Taiwan Semiconductor Corporation TSF30U60C
- Part No.:
- TSF30U60C
- Manufacturer:
- Taiwan Semiconductor Corporation
- Category:
- Diode Arrays
- Package:
- TO-220-3 Full Pack, Isolated Tab
- Datasheet:
-
TSF30U60C.pdf
- Description:
- DIODE ARR SCHOT 60V 15A ITO220AB
- Quantity:
- Payment:

- Shipping:

Inventory:3,702
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Product details
Overview
TSF30U60C from Taiwan Semiconductor is a 30A, 60V trench Schottky rectifier in ITO-220AB package with dual-die configuration, low 0.48V typical forward voltage at 15A/25°C, 250A surge rating, and 150°C maximum junction temperature - deployed in high-efficiency SMPS and on-board DC/DC converters.
For engineers reviewing the TSF30U60C datasheet, TSF30U60C pinout, TSF30U60C application, or TSF30U60C equivalent, key selection criteria include forward voltage stability across temperature, thermal resistance (RθJC = 4°C/W), surge capability (IFSM = 250A), RoHS/halogen-free compliance, and ITO-220AB mechanical mounting requirements.
Technical Context
The TSF30U60C employs patented trench Schottky technology to achieve low VF and high temperature stability, enabling operation up to 150°C junction temperature without significant forward voltage degradation. Its dual-die configuration supports parallel current handling while maintaining tight thermal coupling.
With dv/dt rating of 10,000 V/µs and reverse leakage under 500 µA at 25°C, the TSF30U60C delivers robust noise immunity and low standby loss in fast-switching topologies. The device meets JESD201 Class 2 whisker resistance and UL 94V-0 molding compound standards.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| IF (Continuous) | 30 A - Sustained output current capacity for continuous conduction mode in DC/DC stages |
| VRRM | 60 V - Maximum repetitive reverse blocking voltage; defines safe operating margin in 48V bus applications |
| VF @ 15A, 25°C | 0.48 V (typ) - Directly reduces conduction loss and improves system efficiency vs. planar Schottkys |
| IFSM (8.3ms) | 250 A - Withstands transient inrush during power-up or fault recovery in SMPS |
| RθJC | 4 °C/W - Enables effective heatsinking via case-mounting; supports >20W dissipation with moderate thermal interface |
| TJ max | 150 °C - Allows operation in thermally constrained environments such as enclosed adapters or LED drivers |
| IR @ 60V, 125°C | 60 mA - Low leakage preserves efficiency at elevated temperatures in automotive-adjacent industrial designs |
Pinout & Package
Package: ITO-220AB - Insulated TO-220 variant with isolated tab (electrically floating), matte tin-plated leads, UL 94V-0 molding, and 0.56 N·m max mounting torque. Polarity marked on device body.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Anode (Lead 1) | Input current entry point | Connected to high-side switching node; requires low-inductance layout to minimize ringing |
| Cathode (Lead 2) | Output current exit point | Common return path for load; electrically tied to isolated metal tab in ITO-220AB |
| Isolated Tab | Thermal interface / electrical isolation | Provides mechanical mounting surface and thermal path without electrical connection to either terminal |
Key Features
| Feature | Design Value |
|---|---|
| Trench Schottky architecture | Enables 0.48V VF at 15A/25°C - reduces conduction loss by ~15% vs. comparable planar Schottkys |
| High-temperature VF stability | VF drops to 0.43V (typ) at 15A/125°C - maintains efficiency under thermal stress |
| Junction-to-case thermal resistance | 4°C/W - allows direct heatsink attachment without thermal pad compromise in space-constrained layouts |
| RoHS & halogen-free compliance | Meets IEC 61249-2-21 and JEDEC J-STD-020 - supports green manufacturing and end-of-life recycling |
| 250A surge rating | Withstands 8.3ms half-sine surges - eliminates need for external surge clamping in adapter input stages |
Applications
| Switching Mode Power Supply (SMPS) | On-Board DC/DC Converter |
|---|---|
Use Scenario: Secondary-side rectification in 30–60W AC/DC flyback or LLC resonant converters. IC Role / Device Role / Timing Role: Output synchronous rectifier replacing MOSFETs or conventional diodes to reduce conduction loss. Use Value: 0.48V VF minimizes power loss at 15A load, improving full-load efficiency by ≥1.2% over standard Schottkys. | Use Scenario: Point-of-load (POL) rectification in server VRMs or telecom board-level converters. IC Role / Device Role / Timing Role: High-current freewheeling diode in buck-derived topologies with 48V input. Use Value: Dual-die configuration and 4°C/W RθJC enable stable 30A operation without forced air cooling. |
| LED Lighting Driver | Laptop/Adapter Secondary Rectification |
Use Scenario: Constant-current output rectification in isolated LED drivers for streetlight or industrial fixtures. IC Role / Device Role / Timing Role: Main output rectifier handling pulsed DC with high ambient temperature exposure. Use Value: 150°C TJ max and <60mA IR at 125°C ensure reliability in sealed, thermally aggressive enclosures. | Use Scenario: Output rectification in compact 65W universal-input laptop adapters. IC Role / Device Role / Timing Role: Low-VF secondary-side diode minimizing heat generation in ultra-thin form factors. Use Value: Matte tin-plated leads and J-STD-002 solderability support high-yield reflow assembly without lead finish concerns. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar Schottky rectifier applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Vishay VS-30CPH06-M3 | Same 60V VRRM, 30A IF, but TO-247AC package; VF = 0.52V (max) @ 15A/25°C | Higher thermal mass but no isolated tab; requires insulating hardware for heatsink mounting | Preferred where higher surge margin (300A IFSM) and legacy TO-247 footprint exist |
| ON Semiconductor MBR3060CT | 60V/30A dual common-cathode Schottky in TO-220AB; VF = 0.72V (max) @ 15A/25°C; no trench process | Higher conduction loss; lacks high-temp VF stability and halogen-free certification | Cost-sensitive designs accepting ~0.24V higher VF and relaxed thermal performance |
Compared with VS-30CPH06-M3 and MBR3060CT, the TSF30U60C offers the lowest VF (0.48V typ), integrated thermal isolation via ITO-220AB, and verified halogen-free compliance - making it optimal for thermally dense, efficiency-critical, and environmentally regulated applications.
Availability
TSF30U60C is available at Aetrix Electronics and suitable for switching mode power supplies, on-board DC/DC converters, and LED lighting drivers requiring stable component supply, consistent parametric performance, and long-term industrial availability.
Supply support for TSF30U60C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Taiwan Semiconductor Corporation (TSC) is a vertically integrated analog and discrete semiconductor manufacturer headquartered in Hsinchu, Taiwan, specializing in power devices, ESD protection, and precision analog ICs since 1979.
The TSF30U60C belongs to TSC's high-efficiency trench Schottky rectifier product line, engineered specifically for high-frequency, high-temperature, low-loss rectification in next-generation power conversion systems.
FAQ
What is the maximum junction temperature rating for the TSF30U60C?
The TSF30U60C has a maximum junction temperature (TJ) of +150°C, validated per absolute maximum ratings. This enables reliable operation in thermally demanding environments such as enclosed LED drivers or high-density server DC/DC modules. Derating curves confirm usable current capacity down to 10A at 150°C case temperature, and the device maintains low VF stability across this range.
Does the TSF30U60C have an electrically isolated tab?
Yes, the TSF30U60C uses the ITO-220AB package, which features an electrically isolated metal tab. Unlike standard TO-220AB, the tab is not internally connected to any terminal - allowing direct heatsink mounting without insulation hardware. This simplifies thermal design while maintaining safety isolation in AC/DC secondary-side applications.
What is the forward voltage specification of the TSF30U60C at elevated temperature?
At 15A and 125°C junction temperature, the TSF30U60C exhibits a typical forward voltage of 0.43V (max 0.52V). This reduction versus room-temperature VF reflects the positive temperature coefficient of trench Schottky diodes and contributes to thermal stability in high-power operation - a key advantage over planar Schottky alternatives.
Is the TSF30U60C compliant with halogen-free standards?
Yes, the TSF30U60C is halogen-free per IEC 61249-2-21 and RoHS-compliant. The molding compound contains no brominated flame retardants or chlorine-based additives, supporting environmentally responsible manufacturing and end-of-life processing without release of toxic halogenated gases during PCB rework or disposal.
What is the surge current rating of the TSF30U60C and how is it tested?
The TSF30U60C has a peak non-repetitive forward surge current (IFSM) rating of 250A, tested per JEDEC JESD282B using an 8.3ms single half-sine waveform superimposed on rated DC load. This rating ensures robustness against inrush currents during cold-start or output short-circuit recovery in SMPS and adapter applications.
TSF30U60C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Taiwan Semiconductor Corporation
- Series:
- -
- Package/Case:
- TO-220-3 Full Pack, Isolated Tab
- Packaging:
- Tube
- Product Status:
- Active
- Diode Configuration:
- 1 Pair Common Cathode
- Technology:
- Schottky
- Voltage - DC Reverse (Vr) (Max):
- 60 V
- Current - Average Rectified (Io) (per Diode):
- 15A
- Voltage - Forward (Vf) (Max) @ If:
- 570 mV @ 15 A
- Speed:
- Fast Recovery =< 500ns, > 200mA (Io)
- Reverse Recovery Time (trr):
- -
- Current - Reverse Leakage @ Vr:
- 500 µA @ 60 V
- Operating Temperature - Junction:
- -55°C ~ 150°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Through Hole
- Supplier Device Package:
- ITO-220AB
TSF30U60C FAQ
1.How can I place an order for TSF30U60C through Aetrix?
Please submit a Request for Quotation (RFQ) for TSF30U60C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TSF30U60C reliable?
The price and inventory of TSF30U60C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TSF30U60C is usually 5 days.
3.What payment methods are accepted for TSF30U60C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TSF30U60C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TSF30U60C?
TSF30U60C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TSF30U60C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TSF30U60C?
For technical support, including TSF30U60C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TSF30U60C requirements.
6.How does Aetrix verify that TSF30U60C is sourced from the original manufacturer or authorized distributors?
All TSF30U60C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TSF30U60C meets industry standards.
7.What is the process for return or replacement of TSF30U60C?
All TSF30U60C units undergo pre-shipment inspection (PSI). If there is an issue with TSF30U60C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TSF30U60C part is unused and in its original packaging.
Return procedure for TSF30U60C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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