Taiwan Semiconductor Corporation TSS0230U RGG

Overview

TSS0230U RGG from Taiwan Semiconductor is a surface-mount Schottky barrier diode in 0603 package, rated for 200 mA average forward current, 35 V repetitive peak reverse voltage, and 0.6 V forward voltage at 200 mA - used in compact DC-DC converters and low-power adapters.

For engineers reviewing the TSS0230U RGG datasheet, TSS0230U RGG pinout, TSS0230U RGG application, or TSS0230U RGG equivalent, key selection criteria include low VF for efficiency, low CJ (18 pF) for high-frequency switching, RoHS/halogen-free compliance, and JESD201 Class 1A whisker resistance in space-constrained power stages.

Technical Context

This Schottky diode employs a single-die construction with matte Au-plated terminals, optimized for low-loss rectification in high-frequency switching power supplies. Its 18 pF junction capacitance at 1 MHz and VR = 1 V supports fast transient response in buck converter freewheeling paths.

The device operates across –40 °C to +125 °C junction temperature range and features a cathode band polarity indicator. Moisture sensitivity level 1 (per J-STD-020) enables standard reflow without baking, and UL 94 V-0 molding compound ensures flame-retardant reliability in compact adapters.

Key Specifications

Pinout & Package

Package: 0603 (1.6 × 0.8 × 0.75 mm), surface-mount, cathode-indicated by band. Matte Au-plated terminals meet J-STD-002 solderability and JESD201 Class 1A whisker requirements.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar Schottky diode applications.

Compared with AP2301W5-7 and VS-2EDH02HM3/H, the TSS0230U RGG uniquely balances 35 V blocking, 0.6 V VF, and 0603 size - making it optimal for space-limited 35 V-rated adapters and buck converters where both voltage margin and footprint matter.

Availability

TSS0230U RGG is available at Aetrix Electronics and suitable for adapter power supplies, DC-DC buck converters, and inverter auxiliary supplies requiring stable component supply with halogen-free, RoHS-compliant sourcing.

Supply support for TSS0230U RGG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Taiwan Semiconductor Corporation (TSC) is a vertically integrated semiconductor manufacturer specializing in discrete power devices, including Schottky diodes, TVS, MOSFETs, and rectifiers for industrial and consumer power systems.

The TSS series targets high-efficiency, miniaturized surface-mount rectification - designed specifically for space-constrained switching power supplies needing low VF, low CJ, and robust process reliability.

FAQ

What is the marking code for TSS0230U RGG?

The TSS0230U RGG is marked with "BB" on the device body, indicating its specific variant within the TSS0230U family. This two-character laser marking is visible under 10× magnification on the top surface of the 0603 package and aligns with Taiwan Semiconductor's standardized coding for Schottky diodes. The "BB" marking is consistent across all TSS0230U RGG units and confirms full compliance with the G1706 revision specifications.

Is TSS0230U RGG suitable for reflow soldering without pre-baking?

Yes, TSS0230U RGG has a moisture sensitivity level (MSL) of 1 per J-STD-020, meaning it can be subjected to standard lead-free reflow profiles (e.g., JEDEC J-STD-020 Rev. E) without prior baking. Its MSL-1 rating is verified through qualification testing and reflects the UL 94 V-0 molding compound's low moisture absorption. This eliminates handling overhead in high-volume SMT lines and ensures reliable interconnect integrity for TSS0230U RGG.

Does TSS0230U RGG meet JESD201 whisker resistance requirements?

Yes, TSS0230U RGG passes JESD201 Class 1A whisker testing, confirmed by Taiwan Semiconductor's qualification reports. Its matte Au-plated terminals are engineered to suppress tin whisker growth under thermal cycling and long-term storage, supporting reliability in automotive and industrial applications. This requirement is explicitly met for TSS0230U RGG and is documented in the mechanical data section of its official datasheet revision G1706.

What is the reverse leakage current specification for TSS0230U RGG?

The reverse leakage current (IR) for TSS0230U RGG is specified as a maximum of 1 μA at VR = 10 V and TJ = 25 °C, per the Electrical Specifications table. This value is measured under pulse conditions (PW = 30 ms) and represents worst-case leakage under nominal bias. At elevated temperatures or higher reverse voltages, IR increases predictably - e.g., up to ~10 μA at 125 °C and 10 V - a behavior fully characterized in the device's reverse characteristics curve (Fig.2).

Can TSS0230U RGG replace a 1N5817 in existing designs?

TSS0230U RGG is not a direct replacement for the through-hole 1N5817 due to package (0603 vs. DO-41), thermal mass, and surge rating differences (IFSM = 1.0 A vs. 25 A). However, in new SMT designs targeting <200 mA average current and ≤35 V reverse stress, TSS0230U RGG offers superior high-frequency performance and smaller footprint. For legacy 1N5817 layouts, redesign is required - TSS0230U RGG cannot be substituted without PCB revision.