Taiwan Semiconductor Corporation TSDGLW

Overview

TSDGLW from Taiwan Semiconductor is a 1 A, 400 V repetitive peak reverse voltage surface-mount Schottky rectifier in SOD-123W package, featuring 8–25 kV ESD immunity per IEC 61000-4-2 and ISO 10605, 1.0 A forward current rating, and 40 A surge capability - used in DC-DC converter output stages for high-reliability industrial power supplies.

For engineers reviewing the TSDGLW datasheet, TSDGLW pinout, TSDGLW application, or TSDGLW equivalent, key selection criteria include its 0.90 V max forward voltage at 1.0 A/25°C, -55°C to +175°C junction temperature range, JESD201 Class 2 whisker resistance, moisture sensitivity level 1, and UL 94V-0 molding compound compliance.

Technical Context

The TSDGLW is a single-die, glass-passivated silicon planar junction rectifier optimized for high-surge and high-ESD environments. Its construction delivers 40 A non-repetitive peak forward surge current (8.3 ms half-sine) and maintains ≤1 µA reverse leakage at 25°C under rated 400 V reverse voltage.

Thermal performance is characterized with R_θJL = 25°C/W and R_θJA = 84°C/W on a 5 mm × 5 mm Cu pad PCB. The device exhibits 15 pF junction capacitance at 1 MHz / 4.0 V reverse bias, supporting stable switching behavior in mid-frequency DC-DC topologies.

Key Specifications

Pinout & Package

Package: SOD-123W - surface-mount, molded plastic case with matte tin-plated leads, polarity indicated by cathode band, UL 94V-0 rated, weight ≈ 0.019 g.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar rectifier applications.

Compared with STPS1H40S and SS14-HF, the TSDGLW uniquely combines certified 25 kV air-discharge ESD immunity, SOD-123W's enhanced thermal pad area, and JESD201 Class 2 whisker resistance - making it optimal for high-integrity, unshielded, or thermally demanding rectifier roles.

Availability

TSDGLW is available at Aetrix Electronics and suitable for DC-DC converters, AC-DC adapters, and LED driver power stages requiring stable component supply, long-lifecycle assurance, and consistent ESD-hardened performance.

Supply support for TSDGLW includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Taiwan Semiconductor Corporation (TSC) is a vertically integrated analog and discrete semiconductor manufacturer headquartered in Hsinchu, Taiwan, serving industrial, computing, and consumer markets since 1979.

The TSDGLW belongs to TSC's high-reliability rectifier product line, engineered specifically for ESD-critical, thermally constrained, and safety-certified power conversion applications where field failure risk must be minimized.

FAQ

What is the maximum junction temperature rating for the TSDGLW?

The TSDGLW has a maximum junction temperature (T_JMAX) of +175°C and a minimum of -55°C. This wide operating range allows the TSDGLW to function reliably in high-temperature environments such as enclosed LED drivers or under-hood automotive auxiliary supplies without thermal derating. The TSDGLW's glass passivation and SOD-123W package contribute to this extended thermal capability.

Does the TSDGLW have a certified ESD rating, and what standards does it meet?

Yes, the TSDGLW is certified to ≥25 kV air-discharge per ISO 10605 Level L4 and ≥15 kV contact discharge per IEC 61000-4-2. It also meets AEC-Q101-001 H3B class (≥8 kV HBM). These ratings are measured and documented in the official TSC datasheet for TSDGLW, enabling direct use in ESD-prone applications like open-frame adapters without added protection circuitry.

What is the forward voltage drop of the TSDGLW at full rated current?

The TSDGLW exhibits a maximum forward voltage (V_F) of 1.00 V at I_F = 1.0 A and T_J = 25°C, with typical value of 0.90 V. At elevated junction temperature (125°C), V_F remains ≤1.00 V. This low, stable V_F directly reduces conduction losses in the TSDGLW, improving efficiency in 1 A DC-DC and adapter designs.

Is the TSDGLW compatible with lead-free reflow soldering processes?

Yes, the TSDGLW features matte tin-plated leads compliant with J-STD-002 for solderability and qualified for lead-free reflow profiles. Its moisture sensitivity level is rated at Level 1 per J-STD-020, meaning it can be stored indefinitely before assembly and processed without pre-baking - simplifying manufacturing for the TSDGLW in high-volume SMT lines.

What package type does the TSDGLW use, and how does it differ from standard SOD-123?

The TSDGLW uses the SOD-123W package - a widened-body variant of SOD-123 with larger copper paddle area for improved thermal dissipation. Compared to standard SOD-123, the SOD-123W offers lower R_θJA (84°C/W vs. typical >100°C/W) and enhanced mechanical stability during automated placement. This makes the TSDGLW especially suitable for thermally demanding applications where the standard SOD-123 would require derating.