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Taiwan Semiconductor Corporation TSF20U60C
- Part No.:
- TSF20U60C
- Manufacturer:
- Taiwan Semiconductor Corporation
- Category:
- Diode Arrays
- Package:
- TO-220-3 Full Pack, Isolated Tab
- Datasheet:
-
TSF20U60C.pdf
- Description:
- DIODE ARR SCHOT 60V 10A ITO220AB
- Quantity:
- Payment:
- Shipping:
Inventory:10
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Product details
Overview
TSF20U60C from Taiwan Semiconductor is a 20A, 60V low forward-voltage trench Schottky rectifier in ITO-220AB package with dual-die configuration, rated for 200A surge current and 150°C max junction temperature, used in high-efficiency SMPS and on-board DC/DC converters.
For engineers reviewing the TSF20U60C datasheet, TSF20U60C pinout, TSF20U60C application, or TSF20U60C equivalent, key selection factors include its 0.63V max forward voltage at 20A/25°C, 4°C/W junction-to-case thermal resistance, 10,000 V/µs dv/dt rating, and RoHS/halogen-free compliance for industrial power designs.
Technical Context
This device implements patented trench Schottky technology to achieve stable high-temperature performance and low conduction loss. Its dual-die ITO-220AB construction supports parallel current paths while maintaining single-package integration for compact board layout.
The TSF20U60C delivers 0.48V typical forward voltage at 10A and 125°C, enabling reduced thermal stress in thermally constrained environments. Its 60V repetitive peak reverse voltage and 42V RMS reverse voltage rating target mid-range DC/DC and adapter applications where margin over 48V bus systems is required.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VRRM | 60 V - Maximum repetitive reverse blocking voltage; defines usable input voltage headroom in buck or flyback topologies |
| IF | 20 A - Continuous average forward current; sets steady-state power delivery capability at case temperature ≤75°C |
| IFSM | 200 A - Non-repetitive surge current (8.3 ms half-sine); determines robustness against line transients or startup inrush |
| VF @ 20A, 25°C | 0.63 V max - Forward voltage drop directly impacts conduction loss and thermal design in high-current paths |
| RθJC | 4 °C/W - Junction-to-case thermal resistance; enables accurate heatsink sizing when mounted to PCB copper or external heatsink |
| TJ max | 150 °C - Maximum allowable junction temperature; constrains derating curves and long-term reliability under load |
| dv/dt | 10,000 V/µs - Critical rate of rise of off-state voltage; ensures stable operation during fast-switching node transitions |
Pinout & Package
Package: ITO-220AB - Insulated TO-220 variant with internal isolation between collector (case) and emitter terminals; matte tin-plated leads compliant with J-STD-002 solderability and JESD 201 Class 2 whisker resistance; UL 94V-0 molding compound; 1.70g mass; polarity marked on device body.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Tab (Case) | Cathode (isolated) | Electrically isolated metal tab serves as cathode connection and primary thermal path; requires insulated mounting hardware |
| Lead 1 | Anode | Primary anode terminal for series connection into high-side switching leg or input rectification path |
| Lead 2 | Anode | Second anode terminal supporting dual-die configuration; enables interleaved or paralleled operation within same footprint |
Key Features
| Feature | Design Value |
|---|---|
| Trench Schottky architecture | Enables lower VF and superior high-temperature stability vs planar Schottky, reducing conduction loss at 125°C by ~13% vs TSF20U45C |
| Low VF at high temperature | 0.61 V max at 20A/125°C - maintains efficiency in thermally stressed DC/DC stages without forced air cooling |
| High dv/dt immunity | 10,000 V/µs rating - prevents false turn-on in fast-switching GaN or SiC-based converters with steep voltage edges |
| RoHS & halogen-free | Complies with IEC 61249-2-21 - meets environmental requirements for industrial and consumer end-equipment without compromising thermal or electrical performance |
| Dual-die configuration | Two independent Schottky dies in one ITO-220AB package - simplifies layout versus discrete dual-diode solutions while retaining thermal separation benefits |
Applications
| Server Power Supply | Industrial Adapter |
|---|---|
Use Scenario: Secondary-side synchronous rectification in 48V-input server PSUs operating at >95% efficiency targets. IC Role / Device Role / Timing Role: Low-VF Schottky rectifier replacing MOSFETs in OR-ing and output rectification circuits. Use Value: 0.63V VF at 20A reduces conduction loss by ~1.3W per diode vs legacy 0.75V parts, lowering heatsink requirements. | Use Scenario: Input bridge rectification in universal-input (90–264VAC) industrial adapters delivering 24V/10A output. IC Role / Device Role / Timing Role: High-surge-capable freewheeling diode in active clamp flyback or LLC resonant converter secondary. Use Value: 200A IFSM withstands repeated cold-start surges; 150°C TJ rating sustains operation under sealed enclosure conditions. |
| LED Driver Module | Automotive DC/DC Converter |
Use Scenario: Output rectification in constant-current LED drivers for street lighting with ambient temperatures up to 85°C. IC Role / Device Role / Timing Role: High-efficiency freewheeling diode in boost or SEPIC topology driving 36–48V LED strings. Use Value: 0.48V VF at 125°C minimizes thermal runaway risk in enclosed luminaires; halogen-free package meets regional safety mandates. | Use Scenario: On-board 12V-to-5V/3.3V DC/DC conversion in automotive infotainment ECUs exposed to under-hood thermal cycling. IC Role / Device Role / Timing Role: Input rectifier and clamping diode in buck regulator front-end with transient protection. Use Value: 10,000 V/µs dv/dt rating prevents spurious conduction during load dump events; -55°C to +150°C storage range supports full automotive temp grade. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar Schottky rectifier applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Vishay VS-20CPH06-M3 | 60V VRRM, 20A IF, 0.65V VF max @ 20A/25°C, TO-247AC package, RθJC = 2.5°C/W | Higher thermal conductivity but larger footprint; requires different mounting hardware and PCB cutout | Select when lower thermal resistance is critical and board space allows TO-247 layout |
| ON Semiconductor MBR2060CT | 60V VRRM, 20A IF, 0.75V VF max @ 20A/25°C, TO-220AB package, RθJC = 3.0°C/W, single-die | Higher VF increases conduction loss; no dual-die option; lower surge rating (150A IFSM) | Select when cost sensitivity outweighs efficiency gain and dual-die functionality is unnecessary |
Compared with VS-20CPH06-M3 and MBR2060CT, the TSF20U60C offers best-in-class VF at elevated temperature and integrated dual-die functionality in ITO-220AB-enabling higher power density and thermal margin without changing package footprint.
Availability
TSF20U60C is available at Aetrix Electronics and suitable for switching mode power supplies, industrial adapters, and on-board DC/DC converters requiring stable component supply with consistent parametric performance across production lots.
Supply support for TSF20U60C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Taiwan Semiconductor Corporation (TSC) is a vertically integrated analog and power discrete manufacturer headquartered in Hsinchu, Taiwan, specializing in high-reliability silicon components for industrial and computing markets.
The TSF20U60C belongs to TSC's low-VF trench Schottky rectifier product line, engineered specifically for high-efficiency, high-temperature power conversion in space-constrained applications such as server PSUs and automotive DC/DC modules.
FAQ
What is the maximum junction temperature rating for the TSF20U60C?
The TSF20U60C has a maximum junction temperature (TJ max) of +150°C, verified per absolute maximum ratings table in the official datasheet. This rating enables reliable operation in thermally demanding environments such as enclosed LED drivers or under-hood automotive modules when properly heatsinked. Derating curves define safe operating current versus case temperature, with full 20A capability maintained up to ~75°C case temperature.
Does the TSF20U60C have a dual-die configuration, and how does it affect circuit design?
Yes, the TSF20U60C integrates two independent Schottky dies in a single ITO-220AB package, with separate anode leads and a common isolated cathode tab. This allows designers to implement interleaved rectification or parallel current sharing without additional packaging area. The dual-die structure also improves thermal distribution compared to single-die equivalents, supporting higher sustained current in compact layouts.
What is the forward voltage specification of the TSF20U60C at 20A and 125°C?
The TSF20U60C specifies a maximum forward voltage (VF) of 0.61 V at 20A and 125°C, per the Electrical Specifications table. This value reflects real-world performance under high-temperature operating conditions and is critical for calculating conduction losses in thermally stressed applications such as sealed power supplies or automotive ECUs.
Is the TSF20U60C RoHS and halogen-free compliant?
Yes, the TSF20U60C is fully RoHS compliant and halogen-free per IEC 61249-2-21, as confirmed in the Features section of the official datasheet. The molding compound meets UL 94V-0 flammability rating, and the matte tin-plated leads satisfy J-STD-002 solderability requirements-ensuring compatibility with lead-free reflow processes and environmental regulations.
What is the junction-to-case thermal resistance (RθJC) of the TSF20U60C?
The TSF20U60C has a junction-to-case thermal resistance (RθJC) of 4°C/W, as specified in the Thermal Performance section. This value applies under standard mounting conditions using recommended torque (≤0.56 N·m) and thermal interface material. It enables precise heatsink sizing and thermal simulation for applications requiring sustained 20A operation with controlled junction temperature rise.
TSF20U60C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Taiwan Semiconductor Corporation
- Series:
- -
- Package/Case:
- TO-220-3 Full Pack, Isolated Tab
- Packaging:
- Tube
- Product Status:
- Active
- Diode Configuration:
- 1 Pair Common Cathode
- Technology:
- Schottky
- Voltage - DC Reverse (Vr) (Max):
- 60 V
- Current - Average Rectified (Io) (per Diode):
- 10A
- Voltage - Forward (Vf) (Max) @ If:
- 540 mV @ 10 A
- Speed:
- Fast Recovery =< 500ns, > 200mA (Io)
- Reverse Recovery Time (trr):
- -
- Current - Reverse Leakage @ Vr:
- 300 µA @ 60 V
- Operating Temperature - Junction:
- -55°C ~ 150°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Through Hole
- Supplier Device Package:
- ITO-220AB
TSF20U60C FAQ
1.How can I place an order for TSF20U60C through Aetrix?
Please submit a Request for Quotation (RFQ) for TSF20U60C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TSF20U60C reliable?
The price and inventory of TSF20U60C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TSF20U60C is usually 5 days.
3.What payment methods are accepted for TSF20U60C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TSF20U60C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TSF20U60C?
TSF20U60C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TSF20U60C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TSF20U60C?
For technical support, including TSF20U60C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TSF20U60C requirements.
6.How does Aetrix verify that TSF20U60C is sourced from the original manufacturer or authorized distributors?
All TSF20U60C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TSF20U60C meets industry standards.
7.What is the process for return or replacement of TSF20U60C?
All TSF20U60C units undergo pre-shipment inspection (PSI). If there is an issue with TSF20U60C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TSF20U60C part is unused and in its original packaging.
Return procedure for TSF20U60C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
TSF20U60C Tags
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BAV99-7-F
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Diodes Incorporated
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MMBD1503-TP
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