Taiwan Semiconductor Corporation TS8P06G

Overview

TS8P06G from Taiwan Semiconductor is a quad-configuration, glass-passivated standard bridge rectifier rated for 8 A average forward current and 800 V repetitive peak reverse voltage (V_RRM), with 200 A non-repetitive surge capability and 1.4 °C/W junction-to-case thermal resistance - used in high-efficiency AC/DC front-end stages of industrial SMPS and lighting ballasts.

For engineers reviewing the TS8P06G datasheet, TS8P06G pinout, TS8P06G application, or TS8P06G equivalent, key selection criteria include verified V_RRM = 800 V, I_F = 8 A, I_FSM = 200 A, R_θJC = 1.4 °C/W, and TS-6P package compatibility with PCB-mount thermal management in compact power supplies.

Technical Context

The TS8P06G integrates four diodes in a single-phase full-wave bridge configuration with glass-passivated junctions to ensure stable leakage performance (<10 µA at 25°C) and robustness against humidity and contamination. Its TS-6P molded package supports high-density mounting and meets UL 94V-0 flammability and JESD201 Class 2 whisker resistance standards.

Thermally, it delivers 1.4 °C/W junction-to-case resistance and operates across –55°C to +150°C junction temperature range. Electrical behavior is characterized by forward voltage ≤1.1 V at 8 A/25°C and reverse current ≤500 µA at 125°C under rated V_R, enabling reliable operation in thermally constrained environments.

Key Specifications

Pinout & Package

Package: TS-6P - molded plastic case with matte tin-plated leads, UL 94V-0 rated, 7.15 g weight, designed for through-hole PCB mounting and manual or wave soldering per J-STD-002.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar bridge rectifier applications.

Compared with VS-8EWH08-M3 and GBPC808, the TS8P06G offers superior thermal performance (1.4 vs. 2.5/1.8 °C/W), AEC-Q101 qualification path, and halogen-free compliance - making it preferred for space-constrained, thermally demanding, or environmentally regulated industrial designs.

Availability

TS8P06G is available at Aetrix Electronics and suitable for industrial SMPS, LED driver power stages, AC-DC adapters, and motor control auxiliary supplies requiring stable component supply, long-lifecycle assurance, and traceable green-material compliance.

Supply support for TS8P06G includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Taiwan Semiconductor Corporation (TSC) is a vertically integrated analog and discrete semiconductor manufacturer headquartered in Hsinchu, Taiwan, specializing in power rectifiers, TVS diodes, MOSFETs, and bipolar transistors since 1979.

The TS8P series was developed to deliver high-surge, high-voltage bridge rectifiers in compact TS-6P packages for cost-sensitive yet thermally demanding industrial and lighting power applications.

FAQ

What is the maximum repetitive peak reverse voltage (V_RRM) for TS8P06G?

The TS8P06G has a V_RRM rating of 800 V, confirmed in the Absolute Maximum Ratings table on page 2 of the M2203 datasheet. This value defines the highest instantaneous reverse voltage the device can block repeatedly without breakdown. It corresponds to an RMS input voltage limit of approximately 560 V, supporting universal-line operation in industrial and commercial AC/DC systems. The TS8P06G is part of the TS8P01G–TS8P07G family where "06" explicitly denotes the 800 V grade.

Does TS8P06G meet automotive reliability standards?

The base TS8P06G is not AEC-Q101 qualified, but the pin-compatible variant TS8P06GH is explicitly listed in the Ordering Information as AEC-Q101 qualified. The datasheet confirms AEC-Q101 availability for the TS8P01G–TS8P07G family, and TS8P06GH undergoes stress testing per AEC-Q101 Rev D including HTGB, HTRB, and temperature cycling. For automotive-adjacent applications like EV charging auxiliary supplies, TS8P06GH is the recommended version.

What is the forward voltage drop (V_F) of TS8P06G at full load?

At I_F = 8 A and T_J = 25°C, the TS8P06G exhibits a maximum forward voltage drop of 1.1 V per diode, as specified in the Electrical Specifications table. This value is measured under pulse conditions (PW = 0.3 ms) and represents worst-case conduction loss. At elevated temperatures or continuous DC operation, V_F decreases slightly due to negative temperature coefficient, but design margins should be based on the 1.1 V max specification.

Is TS8P06G compatible with lead-free reflow or wave soldering processes?

Yes, TS8P06G features matte tin-plated leads compliant with J-STD-002 for solderability and is rated for lead-free assembly. The TS-6P molding compound meets UL 94V-0, and the device supports peak reflow temperatures up to 260°C per JEDEC J-STD-020. Mounting torque must not exceed 0.92 N·m during mechanical fastening, and the package is qualified for JESD201 Class 2 whisker resistance - ensuring long-term interconnect integrity in automated manufacturing.

What thermal resistance does TS8P06G offer, and how is it measured?

The TS8P06G has a junction-to-case thermal resistance (R_θJC) of 1.4 °C/W, measured from the silicon die to the outer surface of the molded case under standardized test conditions (per JESD51-1). This value enables accurate thermal modeling when the device is mounted to an external heatsink or copper pour. It is significantly lower than alternatives in similar packages (e.g., GBPC808: 1.8 °C/W), allowing higher power density or reduced heatsink size in thermally constrained layouts.