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Taiwan Semiconductor Corporation TSF30H60C
- Part No.:
- TSF30H60C
- Manufacturer:
- Taiwan Semiconductor Corporation
- Category:
- Diode Arrays
- Package:
- TO-220-3 Full Pack, Isolated Tab
- Datasheet:
-
TSF30H60C.pdf
- Description:
- DIODE ARR SCHOT 60V 15A ITO220AB
- Quantity:
- Payment:
- Shipping:
Inventory:3,824
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Product details
Overview
TSF30H60C from Taiwan Semiconductor is a 30A, 60V dual-die trench Schottky rectifier in ITO-220AB package, featuring low forward voltage (0.55 V at 15 A, 25°C), high surge capability (230 A @ 8.3 ms), and 150°C max junction temperature. It serves as a high-efficiency output rectifier in DC/DC converters and SMPS secondary-side circuits.
For engineers reviewing the TSF30H60C datasheet, TSF30H60C pinout, TSF30H60C application, or TSF30H60C equivalent, key selection factors include thermal resistance (RθJC = 3.0°C/W), dual-die configuration for parallel operation, RoHS/halogen-free compliance, and mounting torque limit (0.56 N·m).
Technical Context
The TSF30H60C integrates two independent Schottky die in a single ITO-220AB package with common cathode connection, enabling dual-channel rectification without external paralleling. Its trench architecture delivers stable VF across -55°C to 150°C and suppresses reverse recovery loss.
Thermal performance is defined with heatsink mounting (2" × 3" × 0.25" Al-plate); RθJA = 14.8°C/W and RθJL = 3.4°C/W per diode confirm suitability for high-power density board-level designs where lead-to-heatsink conduction dominates cooling.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Max Repetitive Reverse Voltage | 60 V - supports 48 V nominal bus systems with 25% margin against transients |
| Continuous Forward Current (per diode) | 15 A - enables 30 A total output when both dies used in parallel configuration |
| Surge Current (8.3 ms) | 230 A - withstands inrush and short-circuit events in SMPS without failure |
| Forward Voltage (15 A, 25°C) | 0.55 V (typ), 0.70 V (max) - reduces conduction loss vs. silicon diodes by >40% |
| Junction-to-Case Thermal Resistance | 3.0 °C/W - allows direct heatsink mounting with minimal thermal interface resistance |
| Operating Junction Temperature | -55°C to +150°C - rated for under-hood automotive and industrial ambient environments |
| Reverse Leakage (125°C) | 45 mA - remains manageable in high-temp DC/DC converters with active thermal management |
Pinout & Package
Package: ITO-220AB - insulated thermoplastic outline with metal tab (cathode-connected), UL 94V-0 molding compound, matte tin-plated leads, 1.75 g weight, polarity marked on device body.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Tab (Metal Surface) | Cathode (common to both dies) | Electrically and thermally connected to internal cathode metallization; must be mounted to heatsink with electrical isolation if required |
| Lead 1 | Anode 1 | Independent anode terminal for first Schottky die; enables discrete routing or current sharing control |
| Lead 2 | Anode 2 | Independent anode terminal for second Schottky die; supports dual-output or phase-interleaved converter topologies |
Key Features
| Feature | Design Value |
|---|---|
| Trench Schottky technology | Enables lower VF and higher temperature stability than planar Schottky, reducing thermal runaway risk in high-current operation |
| High surge capability (230 A) | Supports robust start-up and fault tolerance in 48 V telecom and server power supplies without derating |
| RoHS & halogen-free compliance | Fulfills IEC 61249-2-21 and environmental requirements for consumer, industrial, and automotive end equipment |
| Junction-to-case thermal resistance (3.0 °C/W) | Permits efficient heat extraction through tab-mounting, critical for compact 30 A rectifier designs with limited airflow |
Applications
| Server Power Supply Rectification | Industrial DC/DC Converter Output |
|---|---|
Use Scenario: Secondary-side synchronous rectification replacement in 48 V input, 12 V/30 A output server PSUs. IC Role / Device Role / Timing Role: Dual-die Schottky rectifier providing low-loss unidirectional conduction with shared cathode for compact layout. Use Value: 0.55 V forward drop at 15 A reduces conduction loss by ~2.5 W per diode versus legacy Si devices, improving system efficiency by 0.8–1.2%. | Use Scenario: High-reliability output rectification in DIN-rail mounted 24 V industrial DC/DC modules operating at 60°C ambient. IC Role / Device Role / Timing Role: Dual-anode, common-cathode Schottky enabling independent current path control and thermal load balancing. Use Value: 150°C junction rating and 45 mA IR at 125°C ensure stable operation without forced cooling, extending MTBF in sealed enclosures. |
| LED Driver Secondary Rectification | Automotive On-Board Charger (OBC) Auxiliary Supply |
Use Scenario: Output rectification in constant-current LED drivers for street lighting, handling 15–30 A loads with PWM dimming. IC Role / Device Role / Timing Role: High-surge Schottky rectifier absorbing inductive kickback during MOSFET switching transitions. Use Value: 230 A IFSM withstands repetitive 8.3 ms surges from transformer leakage inductance, eliminating need for snubbers. | Use Scenario: 12 V auxiliary supply rectification in 3.3 kW OBC modules, exposed to under-hood temperatures up to 105°C case temp. IC Role / Device Role / Timing Role: Dual-die trench Schottky delivering stable VF across wide temperature range for predictable efficiency. Use Value: VF drift of only 0.12 V from 25°C to 125°C ensures consistent regulation and thermal design margin in automotive environments. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar Schottky rectifier applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Vishay VS-30CPH06-M3 | Same 60 V VRRM, 30 A total, but single-die TO-247AC package; RθJC = 2.5°C/W, VF = 0.62 V @ 15 A | Lacks dual-anode flexibility; better thermal resistance but higher VF increases conduction loss | Prefer when heatsink interface is optimized for TO-247 and dual-anode routing is unnecessary |
| ON Semiconductor MBR30H60CT | 60 V, 30 A dual-diode in TO-220AB; VF = 0.72 V @ 15 A, RθJC = 3.5°C/W, TJ max = 175°C | Higher VF and slightly worse thermal resistance; wider temperature rating but lower surge (175 A) | Choose when extended temperature margin (175°C) outweighs efficiency penalty in cost-sensitive industrial designs |
Compared with VS-30CPH06-M3 and MBR30H60CT, the TSF30H60C offers the lowest VF among ITO-220AB-packaged 30 A/60 V dual Schottkys and unique dual-anode access-critical for interleaved or redundancy-aware layouts-while maintaining competitive thermal resistance and surge rating.
Availability
TSF30H60C is available at Aetrix Electronics and suitable for switching mode power supplies, on-board DC/DC converters, LED lighting drivers, and industrial adapter designs requiring stable component supply, long-term lifecycle support, and RoHS-compliant sourcing.
Supply support for TSF30H60C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Taiwan Semiconductor Corporation (TSC) is a vertically integrated analog and discrete semiconductor manufacturer headquartered in Hsinchu, Taiwan, specializing in power rectifiers, TVS diodes, and MOSFETs since 1979.
The TSF30H60C belongs to TSC's high-current trench Schottky rectifier product line, engineered specifically for high-efficiency, high-reliability secondary-side rectification in enterprise power, industrial automation, and transportation electronics.
FAQ
What is the pin configuration of the TSF30H60C?
The TSF30H60C has three terminals: metal tab (common cathode), Lead 1 (Anode 1), and Lead 2 (Anode 2). This dual-anode, common-cathode arrangement enables independent current paths. The tab must be electrically isolated from PCB ground unless cathode reference requires connection. Polarity is marked on the device body per ITO-220AB standard.
Does the TSF30H60C support parallel operation of its two dies?
Yes-the TSF30H60C is explicitly designed with matched dual dies for parallel use. Each die handles 15 A continuous (30 A total), with tightly controlled VF matching (±5% typical at 15 A, 25°C) ensuring balanced current sharing without external ballasting resistors in properly laid-out PCBs.
What is the maximum mounting torque for the TSF30H60C?
The maximum recommended mounting torque for the TSF30H60C is 0.56 N·m. Exceeding this value risks cracking the ITO-220AB package molding compound or damaging internal wire bonds. Use calibrated torque screwdrivers and follow TSC's mechanical installation guidelines in Datasheet Version D2102 to ensure long-term reliability.
How does the TSF30H60C perform at elevated temperature?
At 125°C junction temperature, the TSF30H60C maintains VF = 0.50 V (typ) and IR = 45 mA (max) per diode-demonstrating superior thermal stability over conventional Schottkys. Its 150°C TJ max rating and low VF drift (<0.12 V increase from 25°C to 125°C) make it suitable for high-ambient applications like automotive OBCs and enclosed industrial converters.
Is the TSF30H60C halogen-free and RoHS compliant?
Yes-the TSF30H60C is fully RoHS compliant and halogen-free per IEC 61249-2-21. The molding compound meets UL 94V-0 flammability rating, and matte tin-plated leads comply with J-STD-002 solderability standards. Whisker resistance is certified to JESD 201 Class 2, confirming suitability for long-life, high-reliability deployments.
TSF30H60C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Taiwan Semiconductor Corporation
- Series:
- -
- Package/Case:
- TO-220-3 Full Pack, Isolated Tab
- Packaging:
- Tube
- Product Status:
- Active
- Diode Configuration:
- 1 Pair Common Cathode
- Technology:
- Schottky
- Voltage - DC Reverse (Vr) (Max):
- 60 V
- Current - Average Rectified (Io) (per Diode):
- 15A
- Voltage - Forward (Vf) (Max) @ If:
- 700 mV @ 15 A
- Speed:
- Fast Recovery =< 500ns, > 200mA (Io)
- Reverse Recovery Time (trr):
- -
- Current - Reverse Leakage @ Vr:
- 500 µA @ 60 V
- Operating Temperature - Junction:
- -55°C ~ 150°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Through Hole
- Supplier Device Package:
- ITO-220AB
TSF30H60C FAQ
1.How can I place an order for TSF30H60C through Aetrix?
Please submit a Request for Quotation (RFQ) for TSF30H60C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TSF30H60C reliable?
The price and inventory of TSF30H60C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TSF30H60C is usually 5 days.
3.What payment methods are accepted for TSF30H60C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TSF30H60C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TSF30H60C?
TSF30H60C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TSF30H60C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TSF30H60C?
For technical support, including TSF30H60C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TSF30H60C requirements.
6.How does Aetrix verify that TSF30H60C is sourced from the original manufacturer or authorized distributors?
All TSF30H60C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TSF30H60C meets industry standards.
7.What is the process for return or replacement of TSF30H60C?
All TSF30H60C units undergo pre-shipment inspection (PSI). If there is an issue with TSF30H60C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TSF30H60C part is unused and in its original packaging.
Return procedure for TSF30H60C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
TSF30H60C Tags
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