Taiwan Semiconductor Corporation TS8P03GHD2G

Overview

TS8P03GHD2G from Taiwan Semiconductor is a 200V repetitive peak reverse voltage, 8A average forward current AEC-Q101-qualified standard bridge rectifier in TS-6P package, featuring glass-passivated junctions, <0.1μA typical reverse leakage at 25°C, and 200A peak surge capability - used in automotive-grade SMPS and lighting power supplies.

For engineers reviewing the TS8P03GHD2G datasheet, TS8P03GHD2G pinout, TS8P03GHD2G application, or TS8P03GHD2G equivalent, key selection criteria include VRRM=200V, IF=8A, IFSM=200A, TJ(max)=150°C, and AEC-Q101 qualification for under-hood automotive power conversion.

Technical Context

This quad-configuration bridge rectifier integrates four silicon diodes in a single TS-6P molded package with matte tin-plated leads. Its glass-passivated junction ensures stable reverse characteristics across -55°C to +150°C operating range and supports high-reliability automotive applications requiring UL 94V-0 flammability compliance and JESD201 Class 2 whisker resistance.

Thermal performance is defined by R_θJC = 1.4°C/W, enabling efficient heat transfer to heatsink-mounted PCBs. Electrical behavior includes VF ≤ 1.1V at IF = 8A/25°C and IR ≤ 500μA at TJ = 125°C, meeting stringent leakage and conduction loss requirements for compact, high-efficiency AC/DC front-ends.

Key Specifications

Pinout & Package

Package: TS-6P - 6-pin molded plastic case with matte tin-plated leads, UL 94V-0 rated, weight ≈7.15g, mounting torque ≤0.92 N·m.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar bridge rectifier applications.

Compared with GBU8K and GBU8D, TS8P03GHD2G uniquely combines 200V rating, AEC-Q101 qualification, and TS-6P compactness - making it optimal for space-limited automotive and industrial rectification where reliability and regulatory compliance are co-prioritized.

Availability

TS8P03GHD2G is available at Aetrix Electronics and suitable for automotive onboard chargers, LED streetlight power supplies, and industrial SMPS requiring stable component supply with AEC-Q101 assurance and long-term lifecycle support.

Supply support for TS8P03GHD2G includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Taiwan Semiconductor Corporation (TSC) is a vertically integrated analog and discrete semiconductor manufacturer headquartered in Hsinchu, Taiwan, serving global automotive, industrial, and consumer markets since 1979.

The TS8P series is designed specifically for high-reliability AC/DC bridge rectification in harsh-environment applications - emphasizing AEC-Q101 compliance, thermal robustness, and UL safety recognition for automotive and industrial power conversion.

FAQ

What is the peak repetitive reverse voltage rating for TS8P03GHD2G?

The TS8P03GHD2G has a repetitive peak reverse voltage (VRRM) rating of 200 V. This value is confirmed in the Absolute Maximum Ratings table of the official Taiwan Semiconductor datasheet (Version M2203), where TS8P03G is explicitly assigned VRRM = 200 V. It defines the maximum AC voltage the device can block during normal operation without risk of avalanche breakdown.

Is TS8P03GHD2G qualified to AEC-Q101 standards?

Yes, TS8P03GHD2G is AEC-Q101 qualified. The "H" suffix in the ordering code indicates AEC-Q101 qualification, and this is explicitly stated in the FEATURES section and ORDERING INFORMATION notes of the Taiwan Semiconductor datasheet. The qualification covers temperature cycling, high-temperature reverse bias (HTRB), and other stress tests required for automotive under-hood applications.

What does the "D2G" suffix mean in TS8P03GHD2G?

The "D2G" suffix in TS8P03GHD2G denotes packaging and environmental compliance: "D" indicates tape-and-reel packaging (though TS-6P is typically supplied in tubes per datasheet), "2" refers to date code year (2022), and "G" confirms green (halogen-free) molding compound per IEC 61249-2-21. This aligns with TSC's standard marking convention documented in the PACKAGE OUTLINE DIMENSIONS section.

What is the thermal resistance from junction to case for TS8P03GHD2G?

The junction-to-case thermal resistance (R_θJC) of TS8P03GHD2G is 1.4°C/W, as specified in the THERMAL PERFORMANCE table of the official datasheet. This value applies to the TS-6P package and is measured under standard test conditions with proper heatsink contact - critical for calculating allowable power dissipation in thermally constrained layouts.

Can TS8P03GHD2G replace TS8P03G in existing designs?

Yes, TS8P03GHD2G is a direct functional and mechanical replacement for TS8P03G, with identical electrical specifications (VRRM = 200 V, IF = 8 A, etc.) and TS-6P package. The "H" and "D2G" suffixes add AEC-Q101 qualification and halogen-free compliance but do not alter pinout, footprint, or thermal profile - enabling drop-in use where enhanced reliability or environmental compliance is required.