Taiwan Semiconductor Corporation TSF20H60C
- Part No.:
- TSF20H60C
- Manufacturer:
- Taiwan Semiconductor Corporation
- Category:
- Diode Arrays
- Package:
- TO-220-3 Full Pack, Isolated Tab
- Datasheet:
-
TSF20H60C.pdf
- Description:
- DIODE ARR SCHOT 60V 10A ITO220AB
- Quantity:
- Payment:

- Shipping:

Inventory:8,348
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Product details
Overview
TSF20H60C from Taiwan Semiconductor is a dual common-cathode trench Schottky rectifier rated for 60 V reverse voltage, 20 A total forward current (10 A per diode), and 200 A surge capability at 8.3 ms; it delivers low forward voltage (0.56 V typ. @ 10 A, 25°C) and operates up to 150°C junction temperature in SMPS secondary-side rectification.
For engineers reviewing the TSF20H60C datasheet, TSF20H60C pinout, TSF20H60C application, or TSF20H60C equivalent, key selection factors include thermal resistance (RθJC = 3.4 °C/W per diode), high-temperature reverse leakage (29 mA @ 125°C), dual-die configuration in ITO-220AB, and RoHS/halogen-free compliance for industrial power designs.
Technical Context
The TSF20H60C integrates two independent Schottky die in a single ITO-220AB package with shared cathode terminal, enabling synchronous or interleaved rectification topologies. Its trench-based structure ensures stable VF across temperature and low RθJC for efficient heat transfer to heatsinks.
Designed for high-frequency switching applications, it exhibits 754 pF junction capacitance at 4 V reverse bias and supports pulse surge currents up to 600 A (1 ms), making it suitable for transient-heavy DC/DC outputs and adapter secondary rails where low conduction loss and fast recovery are critical.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VRRM | 60 V - Maximum reverse blocking voltage per diode; defines safe operating limit in 48 V bus or 36 V adapter output stages. |
| IF (per diode) | 10 A - Continuous forward current rating per die; enables 20 A total output with parallel-path thermal management. |
| IFSM (8.3 ms) | 200 A - Peak non-repetitive surge current per diode; withstands inrush and fault transients in SMPS startup or overload. |
| VF @ 10 A, 25°C | 0.56 V (typ) - Low conduction loss reduces power dissipation by ~5.6 W per diode vs. silicon rectifiers, improving efficiency. |
| RθJC | 3.4 °C/W - Junction-to-case thermal resistance per diode; allows direct mounting to heatsink without thermal interface material for compact designs. |
| TJ max | +150 °C - Maximum junction temperature; supports operation in sealed enclosures or high-ambient environments like LED drivers. |
| CJ | 754 pF @ 1 MHz, 4 V - Junction capacitance impacts EMI and switching loss; value optimized for <1 MHz SMPS frequencies. |
Pinout & Package
Package: ITO-220AB - Insulated TO-220 variant with internal isolation between leads and metal tab; matte tin-plated leads compliant with J-STD-002; UL 94V-0 molding compound; 1.73 g weight; polarity marked on device body.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Anode 1 (Lead 1) | First diode anode | Independent input path for first Schottky die; used in dual-output or phase-split rectification. |
| Anode 2 (Lead 2) | Second diode anode | Independent input path for second Schottky die; enables interleaving or redundancy without external wiring. |
| Cathode (Tab) | Common cathode connection | Electrically connected metal tab serves as shared output node and primary thermal path to heatsink. |
Key Features
| Feature | Design Value |
|---|---|
| Trench Schottky architecture | Enables lower VF and higher temperature stability vs. planar Schottky; verified by 0.52 V VF @ 10 A, 125°C. |
| Dual-die common-cathode configuration | Reduces PCB footprint and interconnect inductance vs. two discrete SMD Schottkys; supports balanced current sharing. |
| RθJC = 3.4 °C/W per diode | Permits direct heatsink mounting with minimal thermal interface resistance; validated under 2" × 3" × 0.25" Al-plate test condition. |
| 200 A IFSM (8.3 ms) | Withstands repetitive line surges and transformer reset spikes without degradation; exceeds JEDEC JESD22-A114 requirements. |
| Halogen-free & RoHS-compliant | Meets IEC 61249-2-21 and EU RoHS Directive 2011/65/EU; suitable for consumer and industrial end-equipment certification. |
Applications
| Server Power Supply | LED Driver Secondary Rectification |
|---|---|
Use Scenario: High-efficiency 48 V input, 12 V output server PSU with synchronous rectification. IC Role / Device Role / Timing Role: Dual common-cathode Schottky rectifier replacing two discrete devices in LLC resonant converter secondary side. Use Value: Reduces conduction loss by 1.2 W per diode vs. legacy Si diodes, lowering thermal load on heatsink and enabling fanless operation. | Use Scenario: Constant-current LED driver for street lighting with 36 V nominal output. IC Role / Device Role / Timing Role: Output rectifier handling 10–15 A continuous current with high ambient temperature exposure. Use Value: Maintains <0.62 V VF at 125°C, minimizing thermal runaway risk and ensuring stable light output over lifetime. |
| Laptop Adapter Secondary Side | On-board DC/DC Converter in Industrial PLC |
Use Scenario: Compact 65 W laptop adapter with tight thermal constraints and EMI limits. IC Role / Device Role / Timing Role: Dual-anode Schottky providing low-noise, low-loss rectification for +20 V output rail. Use Value: 754 pF junction capacitance minimizes high-frequency ringing, easing EMI filter design and reducing conducted emissions. | Use Scenario: 24 V input to 5 V/3.3 V isolated DC/DC module inside programmable logic controller enclosure. IC Role / Device Role / Timing Role: Primary output rectifier in flyback secondary winding, mounted directly to chassis ground plane. Use Value: ITO-220AB insulated tab eliminates need for insulating pads, simplifying assembly and improving long-term reliability in vibration-prone environments. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar Schottky rectifier applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Vishay VS-20CPH06 | Same 60 V VRRM, 20 A total, but single-die dual-anode; RθJC = 4.0 °C/W; VF = 0.59 V @ 10 A, 25°C. | Lacks independent die thermal paths; less suited for unbalanced load sharing or asymmetric heatsinking. | Prefer TSF20H60C when dual-die thermal independence or lower VF is required. |
| ON Semiconductor MBR2060CT | 60 V, 20 A, TO-220AC package (non-insulated); RθJC = 3.0 °C/W; VF = 0.72 V @ 10 A, 25°C. | Requires insulating washer for chassis mounting; higher VF increases conduction loss by ~1.6 W per diode. | Choose TSF20H60C for insulated mounting, lower VF, and halogen-free compliance. |
Compared with VS-20CPH06 and MBR2060CT, the TSF20H60C offers superior thermal separation between dies, lowest VF among alternatives, and built-in insulation-making it optimal for thermally demanding, space-constrained, or safety-critical industrial power supplies.
Availability
TSF20H60C is available at Aetrix Electronics and suitable for switching mode power supplies, LED lighting drivers, and on-board DC/DC converters requiring stable component supply, high-temperature reliability, and RoHS-compliant sourcing.
Supply support for TSF20H60C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Taiwan Semiconductor Corporation (TSC) is a vertically integrated analog and power discrete manufacturer headquartered in Hsinchu, Taiwan, serving global industrial, computing, and consumer markets since 1979.
The TSF series of trench Schottky rectifiers targets high-efficiency, high-reliability power conversion systems where low VF, thermal robustness, and regulatory compliance are mandatory design criteria.
FAQ
What is the maximum junction temperature rating for the TSF20H60C?
The TSF20H60C has a maximum junction temperature (TJ) of +150°C, verified across its full operating range from –55°C to +150°C. This rating is supported by its trench Schottky structure and low RθJC of 3.4 °C/W per diode. The TSF20H60C maintains stable forward voltage and leakage performance up to this limit, making it suitable for enclosed or high-ambient environments such as LED drivers and industrial power modules.
Does the TSF20H60C have insulated leads for chassis mounting?
Yes, the TSF20H60C uses the ITO-220AB package, which provides electrical isolation between the metal tab (cathode) and the two anode leads. This insulation eliminates the need for separate insulating washers or pads when mounting directly to a grounded heatsink or chassis. The TSF20H60C's ITO-220AB construction meets UL 94V-0 flammability standards and supports safe, simplified mechanical integration in Class I power supplies.
What is the forward voltage of the TSF20H60C at 10 A and 125°C?
The TSF20H60C exhibits a typical forward voltage of 0.52 V and a maximum of 0.62 V at 10 A and 125°C per diode, as specified in its electrical characteristics table. This low, temperature-stable VF is enabled by its patented trench Schottky technology. The TSF20H60C's performance at elevated temperature ensures consistent efficiency in thermally stressed applications like server PSUs or outdoor LED drivers.
Can the TSF20H60C replace two separate 10 A Schottky diodes?
Yes, the TSF20H60C integrates two independent 10 A Schottky dies in a single ITO-220AB package with a shared cathode, allowing direct replacement of two discrete 10 A Schottky diodes. Its dual-anode layout preserves circuit flexibility while reducing PCB area, solder joints, and thermal interface complexity. The TSF20H60C maintains individual die ratings (IF = 10 A per diode, IFSM = 200 A per diode), ensuring functional equivalence without derating.
Is the TSF20H60C compliant with halogen-free and RoHS requirements?
Yes, the TSF20H60C is both RoHS-compliant and halogen-free in accordance with IEC 61249-2-21. Its molding compound contains no brominated flame retardants or chlorine-based additives, and all terminations use matte tin plating meeting J-STD-002 solderability standards. These certifications are confirmed in the official Taiwan Semiconductor datasheet for TSF20H60C and support compliance for CE, UL, and other regional safety marks.
TSF20H60C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Taiwan Semiconductor Corporation
- Series:
- -
- Package/Case:
- TO-220-3 Full Pack, Isolated Tab
- Packaging:
- Tube
- Product Status:
- Active
- Diode Configuration:
- 1 Pair Common Cathode
- Technology:
- Schottky
- Voltage - DC Reverse (Vr) (Max):
- 60 V
- Current - Average Rectified (Io) (per Diode):
- 10A
- Voltage - Forward (Vf) (Max) @ If:
- 650 mV @ 10 A
- Speed:
- Fast Recovery =< 500ns, > 200mA (Io)
- Reverse Recovery Time (trr):
- -
- Current - Reverse Leakage @ Vr:
- 30 µA @ 60 V
- Operating Temperature - Junction:
- -55°C ~ 150°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Through Hole
- Supplier Device Package:
- ITO-220AB
TSF20H60C FAQ
1.How can I place an order for TSF20H60C through Aetrix?
Please submit a Request for Quotation (RFQ) for TSF20H60C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TSF20H60C reliable?
The price and inventory of TSF20H60C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TSF20H60C is usually 5 days.
3.What payment methods are accepted for TSF20H60C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TSF20H60C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TSF20H60C?
TSF20H60C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TSF20H60C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TSF20H60C?
For technical support, including TSF20H60C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TSF20H60C requirements.
6.How does Aetrix verify that TSF20H60C is sourced from the original manufacturer or authorized distributors?
All TSF20H60C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TSF20H60C meets industry standards.
7.What is the process for return or replacement of TSF20H60C?
All TSF20H60C units undergo pre-shipment inspection (PSI). If there is an issue with TSF20H60C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TSF20H60C part is unused and in its original packaging.
Return procedure for TSF20H60C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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