Taiwan Semiconductor Corporation TS8P04G

Overview

TS8P04G from Taiwan Semiconductor is a 8A, 400V repetitive peak reverse voltage (V_RRM) quad-standard bridge rectifier in TS-6P package, featuring glass passivated junctions, <0.1μA typical reverse leakage at 25°C, and 200A peak surge current capability; used in AC/DC front-end stages of industrial SMPS and LED drivers.

For engineers reviewing the TS8P04G datasheet, TS8P04G pinout, TS8P04G application, or TS8P04G equivalent, key selection criteria include V_RRM = 400V, I_F = 8A continuous, thermal resistance R_θJC = 1.4°C/W, AEC-Q101 qualification availability (TS8P04GH), and TS-6P mechanical compatibility with PCB-mount high-power rectification.

Technical Context

The TS8P04G integrates four silicon diodes in a single-phase full-wave bridge configuration with common-cathode/common-anode topology, enabling direct AC-to-DC conversion without external interconnection. Its glass-passivated junction ensures stable reverse characteristics across -55°C to +150°C operating range and low IR drift at elevated temperatures.

Designed for high-reliability power conversion, it supports 8.3ms half-sine surge events up to 200A (I²t = 166 A²s) and maintains <1.1V forward voltage at 8A/25°C - critical for minimizing conduction loss in compact, thermally constrained adapters and lighting ballasts.

Key Specifications

Pinout & Package

Package: TS-6P - molded plastic case with matte tin-plated leads, UL 94V-0 rated, 7.15g weight, designed for through-hole PCB mounting and high-power dissipation.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar bridge rectifier applications.

Compared with GBU8K and KBP304, the TS8P04G uniquely balances 400V V_RRM, 8A I_F, and 1.4°C/W thermal resistance in the compact TS-6P package - making it optimal for high-density, thermally demanding 400V bridge applications where size and efficiency are prioritized.

Availability

TS8P04G is available at Aetrix Electronics and suitable for industrial SMPS, LED driver power stages, and consumer adapter secondary-side rectification requiring stable component supply and long-lifecycle support.

Supply support for TS8P04G includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Taiwan Semiconductor Corporation (TSC) is a vertically integrated analog and power discrete manufacturer headquartered in Hsinchu, Taiwan, serving global industrial, computing, and automotive markets since 1979.

The TS8P series is part of TSC's high-reliability standard bridge rectifier product line, engineered specifically for high-current, high-temperature AC/DC conversion in mission-critical power supplies and lighting systems.

FAQ

What is the maximum junction temperature rating for TS8P04G?

The TS8P04G has a maximum junction temperature (T_J) of +150°C and a minimum storage temperature of -55°C. This wide operating range supports use in high-ambient environments such as enclosed LED drivers and industrial power supplies. The device's glass passivated junction contributes to thermal stability, and its R_θJC of 1.4°C/W enables predictable thermal modeling when mounted on heatsinks or metal-core PCBs. Always verify actual T_J using measured case temperature and power dissipation in the final design.

Does TS8P04G have AEC-Q101 qualification?

The TS8P04G itself is not AEC-Q101 qualified; however, the pin-compatible TS8P04GH variant is fully AEC-Q101 qualified and shares identical electrical specifications and TS-6P packaging. TS8P04GH undergoes automotive-grade stress testing including temperature cycling, high-temperature reverse bias (HTRB), and electrostatic discharge (ESD). For automotive applications requiring qualification, TS8P04GH is the recommended drop-in replacement - no layout or schematic changes are needed.

What is the forward voltage drop of TS8P04G at full rated current?

At I_F = 8A and T_J = 25°C, the TS8P04G exhibits a maximum forward voltage drop (V_F) of 1.1V per diode - meaning the total bridge drop is approximately 2.2V under worst-case conduction. This value is confirmed in the Electrical Specifications table under "Forward voltage per diode" with pulse test conditions (PW = 0.3ms). At elevated temperatures or higher currents, V_F increases slightly but remains within design margins for efficient 400V-class rectification.

How does the TS-6P package of TS8P04G compare to KBP or GBU packages?

The TS-6P package of TS8P04G is dimensionally smaller than KBP and GBU packages, offering higher power density. It features a 7.15g mass, UL 94V-0 molding compound, and matte tin-plated leads compliant with J-STD-002 solderability. With R_θJC = 1.4°C/W, TS-6P provides superior thermal performance versus KBP (≈2.5°C/W) and GBU (≈2.0°C/W), enabling more compact thermal solutions. Mounting torque is specified at ≤0.92 N·m to prevent lead damage during assembly.

What is the reverse leakage current specification for TS8P04G at elevated temperature?

At T_J = 125°C and rated reverse voltage (V_R = 400V), the TS8P04G specifies a maximum reverse leakage current (I_R) of 500 μA per diode - measured under 30ms pulse conditions. This is significantly lower than generic bridge rectifiers and supports low-standby-power designs. At 25°C, typical I_R is <0.1 μA, confirming excellent junction integrity from glass passivation. These values are validated per the Electrical Specifications table and ensure stable operation in high-temperature lighting and industrial environments.