Taiwan Semiconductor Corporation TSD2G

Overview

TSD2G from Taiwan Semiconductor is a 2A, 400V glass-passivated standard rectifier diode with high ESD immunity (≥8 kV HBM, ≥25 kV IEC 61000-4-2 air), low forward voltage (0.90 V @ 2A, 25°C), and DO-214AA (SMB) surface-mount package - used in SMPS input rectification stages where surge robustness and automated assembly are required.

For engineers reviewing the TSD2G datasheet, TSD2G pinout, TSD2G application, or TSD2G equivalent, key selection factors include its 50 A surge rating, 175°C max junction temperature, J-STD-020 Level 1 moisture sensitivity, and verified compliance with AEC-Q101-001 Class H3B and ISO 10605 Level L4 ESD standards.

Technical Context

The TSD2G is a single-die, unidirectional silicon rectifier optimized for high-reliability AC/DC conversion. Its glass-passivated junction ensures stable reverse leakage (<1 µA @ 25°C, <50 µA @ 125°C) and long-term stability under thermal cycling.

Thermal performance is defined for PCB mounting on a 10 mm × 10 mm copper pad: R_θJL = 26°C/W and R_θJA = 73°C/W. Junction capacitance is 20 pF at 1 MHz and 4 V reverse bias, supporting moderate-frequency switching applications up to ~100 kHz.

Key Specifications

Pinout & Package

Package: DO-214AA (SMB), surface-mount, cathode indicated by band. Matte tin-plated leads, RoHS and halogen-free compliant.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar rectifier applications.

Compared with STTH2R04 and SB240, the TSD2G uniquely combines 400 V blocking, 2 A current capability, and certified high-level ESD immunity - making it the only drop-in option for automotive-grade or industrial-grade AC input rectification requiring both voltage margin and EMC robustness.

Availability

TSD2G is available at Aetrix Electronics and suitable for switching mode power supplies, LED lighting drivers, and USB-C adapter designs requiring stable component supply, consistent parametric performance, and full traceability from wafer to shipment.

Supply support for TSD2G includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Taiwan Semiconductor Corporation (TSC) is a vertically integrated analog and discrete semiconductor manufacturer headquartered in Hsinchu, Taiwan, serving global power, automotive, and industrial markets since 1979.

The TSD2G belongs to TSC's high-reliability rectifier product line, engineered specifically for AC/DC power conversion systems demanding extended thermal endurance, ESD resilience, and automated assembly compatibility.

FAQ

What is the maximum junction temperature rating for the TSD2G?

The TSD2G has a maximum junction temperature (T_J) of +175°C, validated per JEDEC JESD22-A103. This allows continuous operation in high-ambient environments such as enclosed LED drivers or industrial control modules without thermal shutdown. The TSD2G maintains stable electrical parameters across its full –55°C to +175°C junction range, and its thermal resistance values (R_θJL = 26°C/W, R_θJA = 73°C/W) are measured on a standard 10 mm × 10 mm Cu pad test board.

Does the TSD2G meet automotive qualification standards?

Yes, the TSD2G is qualified per AEC-Q101-001 Class H3B for human-body-model ESD (≥8 kV contact), and also meets ISO 10605 Level L4 (≥25 kV air discharge). While not fully AEC-Q101 stress-qualified across all tests, its ESD performance is certified for automotive subsystems requiring robust interface immunity - such as infotainment power supplies or body-control module auxiliary rails. Full AEC-Q101 qualification status should be confirmed via TSC's official automotive product documentation.

What is the forward voltage drop of the TSD2G at 2A and 125°C?

The TSD2G exhibits a typical forward voltage (V_F) of 0.75 V and a maximum of 0.85 V at 2A and 125°C, per its Electrical Specifications table. This low V_F at elevated temperature reduces conduction losses and improves thermal stability in high-power-density designs like compact wall adapters. The value is measured under pulsed conditions (PW = 0.3 ms) to avoid self-heating artifacts during test.

Is the TSD2G compatible with lead-free reflow soldering processes?

Yes, the TSD2G uses matte tin-plated leads compliant with J-STD-002 and rated for lead-free reflow profiles (peak temperature ≤ 260°C). Its J-STD-020 moisture sensitivity level is Level 1, meaning it can be stored indefinitely at ≤30°C/60% RH and placed directly into reflow without baking. The UL 94V-0 molding compound remains dimensionally stable and non-delaminating under standard Pb-free thermal cycles.

What does the marking code "TSD2G" indicate on the device body?

The marking code "TSD2G" on the TSD2G device corresponds directly to the orderable part number and confirms the DO-214AA (SMB) package variant. The "G" suffix denotes green (halogen-free) compound per IEC 61249-2-21. Date code (YW), factory code (F), and other identifiers follow this base marking per TSC's standard labeling convention shown in the Package Outline Dimensions sheet.