Taiwan Semiconductor Corporation TS8P05G

Overview

TS8P05G from Taiwan Semiconductor is a quad-configuration, glass-passivated standard bridge rectifier rated for 8 A average forward current and 600 V repetitive peak reverse voltage (V_RRM), with 200 A non-repetitive surge capability and 1.4 °C/W junction-to-case thermal resistance - used in AC/DC front-end stages of industrial SMPS and lighting ballasts.

For engineers reviewing the TS8P05G datasheet, TS8P05G pinout, TS8P05G application, or TS8P05G equivalent, key selection criteria include verified V_RRM = 600 V, I_F = 8 A, I_FSM = 200 A, R_θJC = 1.4 °C/W, and TS-6P package compatibility with high-density PCB layouts requiring UL 94V-0 molding and J-STD-002 solderability.

Technical Context

The TS8P05G integrates four silicon diodes in a single-phase full-wave bridge configuration with glass-passivated junctions, enabling stable operation up to 150 °C junction temperature and low leakage (I_R ≤ 10 µA at 25 °C, ≤ 500 µA at 125 °C). Its TS-6P package features matte tin-plated leads and meets JESD201 Class 2 whisker resistance.

Designed for high-surge environments, it delivers 166 A²s fusing rating under 8.3 ms half-sine conditions and supports continuous conduction mode in offline switchers where thermal management relies on its 1.4 °C/W R_θJC and 7.15 g mass for heat spreading.

Key Specifications

Pinout & Package

Package: TS-6P - molded plastic case with 6-pin inline configuration (4 active terminals + 2 mounting lugs), UL 94V-0 rated, 7.15 g weight, matte tin-plated leads compliant with J-STD-002 solderability and JESD201 Class 2 whisker testing.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar bridge rectifier applications.

Compared with GBU8K and GBPC806, TS8P05G provides optimal balance of 600 V rating, 1.4 °C/W thermal resistance, and TS-6P compactness - making it preferred for space-constrained, thermally managed industrial and lighting designs where exact V_RRM match and low-loss operation are prioritized.

Availability

TS8P05G is available at Aetrix Electronics and suitable for industrial SMPS, LED drivers, AC adapters, and appliance motor control systems requiring stable component supply, consistent parametric performance, and long-term lifecycle support.

Supply support for TS8P05G includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Taiwan Semiconductor Corporation (TSC) is a vertically integrated analog and discrete semiconductor manufacturer headquartered in Hsinchu, Taiwan, specializing in power devices, rectifiers, TVS diodes, and MOSFETs for industrial and automotive markets.

The TS8P series was developed to deliver high-reliability, AEC-Q101-capable bridge rectifiers in compact TS-6P packages for cost-sensitive yet thermally demanding AC/DC conversion in lighting, power adapters, and motor drives.

FAQ

What is the maximum junction temperature rating for TS8P05G?

The TS8P05G has a maximum junction temperature (T_JMAX) of +150 °C, verified per absolute maximum ratings table. This allows operation in high-ambient environments such as enclosed LED luminaires or industrial enclosures. Derating curves confirm usable current down to 0 A at 150 °C case temperature. Thermal design must respect the 1.4 °C/W R_θJC to avoid exceeding this limit during continuous 8 A conduction.

Does TS8P05G meet automotive qualification standards?

The base TS8P05G is not AEC-Q101 qualified; however, the variant TS8P05GH is explicitly certified to AEC-Q101. Both share identical electrical and thermal specifications, but only TS8P05GH undergoes stress testing for temperature cycling, humidity bias, and mechanical shock per automotive requirements. For automotive body electronics or infotainment power supplies, TS8P05GH must be specified.

What is the forward voltage drop of TS8P05G at full rated current?

At I_F = 8 A and T_J = 25 °C, the TS8P05G exhibits a maximum forward voltage drop (V_F) of 1.1 V per diode - meaning 2.2 V total across the bridge. This value is measured under pulse conditions (PW = 0.3 ms) and defines worst-case conduction loss (≈17.6 W at 8 A), directly impacting thermal design and efficiency calculations in the TS8P05G application circuit.

How does the TS-6P package of TS8P05G compare to GBPC-4 in board space usage?

The TS-6P package used by TS8P05G measures 20.0 × 15.5 × 4.5 mm and occupies ~310 mm² footprint, while the GBPC-4 package is larger at 22.5 × 18.5 × 4.5 mm (~416 mm²). TS8P05G's TS-6P also features inline pin arrangement optimized for automated placement and reflow, whereas GBPC-4 uses gull-wing leads. Board space reduction with TS8P05G enables denser power stage layouts without sacrificing thermal performance.

What is the reverse leakage current specification for TS8P05G at elevated temperature?

Per electrical specifications, TS8P05G exhibits a maximum reverse leakage current (I_R) of 500 µA per diode at T_J = 125 °C and rated V_R. At 25 °C, I_R is ≤10 µA. This low leakage supports low standby power in energy-efficient designs and maintains stability in high-temperature LED driver or industrial control applications where the TS8P05G operates near thermal limits.