Taiwan Semiconductor Corporation TS8P06GH

Overview

TS8P06GH from Taiwan Semiconductor is an AEC-Q101-qualified, glass-passivated quad standard bridge rectifier rated for 8 A average forward current and 800 V repetitive peak reverse voltage (V_RRM), with 200 A non-repetitive surge capability and 1.4 °C/W junction-to-case thermal resistance - used in automotive-grade AC/DC front-end stages of on-board chargers and lighting power supplies.

For engineers reviewing the TS8P06GH datasheet, TS8P06GH pinout, TS8P06GH application, or TS8P06GH equivalent, key selection considerations include its TS-6P package compatibility with high-density PCB layouts, low leakage (<10 µA @ 25°C), and validated performance under 150°C junction temperature in harsh environments.

Technical Context

This device integrates four silicon diodes in a single-phase full-wave bridge configuration within a molded TS-6P thermally optimized package. Its glass-passivated junction ensures stable reverse characteristics across -55°C to +150°C operating range, while UL 94V-0 molding compound and matte tin-plated leads support reliable reflow soldering per J-STD-002.

The TS8P06GH delivers 8 A continuous forward current with forward voltage drop ≤1.1 V at 8 A/25°C and reverse leakage ≤500 µA at 125°C - enabling efficient thermal management in compact SMPS designs where I²t rating (166 A²s) supports robust inrush handling without external fusing.

Key Specifications

Pinout & Package

Package: TS-6P - thermally enhanced molded plastic case with 6-pin inline lead frame, UL 94V-0 rated, matte tin-plated leads, 7.15 g weight, polarity marked on top surface.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar bridge rectifier applications.

Compared with GBU8K and GBJ808, the TS8P06GH provides superior thermal performance (1.4 °C/W), lower reverse leakage, and formal AEC-Q101 certification - making it the preferred choice for automotive and high-reliability industrial rectification where long-term parametric stability is critical.

Availability

TS8P06GH is available at Aetrix Electronics and suitable for automotive on-board chargers, LED streetlight power supplies, and industrial switching mode power supplies requiring stable component supply with full traceability and long-lifecycle support.

Supply support for TS8P06GH includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Taiwan Semiconductor Corporation (TSC) is a vertically integrated analog and discrete semiconductor manufacturer headquartered in Hsinchu, Taiwan, specializing in high-reliability rectifiers, TVS diodes, and MOSFETs for automotive and industrial markets.

The TS8P series was developed specifically to meet stringent AEC-Q101 requirements for automotive power conversion, combining glass passivation, UL recognition, and thermally optimized TS-6P packaging for demanding front-end rectification tasks.

FAQ

What is the maximum junction temperature rating for TS8P06GH?

The TS8P06GH has a maximum junction temperature (T_J) of +150°C, verified per AEC-Q101 stress testing protocols. This rating allows operation in under-hood automotive environments and high-ambient industrial enclosures. The device maintains specified electrical parameters up to this limit when thermal design respects the 1.4 °C/W junction-to-case resistance. Derating curves in the TS8P06GH datasheet confirm usable current capacity down to 0 A at 150°C case temperature.

Does TS8P06GH require heatsinking in typical 8 A applications?

Yes, TS8P06GH requires heatsinking to sustain 8 A continuous current at elevated ambient temperatures. With R_θJC = 1.4 °C/W and typical V_F ≈ 1.1 V, power dissipation reaches ~8.8 W at full load - resulting in >12°C rise above heatsink temperature. For reliable operation at 70°C ambient, a heatsink maintaining <60°C case temperature is recommended. The exposed thermal slug in the TS-6P package must be mounted to a heatsink using thermally conductive adhesive or screw clamp.

Is TS8P06GH pin-compatible with other TS8PxG variants?

Yes, all TS8PxG and TS8PxGH devices share identical TS-6P package dimensions, pinout, and terminal assignments - only V_RRM and marking code differ across the family. TS8P06GH uses the same AC1/AC2/+/- pin configuration as TS8P01G through TS8P07G, enabling board-level voltage scalability without layout changes. However, thermal and surge margins must be re-evaluated when substituting lower-voltage variants into 800 V designs.

What does the 'H' suffix in TS8P06GH signify?

The 'H' suffix in TS8P06GH explicitly denotes AEC-Q101 qualification - confirming that the device has passed the full suite of automotive reliability tests including HTOL, TC, UHAST, and ESD per JESD22 standards. This distinguishes it from the non-H variant TS8P06G, which shares identical electrical specs but lacks automotive stress validation and is intended for commercial/industrial use only.

How does TS8P06GH compare to standard GBU-series bridge rectifiers?

TS8P06GH offers lower thermal resistance (1.4 °C/W vs. ~2.0 °C/W for GBU8K), tighter reverse leakage (<10 µA vs. ~50 µA), and formal AEC-Q101 certification - features absent in most GBU-family parts. While both use 6-pin packages, TS-6P's optimized leadframe and molding compound deliver superior power density and automotive-grade reliability. Electrical ratings match, but TS8P06GH is engineered for mission-critical deployment where long-term parametric stability is mandatory.