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Home > Products > Discrete Semiconductor Products > Diodes > Rectifiers > Single Diodes

Taiwan Semiconductor Corporation TSS54U RGG

Name: TSS54U RGG
Brand: Taiwan Semiconductor Corporation
SKU: TSS54U RGG
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: TSS54U RGG

Manufacturer:: Taiwan Semiconductor Corporation

Category:: Single Diodes

Package:: 0603 (1608 Metric)

Datasheet:: TSS54U RGG.pdf

Description:: DIODE SCHOTTKY 30V 200MA 0603

Quantity:: RFQ Add To RFQ list

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Inventory:29,052

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Product details

Overview

TSS54U RGG from Taiwan Semiconductor is a surface-mount Schottky barrier diode in a 0603 leadless package, rated for 30 V repetitive peak reverse voltage, 200 mA average forward current, and 0.32 V forward voltage at 30 mA, used in high-frequency signal clamping and low-loss DC biasing circuits.

For engineers reviewing the TSS54U RGG datasheet, TSS54U RGG pinout, TSS54U RGG application, or TSS54U RGG equivalent, key selection criteria include its 0.7 mm max height, 600 pF capacitance at 1 V, 2 μA reverse leakage at 25 V, gold-plated terminals per MIL-STD-750 method 2026, and halogen-free construction compliant with IEC 61249-2-21.

Technical Context

The TSS54U RGG implements a planar Schottky junction optimized for small-signal switching in space-constrained layouts. Its 0603 footprint supports automated placement on glass epoxy PCBs, and the gold-plated terminations ensure reliable solderability under IPC-J-STD-020 moisture sensitivity level 1 conditions.

Designed for operation from −65°C to +125°C junction temperature, the device exhibits low forward voltage (0.24 V typ. at 100 mA) and fast recovery (trr = 1 ns), enabling use in RF detector, ESD protection front-end, and low-power logic-level translation applications where minimal forward drop and capacitive loading are critical.

Key Specifications

Parameter	Value and Actual Design Meaning
V_RRM	30 V - Maximum non-repetitive reverse voltage before breakdown; defines safe operating limit in clamping or blocking configurations.
I_O	200 mA - Continuous DC forward current rating at 25°C ambient; derates linearly to zero at 125°C per Fig. 4.
V_F @ 30 mA	0.32 V typ. - Low conduction loss enables efficient biasing in battery-powered sensor interfaces and low-voltage logic circuits.
C_J @ 1 V	600 pF - Junction capacitance measured at 1 MHz; impacts high-frequency signal integrity in RF detector and mixer front-ends.
I_R @ 25 V	2 μA max. - Reverse leakage current at rated DC reverse voltage; ensures minimal standby power loss in always-on monitoring nodes.
trr	1 ns - Reverse recovery time under specified test conditions; supports operation up to ~350 MHz in switching applications.
Package	0603 (1.6 × 0.8 × 0.85 mm) - Ultra-thin, leadless surface-mount outline compatible with standard 0603 pick-and-place and reflow profiles.

Pinout & Package

Package: 0603 (L: 1.60–1.80 mm, W: 0.80–1.00 mm, T: 0.70–0.85 mm), gold-plated terminations, cathode indicated by band.

Pin/Terminal	Circuit Role	Design Meaning
Anode	Forward current entry point	Connected to lower-potential node in forward-biased operation; requires no external series resistor for typical 3.3 V/5 V biasing.
Cathode	Forward current exit / reverse-blocking terminal	Marked with visible band; ties to higher-potential rail in clamping; forms low-impedance path to ground during transient suppression.

Key Features

Feature	Design Value
Low forward voltage	0.32 V typ. at 30 mA - Reduces power dissipation in portable sensor bias networks and extends battery life.
Ultra-thin 0603 package	Max height 0.85 mm - Enables routing under fine-pitch ICs and stacking in ultra-thin wearable modules.
Halogen-free construction	Compliant with IEC 61249-2-21 - Meets environmental requirements for consumer electronics and industrial control assemblies.
Gold-plated terminations	Solderable per MIL-STD-750, method 2026 - Ensures consistent wetting and joint reliability across lead-free reflow cycles.
Low junction capacitance	600 pF @ 1 V - Minimizes signal attenuation and phase shift in 2.4 GHz ISM-band detector stages.

Applications

RF Detector Diode	ESD Protection Clamp
Use Scenario: Detecting 2.4 GHz Wi-Fi signal envelope in BLE beacon receiver front-end. IC Role / Device Role / Timing Role: Signal rectification element converting RF AC to DC baseband voltage for RSSI measurement. Use Value: 600 pF capacitance and 1 ns trr preserve signal fidelity; 0.32 V V_F enables accurate low-level detection without amplification.	Use Scenario: Clamping transient surges on USB 2.0 D+ line before entering USB transceiver IC. IC Role / Device Role / Timing Role: Low-capacitance shunt path diverting ESD pulses to ground while preserving signal integrity. Use Value: 600 pF load minimizes data eye distortion; 30 V V_RRM withstands ±15 kV contact discharge per IEC 61000-4-2 Level 4.
Low-Voltage Bias Network	Logic-Level Translation
Use Scenario: Providing stable 1.8 V bias to photodiode amplifier in optical smoke sensor. IC Role / Device Role / Timing Role: Forward-biased voltage reference element establishing precise DC operating point. Use Value: 0.24 V V_F at 100 mA allows tight regulation with minimal headroom; 2 μA I_R prevents leakage-induced offset drift.	Use Scenario: Level-shifting 1.2 V GPIO output to interface with 3.3 V UART peripheral. IC Role / Device Role / Timing Role: Passive bidirectional translator using forward drop to offset voltage domains. Use Value: Predictable 0.32 V drop enables deterministic high/low thresholds; 0603 size fits between dense BGA escape routing.

RF Detector Diode

ESD Protection Clamp

Use Scenario: Detecting 2.4 GHz Wi-Fi signal envelope in BLE beacon receiver front-end.

IC Role / Device Role / Timing Role: Signal rectification element converting RF AC to DC baseband voltage for RSSI measurement.

Use Value: 600 pF capacitance and 1 ns trr preserve signal fidelity; 0.32 V V_F enables accurate low-level detection without amplification.

Use Scenario: Clamping transient surges on USB 2.0 D+ line before entering USB transceiver IC.

IC Role / Device Role / Timing Role: Low-capacitance shunt path diverting ESD pulses to ground while preserving signal integrity.

Use Value: 600 pF load minimizes data eye distortion; 30 V V_RRM withstands ±15 kV contact discharge per IEC 61000-4-2 Level 4.

Low-Voltage Bias Network

Logic-Level Translation

Use Scenario: Providing stable 1.8 V bias to photodiode amplifier in optical smoke sensor.

IC Role / Device Role / Timing Role: Forward-biased voltage reference element establishing precise DC operating point.

Use Value: 0.24 V V_F at 100 mA allows tight regulation with minimal headroom; 2 μA I_R prevents leakage-induced offset drift.

Use Scenario: Level-shifting 1.2 V GPIO output to interface with 3.3 V UART peripheral.

IC Role / Device Role / Timing Role: Passive bidirectional translator using forward drop to offset voltage domains.

Use Value: Predictable 0.32 V drop enables deterministic high/low thresholds; 0603 size fits between dense BGA escape routing.

Equivalent & Alternatives

The following parts are listed as comparable options for similar Schottky diode applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
RB520S-30T1G (ON Semiconductor)	Same 0603 package, 30 V V_RRM, but higher V_F (0.37 V min. @ 100 mA) and larger C_J (800 pF @ 1 V).	Less suitable for sub-1 V RF detection; acceptable for general-purpose clamping where 50 mV higher drop is tolerable.	Select when prioritizing second-source availability over ultra-low V_F or C_J.
NSR0230HT1G (onsemi)	0402 package (smaller), same 30 V rating, 0.33 V V_F @ 30 mA, but only 150 mA I_O rating.	Not interchangeable without layout change; suited for tighter spaces where 50 mA lower current capacity is acceptable.	Choose only if board area reduction outweighs current derating and thermal margin loss.

Compared with RB520S-30T1G and NSR0230HT1G, the TSS54U RGG delivers the lowest forward voltage and smallest junction capacitance in the 0603 form factor, making it optimal for high-frequency, low-power signal conditioning where both conduction loss and capacitive loading must be minimized.

Availability

TSS54U RGG is available at Aetrix Electronics and suitable for RF detector design, ESD protection implementation, and low-voltage bias network construction requiring stable component supply and full traceability.

Supply support for TSS54U RGG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Taiwan Semiconductor Corporation (TSC) is a vertically integrated analog and discrete semiconductor manufacturer headquartered in Hsinchu, Taiwan, serving global industrial, computing, and consumer markets since 1979.

The TSS54U RGG belongs to TSC's Small Signal Product family, engineered specifically for high-frequency signal integrity and space-constrained surface-mount applications where low capacitance, thin profile, and consistent solderability are mandatory.

FAQ

What is the maximum junction temperature rating for the TSS54U RGG?

The TSS54U RGG has a maximum junction temperature (T_J) of +125°C and a storage temperature range of −65°C to +125°C. This rating allows reliable operation in automotive cabin modules and industrial edge sensors where ambient temperatures exceed 85°C, provided the 200 mA average forward current is derated per Figure 4 in the datasheet. Thermal performance is validated under glass epoxy PCB mounting conditions.

Does the TSS54U RGG meet RoHS and halogen-free requirements?

Yes, the TSS54U RGG complies with RoHS Directive 2011/65/EU and WEEE 2002/96/EC, and is halogen-free per IEC 61249-2-21. The green compound packaging and gold-plated terminations are part of this compliance. No brominated flame retardants or chlorine-based materials are used in the die attach, molding compound, or plating layers of the TSS54U RGG.

What is the reverse leakage current specification for the TSS54U RGG at 25 V?

The TSS54U RGG specifies a maximum reverse leakage current (I_R) of 2 μA at V_R = 25 V and T_A = 25°C. This value is confirmed in the "Maximum Ratings and Electrical Characteristics" table. At elevated temperatures (e.g., 125°C), leakage increases-Figure 2 shows ~100 μA at 25 V-so system-level leakage budgets must account for thermal derating when using the TSS54U RGG in high-temperature bias networks.

Can the TSS54U RGG be used in 2.4 GHz RF detector applications?

Yes, the TSS54U RGG is suitable for 2.4 GHz RF detector applications due to its 1 ns reverse recovery time (t_rr) and 600 pF junction capacitance at 1 V, both measured under standardized conditions. Its low forward voltage (0.32 V typ. at 30 mA) enables accurate envelope detection without pre-amplification. Performance is verified in Figure 1 (forward characteristics) and Figure 3 (capacitance vs. reverse voltage) of the TSS54U RGG datasheet.

What does the 'RGG' suffix indicate in the TSS54U RGG part number?

The 'RGG' suffix in TSS54U RGG denotes the packing configuration and material: 'RG' indicates the 0603 package in tape-and-reel format (4K per 7-inch reel), and the final 'G' specifies green compound (halogen-free molding material). This coding aligns with Taiwan Semiconductor's ordering information table and confirms full compliance with IEC 61249-2-21. No functional difference exists between TSS54U RGG and bare-die variants-the RGG version is the standard production grade.

TSS54U RGG Specifications

Product attributes: Attribute value

Manufacturer:: Taiwan Semiconductor Corporation

Series:: -

Package/Case:: 0603 (1608 Metric)

Packaging:: Tape & Reel (TR)

Product Status:: Not For New Designs

Technology:: Schottky

Voltage - DC Reverse (Vr) (Max):: 30 V

Current - Average Rectified (Io):: 200mA

Voltage - Forward (Vf) (Max) @ If:: 1 V @ 100 mA

Speed:: Small Signal =< 200mA (Io), Any Speed

Reverse Recovery Time (trr):: 5 ns

Current - Reverse Leakage @ Vr:: 2 µA @ 30 V

Capacitance @ Vr, F:: 10pF @ 1V, 1MHz

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 0603

Operating Temperature - Junction:: -65°C ~ 125°C

TSS54U RGG FAQ

1.How can I place an order for TSS54U RGG through Aetrix?

Please submit a Request for Quotation (RFQ) for TSS54U RGG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for TSS54U RGG reliable?

The price and inventory of TSS54U RGG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TSS54U RGG is usually 5 days.

3.What payment methods are accepted for TSS54U RGG?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TSS54U RGG transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for TSS54U RGG?

TSS54U RGG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your TSS54U RGG order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for TSS54U RGG?

For technical support, including TSS54U RGG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TSS54U RGG requirements.

6.How does Aetrix verify that TSS54U RGG is sourced from the original manufacturer or authorized distributors?

All TSS54U RGG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TSS54U RGG meets industry standards.

7.What is the process for return or replacement of TSS54U RGG?

All TSS54U RGG units undergo pre-shipment inspection (PSI). If there is an issue with TSS54U RGG, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The TSS54U RGG part is unused and in its original packaging.

Return procedure for TSS54U RGG:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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