Taiwan Semiconductor Corporation TSD3G

Overview

TSD3G from Taiwan Semiconductor is a 3A, 400V glass-passivated single-die standard rectifier diode with 8–30kV ESD immunity per IEC 61000-4-2 and ISO 10605, low forward voltage (0.89V @ 3A, 25°C), and DO-214AB (SMC) package - used in SMPS secondary-side rectification and lighting converters.

For engineers reviewing the TSD3G datasheet, TSD3G pinout, TSD3G application, or TSD3G equivalent, key selection criteria include peak reverse voltage (400V), surge current rating (100A), junction-to-lead thermal resistance (21°C/W), ESD class compliance (H3B/AEC-Q101-001), and moisture sensitivity level (MSL 1).

Technical Context

The TSD3G is a single-die, unidirectional silicon rectifier optimized for high-reliability switching power supplies. Its glass-passivated junction ensures stable leakage performance up to 125°C, while its 100A IFSM rating supports transient surge handling in AC/DC adapters and LED drivers.

Thermal design is enabled by low R_θJL (21°C/W) on a 16mm × 16mm Cu pad PCB, and its MSL 1 rating eliminates bake requirements prior to reflow. The cathode-band polarity marking and matte tin-plated leads comply with J-STD-002 solderability and JESD 201 Class 2 whisker resistance.

Key Specifications

Pinout & Package

Package: DO-214AB (SMC), surface-mount, molded plastic case meeting UL 94V-0; cathode indicated by band; matte tin-plated leads; weight ≈ 0.210 g.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar standard rectifier applications.

Compared with STTH3L04 and ES1J, the TSD3G uniquely combines 400V/3A ratings with certified 25kV air-gap ESD immunity and MSL 1 handling - making it optimal for cost-sensitive, high-volume consumer lighting and adapter designs requiring zero added protection circuitry.

Availability

TSD3G is available at Aetrix Electronics and suitable for switching mode power supplies, LED lighting drivers, and AC/DC adapters requiring stable component supply, full traceability, and long-term production continuity.

Supply support for TSD3G includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Taiwan Semiconductor Corporation (TSC) is a vertically integrated analog and discrete semiconductor manufacturer headquartered in Hsinchu, Taiwan, specializing in power rectifiers, TVS diodes, MOSFETs, and ESD protection devices.

The TSD series targets high-reliability, high-volume power conversion applications - designed specifically for SMPS, lighting, and industrial power supplies where ESD robustness, thermal performance, and regulatory compliance are mandatory.

FAQ

What is the maximum junction temperature rating for the TSD3G?

The TSD3G has a maximum junction temperature (T_J) rating of +175°C and a minimum of −55°C. This wide operating range allows reliable use in industrial and automotive-adjacent environments. The TSD3G's thermal resistance values - R_θJL = 21°C/W and R_θJA = 59°C/W - are measured on a 16mm × 16mm Cu pad PCB, enabling accurate thermal modeling in real-world layouts. The TSD3G maintains stable electrical parameters across this full range.

Does the TSD3G meet automotive qualification standards?

The TSD3G is qualified to AEC-Q101-001 Class H3B for human-body-model ESD (≥8kV contact), but it is not fully AEC-Q101 qualified as a complete device. It lacks stress test data for HTGB, AC-H3TRB, or temperature cycling. Therefore, the TSD3G is recommended for automotive-adjacent applications (e.g., cabin lighting, infotainment power supplies) but not for under-hood safety-critical systems. Always verify system-level ESD and thermal validation when using TSD3G in automotive designs.

What is the forward voltage specification of the TSD3G at elevated temperature?

At 3.0A and 125°C junction temperature, the TSD3G exhibits a typical forward voltage (V_F) of 0.76V, with a maximum of 1.00V. This reduction from room-temperature V_F (0.89V typ) reflects the negative temperature coefficient of silicon PN junctions. The TSD3G's low V_F drift supports stable efficiency in thermally constrained LED drivers and adapters operating continuously at elevated ambient temperatures.

Is the TSD3G compatible with lead-free reflow processes?

Yes, the TSD3G uses matte tin-plated leads that are fully compatible with lead-free reflow profiles per J-STD-002. Its MSL 1 rating means it can be stored indefinitely at ≤30°C/60% RH without baking. The device's UL 94V-0 molding compound and JESD 201 Class 2 whisker resistance further ensure reliability through multiple reflow cycles and long-term interconnect integrity in high-volume SMT lines.

How does the ESD performance of the TSD3G compare to generic rectifiers?

The TSD3G delivers industry-leading ESD immunity: ≥8kV contact (IEC 61000-4-2), ≥15kV air (IEC 61000-4-2), and ≥25kV air (ISO 10605). Most standard rectifiers lack published ESD specs or achieve only 2–4kV. This enables the TSD3G to replace discrete ESD protection in lighting and adapter outputs - reducing BOM count and board space. The TSD3G's ESD robustness is intrinsic to its glass-passivated structure and process-controlled junction design.