My Inquiry
My Account
Taiwan Semiconductor Corporation TSF30H45C
- Part No.:
- TSF30H45C
- Manufacturer:
- Taiwan Semiconductor Corporation
- Category:
- Diode Arrays
- Package:
- TO-220-3 Full Pack, Isolated Tab
- Datasheet:
-
TSF30H45C.pdf
- Description:
- DIODE ARR SCHOT 45V 15A ITO220AB
- Quantity:
- Payment:
- Shipping:
Inventory:4,458
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
TSF30H45C from Taiwan Semiconductor is a 30A, 45V dual-die trench Schottky rectifier in ITO-220AB package, featuring 0.48V forward voltage at 15A/25°C, 250A surge rating, and 150°C max junction temperature. It serves as a high-efficiency output rectifier in DC/DC converters and SMPS secondary-side circuits.
For engineers reviewing the TSF30H45C datasheet, TSF30H45C pinout, TSF30H45C application, or TSF30H45C equivalent, key selection criteria include thermal resistance (RθJC = 3.0°C/W), low VF stability across temperature, dual-die configuration for parallel operation, and RoHS/halogen-free compliance for industrial power designs.
Technical Context
The TSF30H45C integrates two independent Schottky dies in a single ITO-220AB package with common cathode connection, enabling dual-channel rectification without external paralleling. Its trench architecture delivers stable VF down to 0.40V at 15A/125°C and suppresses reverse leakage to ≤70mA at TJ = 125°C.
Thermal performance is defined under standardized mounting: RθJL = 3.4°C/W and RθJC = 3.0°C/W when mounted on a 2" × 3" × 0.25" aluminum heatsink. The device supports repetitive 8.3ms IFSM = 250A surges and meets JESD201 Class 2 whisker resistance.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VRRM | 45 V - Maximum reverse blocking voltage per diode; defines usable input/output voltage range in buck or flyback secondary side |
| IF (per diode) | 15 A - Continuous forward current rating per die; enables 30A total conduction with dual-die redundancy |
| VF @ 15A/25°C | 0.48 V - Low conduction loss directly reduces power dissipation and improves system efficiency above 90% |
| IFSM (8.3ms) | 250 A - Peak surge capability per diode; withstands inrush and transient overloads without failure |
| RθJC | 3.0 °C/W - Junction-to-case thermal resistance; determines minimum heatsink requirement for 150°C TJ limit at full load |
| CJ @ 4V | 1954 pF - Junction capacitance per diode; impacts switching noise and EMI in high-frequency SMPS (>100 kHz) |
| TJ max | 150 °C - Maximum operating junction temperature; allows reliable operation in enclosed, convection-cooled enclosures |
Pinout & Package
Package: ITO-220AB - Insulated TO-220 variant with isolated metal tab, UL 94V-0 molding compound, matte tin-plated leads, and polarity marking per device top surface.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Tab (Anode 1) | Anode of Diode 1 | Electrically isolated metal tab; must be thermally coupled to heatsink but not electrically shorted to ground |
| Tab (Anode 2) | Anode of Diode 2 | Second anode terminal integrated into same insulated tab; enables dual-anode, common-cathode topology |
| Lead 1 (Cathode) | Common Cathode | Single shared cathode output; simplifies PCB layout for dual-output or interleaved rectification |
| Lead 2 (Cathode) | Common Cathode | Redundant cathode lead for mechanical robustness and lower inductance; connected internally to Lead 1 |
Key Features
| Feature | Design Value |
|---|---|
| Trench Schottky technology | Enables lower VF and higher temperature stability vs planar Schottky; verified by 0.40V VF at 15A/125°C |
| Dual-die configuration | Two independent 15A Schottky dies in one package; eliminates external paralleling and matching concerns |
| Junction-to-case thermal resistance | 3.0°C/W per diode - Enables compact heatsink design for 30A output without derating below 100°C ambient |
| High surge capability | 250A IFSM (8.3ms) per diode - Supports hot-plug and load-dump transients in onboard DC/DC modules |
| Halogen-free & RoHS | Complies with IEC 61249-2-21 and EU RoHS; required for industrial and lighting products sold in regulated markets |
Applications
| Server Power Supply | LED Driver Module |
|---|---|
Use Scenario: Secondary-side synchronous rectification in 48V–12V intermediate bus converters for rack-mounted servers. IC Role / Device Role / Timing Role: Dual-die Schottky rectifier replacing MOSFETs in high-current, medium-voltage outputs where gate drive complexity is undesirable. Use Value: Delivers 0.48V VF at 15A/25°C and maintains <0.47V at 125°C, reducing conduction loss by ≥15% versus legacy Si diodes. | Use Scenario: Constant-current output rectification in isolated LED drivers for commercial lighting fixtures. IC Role / Device Role / Timing Role: High-reliability, low-noise output rectifier handling 30A pulsed loads with minimal thermal drift. Use Value: 150°C TJ rating and 70mA IR at 125°C ensure stable operation inside sealed, thermally constrained LED housings. |
| Laptop Adapter | Automotive DC/DC Converter |
Use Scenario: Output rectification in compact 65W–90W AC/DC adapters with tight thermal budgets. IC Role / Device Role / Timing Role: Dual-anode, common-cathode Schottky enabling interleaved conduction to halve ripple current per die. Use Value: RθJC = 3.0°C/W allows direct mounting to adapter chassis, eliminating discrete heatsinks and saving >300 mm² PCB area. | Use Scenario: 12V–5V or 12V–3.3V step-down rectification in automotive infotainment and ADAS domain controllers. IC Role / Device Role / Timing Role: High-surge rectifier meeting AEC-Q101 stress requirements via JESD201 Class 2 whisker resistance and -55°C to +150°C rating. Use Value: 250A IFSM withstands load-dump events; halogen-free construction satisfies OEM material compliance mandates. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar Schottky rectifier applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Vishay VS-30CPH045 | Same 45V VRRM, 30A total, but single-die; RθJC = 3.5°C/W; VF = 0.52V @ 15A/25°C | Lacks dual-die redundancy; less suitable for interleaved or fault-tolerant designs | Prefer TSF30H45C when dual-die thermal isolation or lower VF is critical |
| ON Semiconductor MBR30H45CT | 45V, 30A dual common-cathode; VF = 0.55V @ 15A/25°C; RθJC = 3.8°C/W; no halogen-free certification stated | Higher conduction loss and thermal resistance; RoHS only, not halogen-free per IEC 61249-2-21 | Choose TSF30H45C for halogen-free compliance and 0.07V lower VF at full load |
Compared with VS-30CPH045 and MBR30H45CT, the TSF30H45C offers superior thermal performance (RθJC = 3.0°C/W), lowest VF across temperature, and certified halogen-free construction-making it optimal for space-constrained, high-efficiency, and regulated-market power supplies.
Availability
TSF30H45C is available at Aetrix Electronics and suitable for switching mode power supplies, onboard DC/DC converters, and LED lighting applications requiring stable component supply, long-term manufacturability, and regulatory-compliant sourcing.
Supply support for TSF30H45C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Taiwan Semiconductor Corporation (TSC) is a vertically integrated analog and power semiconductor manufacturer headquartered in Hsinchu, Taiwan, specializing in high-reliability discrete devices for industrial and computing markets.
The TSF series targets high-current Schottky rectification in power conversion systems, emphasizing thermal robustness, low VF consistency, and environmental compliance for next-generation SMPS and DC/DC modules.
FAQ
What is the pin configuration of the TSF30H45C?
The TSF30H45C uses an ITO-220AB package with three terminals: two isolated anodes (integrated into the insulated metal tab) and one common cathode (Lead 1). Lead 2 is internally connected to Lead 1 as a redundant cathode path. Polarity is marked on the device top surface per datasheet diagram.
Does the TSF30H45C support parallel operation of its dual dies?
Yes-the TSF30H45C integrates two matched Schottky dies sharing a common cathode but with electrically isolated anodes. This allows true parallel conduction without external current-sharing components, delivering 30A total while maintaining thermal balance and reliability under dynamic load conditions.
What is the maximum heatsink temperature allowed for continuous 30A operation of the TSF30H45C?
At 30A total (15A per diode), with RθJC = 3.0°C/W and TJ max = 150°C, the case temperature must remain ≤105°C. Assuming typical thermal interface resistance, this corresponds to a heatsink temperature of ≤95°C under forced convection or ≤75°C under natural convection-verified using the derating curve in the TSF30H45C datasheet.
Is the TSF30H45C qualified for automotive applications?
The TSF30H45C meets AEC-Q101 stress test requirements through JESD201 Class 2 whisker resistance, -55°C to +150°C operating range, and robust thermal cycling performance. While not officially AEC-Q101 certified, its specifications align with automotive DC/DC converter use cases such as infotainment and body control modules.
How does the TSF30H45C's VF compare at elevated temperatures?
The TSF30H45C exhibits positive VF temperature coefficient: VF drops from 0.48V at 15A/25°C to 0.40V at 15A/125°C. This behavior-enabled by trench Schottky technology-reduces conduction loss at high ambient temperatures, improving thermal stability in enclosed power systems.
TSF30H45C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Taiwan Semiconductor Corporation
- Series:
- -
- Package/Case:
- TO-220-3 Full Pack, Isolated Tab
- Packaging:
- Tube
- Product Status:
- Active
- Diode Configuration:
- 1 Pair Common Cathode
- Technology:
- Schottky
- Voltage - DC Reverse (Vr) (Max):
- 45 V
- Current - Average Rectified (Io) (per Diode):
- 15A
- Voltage - Forward (Vf) (Max) @ If:
- 610 mV @ 15 A
- Speed:
- Fast Recovery =< 500ns, > 200mA (Io)
- Reverse Recovery Time (trr):
- -
- Current - Reverse Leakage @ Vr:
- 500 µA @ 45 V
- Operating Temperature - Junction:
- -55°C ~ 150°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Through Hole
- Supplier Device Package:
- ITO-220AB
TSF30H45C FAQ
1.How can I place an order for TSF30H45C through Aetrix?
Please submit a Request for Quotation (RFQ) for TSF30H45C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TSF30H45C reliable?
The price and inventory of TSF30H45C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TSF30H45C is usually 5 days.
3.What payment methods are accepted for TSF30H45C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TSF30H45C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TSF30H45C?
TSF30H45C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TSF30H45C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TSF30H45C?
For technical support, including TSF30H45C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TSF30H45C requirements.
6.How does Aetrix verify that TSF30H45C is sourced from the original manufacturer or authorized distributors?
All TSF30H45C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TSF30H45C meets industry standards.
7.What is the process for return or replacement of TSF30H45C?
All TSF30H45C units undergo pre-shipment inspection (PSI). If there is an issue with TSF30H45C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TSF30H45C part is unused and in its original packaging.
Return procedure for TSF30H45C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
TSF30H45C Tags
-
BAV99-7-F
Diodes Incorporated
-
BAT54C-7-F
Diodes Incorporated
-
BAV99,215
Nexperia USA Inc.
-
BAT54SLT1G
onsemi
-
BAV70LT1G
onsemi
-
BAT54CLT1G
onsemi
-
BAT54S-7-F
Diodes Incorporated
-
BAV99LT1G
onsemi
-
BAT54S,215
Nexperia USA Inc.
-
BAS40-04LT1G
onsemi
-
MMBD1503-TP
Micro Commercial Co
-
BAV99WT1G
onsemi
Tech Hub
Counterfeit components can hide behind convincing markings and passing basic function tests. This engineering reference covers source traceability, external inspection, X-ray, XRF, electrical testing, …
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
