Taiwan Semiconductor Corporation TSS43U RGG

Overview

TSS43U RGG from Taiwan Semiconductor is a surface-mount Schottky barrier diode in 0603 package, rated for 30 V repetitive peak reverse voltage, 200 mA average forward current, and 0.45 V forward voltage at 2 mA - optimized for low-power signal rectification and ESD-sensitive high-frequency circuits such as USB data lines and RF front-end bias networks.

For engineers reviewing the TSS43U RGG datasheet, TSS43U RGG pinout, TSS43U RGG application, or TSS43U RGG equivalent, key selection criteria include its 0.45 V VF at 2 mA, 10 pF junction capacitance at 1 V, 5 ns reverse recovery time, gold-plated solderable terminals per MIL-STD-750 method 2026, and halogen-free green compound compliance with IEC 61249-2-21.

Technical Context

The TSS43U RGG implements a planar Schottky junction structure enabling fast switching (trr = 5 ns) and low forward conduction loss. Its 0603 footprint supports automated placement on dense PCBs, and the cathode band marking ensures unambiguous polarity identification during assembly.

Thermal resistance is 667°C/W (junction-to-ambient), with operation supported from −55°C to +125°C. The device exhibits 0.1 μA reverse leakage at VR = 25 V and maintains stable capacitance (10 pF typical at 1 V, 1 MHz) across bias voltages up to 15 V.

Key Specifications

Pinout & Package

Package: 0603 (1.60 × 0.80 × 0.75 mm), leadless, gold-plated terminals, cathode indicated by band.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar Schottky diode applications.

Compared with RB521S-30T2R and NSR0230HT1G, the TSS43U RGG delivers the lowest capacitance (10 pF) and smallest footprint (0603) among these three, making it uniquely suited for high-frequency signal integrity–critical roles where layout density and parasitic minimization are primary constraints.

Availability

TSS43U RGG is available at Aetrix Electronics and suitable for USB interface protection, RF bias clamping, low-power sensor conditioning, and IoT battery monitoring requiring stable component supply and consistent green compound compliance.

Supply support for TSS43U RGG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Taiwan Semiconductor Corporation (TSC) is a vertically integrated analog and discrete semiconductor manufacturer headquartered in Hsinchu, Taiwan, serving global industrial, computing, and consumer markets since 1993.

The TSS42U/TSS43U series belongs to TSC's Small Signal Product line, engineered specifically for miniaturized, high-frequency signal path applications demanding low capacitance, low VF, and halogen-free packaging in 0201–0603 footprints.

FAQ

What is the maximum reverse voltage rating for TSS43U RGG?

The TSS43U RGG has a repetitive peak reverse voltage (VRRM) rating of 30 V. This means it can reliably block up to 30 V in the reverse direction under repetitive conditions without breakdown. It also supports a non-repetitive peak forward surge current (IFSM) of 500 mA for 8.3 ms half-sine pulses, but reverse voltage must remain within the 30 V limit to ensure long-term reliability. Exceeding VRRM risks irreversible junction damage.

Does TSS43U RGG have a documented thermal resistance value?

Yes, the TSS43U RGG has a specified junction-to-ambient thermal resistance (RθJA) of 667°C/W at TA = 25°C on a standard glass epoxy PCB. This value reflects its 0603 package's limited heat-spreading capability. For continuous operation, power dissipation should be kept below ~4 mW at room temperature to avoid exceeding the 125°C maximum junction temperature. Derating is required above 25°C ambient, per Figure 4 in the datasheet.

Is TSS43U RGG compatible with lead-free reflow processes?

Yes, the TSS43U RGG features gold-plated terminals qualified per MIL-STD-750, method 2026, and is fully compatible with standard lead-free reflow profiles (peak temperature ≤ 260°C). Its halogen-free green compound and RoHS-compliant construction meet JEDEC J-STD-020 moisture sensitivity level (MSL) 1 requirements - no baking is needed prior to assembly. The 0.003 g mass ensures uniform heating and minimizes tombstoning risk.

How does the forward voltage of TSS43U RGG compare to TSS42U RGG?

The TSS43U RGG specifies VF = 0.45 V at IF = 2 mA, whereas the TSS42U RGG specifies VF = 0.33 V at IF = 10 mA and 0.45 V at IF = 50 mA. At low currents (< 5 mA), the TSS43U RGG delivers lower forward drop than TSS42U RGG - making it preferable for micro-power bias and sensing applications. The difference arises from distinct doping and junction optimization per variant, not package or process variation.

What marking code identifies TSS43U RGG on the device body?

The TSS43U RGG is marked with the code "BE" on its top surface, laser-etched or printed in accordance with industry-standard 0603 visibility requirements. This distinguishes it from the TSS42U RGG, which carries the "BD" marking. Both variants share identical 0603 mechanical dimensions and gold-plated terminations, but differ in electrical characteristics - confirming BE-marked units must be verified as TSS43U RGG for design-critical low-VF applications.