Taiwan Semiconductor Corporation TS8P01G D2G

Overview

TS8P01G from Taiwan Semiconductor is a 50V, 8A standard quad bridge rectifier in TS-6P package, featuring glass-passivated junctions, <0.1μA typical reverse leakage at 25°C, 200A peak surge current, and UL recognition (E-326243). It is used in AC/DC front-end stages of compact switching power supplies.

For engineers reviewing the TS8P01G datasheet, TS8P01G pinout, TS8P01G application, or TS8P01G equivalent, key selection criteria include repetitive peak reverse voltage (50 V), average forward current (8 A), thermal resistance (1.4 °C/W), AEC-Q101 qualification status, and TS-6P mechanical compatibility with PCB-mounting requirements.

Technical Context

The TS8P01G integrates four diodes in a single-phase full-wave bridge configuration, enabling direct AC-to-DC conversion without external interconnection. Its glass-passivated junction ensures stable reverse characteristics across temperature, with IR ≤10 µA at rated VRRM and TJ = 25°C.

Thermally optimized for conduction-cooled PCB mounting, it delivers 1.4 °C/W junction-to-case resistance and supports continuous operation up to TJ = 150°C. The device meets JESD201 Class 2 whisker resistance and UL 94V-0 flammability standards for molded compound.

Key Specifications

Pinout & Package

Package: TS-6P - Surface-mountable, 6-pin, single-phase bridge rectifier package with matte tin-plated leads compliant with J-STD-002 solderability and JESD201 Class 2 whisker testing. Weight: 7.15 g.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar bridge rectifier applications.

Compared with GBU8K and GBU8J, the TS8P01G offers superior thermal performance (1.4 vs. 2.0 °C/W), identical TS-6P footprint to GBU8J, and optional AEC-Q101 qualification-making it optimal for compact, thermally demanding, or automotive-adjacent power supplies.

Availability

TS8P01G is available at Aetrix Electronics and suitable for switching mode power supplies, LED lighting drivers, and USB-C wall adapters requiring stable component supply, consistent lead-time visibility, and long-term production continuity.

Supply support for TS8P01G includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Taiwan Semiconductor Corporation (TSC) is a vertically integrated analog and discrete semiconductor manufacturer headquartered in Hsinchu, Taiwan, serving industrial, computing, and consumer markets since 1979.

The TS8P series targets high-reliability AC/DC front-end rectification, emphasizing thermal efficiency, safety certification readiness, and mechanical robustness for automated SMT assembly in high-volume power electronics.

FAQ

What is the maximum junction temperature rating for TS8P01G?

The TS8P01G has a maximum junction temperature (TJ) rating of +150°C, allowing continuous operation in high-ambient environments such as enclosed LED drivers or industrial power modules. This rating is validated under specified thermal conditions and must be maintained via proper PCB copper area or heatsinking to ensure RθJC = 1.4 °C/W is achieved. Exceeding TJ = 150°C risks parametric shift and long-term reliability degradation in the TS8P01G.

Does TS8P01G meet automotive qualification standards?

The base TS8P01G is not AEC-Q101 qualified; however, the variant TS8P01GH is explicitly qualified per AEC-Q101 Rev D. This distinction is marked in the ordering code-the "H" suffix denotes automotive qualification. For automotive applications such as body control modules or infotainment power supplies, TS8P01GH-not TS8P01G-must be selected to satisfy stress-test and reliability requirements defined in the AEC standard.

What is the forward voltage drop of TS8P01G at full rated current?

The TS8P01G exhibits a maximum forward voltage drop (VF) of 1.1 V at IF = 8 A and TJ = 25°C, measured per diode under pulsed conditions (PW = 0.3 ms). This value directly impacts conduction loss and thermal design-e.g., at 8 A, total bridge dissipation is ~8.8 W (4 × 1.1 V × 2 A per diode path), requiring appropriate thermal management to maintain TJ ≤ 150°C in the TS8P01G.

Is TS8P01G RoHS and halogen-free compliant?

Yes, TS8P01G is fully RoHS compliant and halogen-free per IEC 61249-2-21. The molding compound contains no brominated flame retardants or chlorine-based additives, eliminating corrosive outgassing risks in sealed or high-humidity environments. This compliance is verified through material declarations and third-party testing, supporting sustainability requirements for consumer, medical, and industrial end equipment using the TS8P01G.

What packaging and reel options are available for TS8P01G?

TS8P01G is supplied in tube packaging-15 units per tube-with no tape-and-reel option specified in the official datasheet (Version M2203). The TS-6P package uses matte tin-plated leads compatible with J-STD-002 soldering processes. For automated SMT placement, tube-to-tape conversion may be required; Aetrix Electronics can support custom packaging solutions upon request for high-volume TS8P01G procurement.