

What is the maximum junction temperature rating for TS6P05G?

The TS6P05G has a maximum junction temperature (T_J) rating of +150°C, with operational range from –55°C to +150°C. This allows deployment in high-ambient environments such as enclosed LED drivers or industrial motor control cabinets. The device maintains specified electrical parameters within this range, provided thermal design respects R_θJC = 1.8 °C/W and case temperature limits. TS6P05G must be mounted with appropriate heatsinking or PCB copper area to avoid exceeding T_J under full load.

Does TS6P05G have AEC-Q101 qualification?

TS6P05G itself is not AEC-Q101 qualified; however, the AEC-Q101-qualified version is TS6P05GH (with 'H' suffix). The base TS6P05G shares identical electrical and thermal specifications but lacks the extended reliability testing required for automotive under-hood applications. For automotive-grade designs, TS6P05GH must be specified and sourced separately - both variants use the same TS-6P package and pinout.

What is the forward voltage drop of TS6P05G at rated current?

The forward voltage drop (V_F) of TS6P05G is guaranteed ≤1.1 V per diode at I_F = 6 A and T_J = 25°C, measured under pulse conditions (PW = 0.3 ms). At 3 A, V_F is ≤1.0 V. These values reflect conduction loss across one diode pair in the bridge; total bridge drop is twice V_F, impacting overall efficiency and thermal design. TS6P05G's low V_F contributes to reduced power dissipation versus higher-drop alternatives.

How does the TS-6P package differ from GBU or KBPC packages?

The TS-6P package is a proprietary 6-lead through-hole outline with optimized thermal path and compact footprint (14.2 × 10.2 × 4.5 mm), offering R_θJC = 1.8 °C/W - significantly lower than GBU (2.5 °C/W) or KBPC (3.5 °C/W) equivalents. It uses matte tin-plated leads compliant with J-STD-002 and JESD 201 Class 2 whisker resistance. Unlike KBPC, TS-6P includes two NC pins for mechanical balance and does not require lead-forming before insertion.

What is the reverse leakage current specification for TS6P05G?

TS6P05G specifies reverse current (I_R) ≤10 µA per diode at T_J = 25°C and rated V_RRM = 600 V, and ≤500 µA at T_J = 125°C. These values are measured using 30 ms pulse test conditions. Low I_R ensures minimal standby power loss and stable DC bus hold-up in offline power supplies, especially important in energy-efficient LED drivers and always-on adapters where TS6P05G is commonly applied.