Taiwan Semiconductor Corporation TSSA3U60

Overview

TSSA3U60 from Taiwan Semiconductor is a 3A, 60V trench Schottky surface-mount rectifier in DO-214AC (SMA) package, featuring VF = 0.54 V max at 3A/25°C, IFSM = 60 A, TJ max = 150°C, and RθJA = 70°C/W - optimized for high-frequency SMPS in AC/DC adapters and LED lighting.

For engineers reviewing the TSSA3U60 datasheet, TSSA3U60 pinout, TSSA3U60 application, or TSSA3U60 equivalent, key selection criteria include forward voltage drop at full load, thermal resistance under PCB-mounted conditions, surge current rating for transient robustness, and RoHS/halogen-free compliance for regulated end equipment.

Technical Context

The TSSA3U60 employs a single-die trench Schottky barrier structure to minimize conduction loss and reverse recovery time (trr ≤ 25 ns), enabling efficient operation in 100–500 kHz switching converters. Its low VF and high IFSM support compact, thermally constrained designs without forced air cooling.

Thermal performance is defined for mounting on a 5 mm × 5 mm Cu pad: RθJL = 27°C/W and RθJC = 20°C/W confirm effective heat transfer to PCB leads and case, while moisture sensitivity level 1 (per J-STD-020) ensures compatibility with standard SMT reflow profiles.

Key Specifications

Pinout & Package

Package: DO-214AC (SMA), surface-mount plastic case with matte tin-plated leads, cathode indicated by band. Weight: 0.060 g.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar Schottky rectifier applications.

Compared with STPS3L60 and MBR360, the TSSA3U60 delivers the lowest VF and best thermal resistance in DO-214AC, making it preferred for space-constrained, high-efficiency 100–300 kHz SMPS where junction temperature control and light-load efficiency are critical.

Availability

TSSA3U60 is available at Aetrix Electronics and suitable for AC/DC adapters, LED drivers, USB-C PD chargers, and industrial 24 V SMPS requiring stable component supply, long-lifecycle assurance, and RoHS-compliant sourcing.

Supply support for TSSA3U60 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Taiwan Semiconductor Corporation (TSC) is a vertically integrated analog and discrete semiconductor manufacturer headquartered in Hsinchu, Taiwan, specializing in power rectifiers, TVS devices, and MOSFETs since 1979.

The TSSA series targets high-efficiency, surface-mount Schottky rectification in compact power supplies - engineered for low VF, fast recovery, and robust thermal performance in cost-sensitive, high-volume applications.

FAQ

What is the maximum junction temperature rating for the TSSA3U60?

The TSSA3U60 has a maximum junction temperature (TJ max) of +150°C, with an operational range from –55°C to +150°C. This rating is validated under absolute maximum conditions and supports reliable operation in industrial environments when mounted per JEDEC-standard PCB layout guidelines. The TSSA3U60 maintains specified electrical parameters within this range, including VF and IR stability up to 125°C junction temperature.

Does the TSSA3U60 have a specified reverse recovery time (trr)?

Yes, the TSSA3U60 specifies trr ≤ 25 ns under test conditions of IF = 0.5 A, IR = 1.0 A, and Irr = 0.25 A. This value reflects its trench Schottky construction, which eliminates minority-carrier storage delay. The TSSA3U60's fast trr reduces switching losses and EMI generation in high-frequency converters, distinguishing it from slower planar Schottky or fast-recovery diodes.

Is the TSSA3U60 compatible with lead-free reflow soldering processes?

Yes, the TSSA3U60 features matte tin-plated leads qualified per J-STD-002 for solderability and is rated MSL Level 1 per J-STD-020, meaning it can be processed using standard Pb-free reflow profiles (peak 260°C) without baking. The device's DO-214AC package and terminal finish ensure consistent wetting and joint integrity on OSP- and ENIG-finished PCBs when using common SAC305 or SN100C pastes.

What does the marking code "3U60" on the TSSA3U60 indicate?

The marking code "3U60" laser-etched on the TSSA3U60 identifies the device as a 3 A, 60 V Schottky rectifier and is the industry-standard top-side identifier per Taiwan Semiconductor's ordering nomenclature. It appears adjacent to the cathode band and is used for visual verification during assembly and field service. The TSSA3U60's full orderable part number remains TSSA3U60 regardless of marking variation.

How does the thermal resistance of the TSSA3U60 compare between junction-to-lead and junction-to-ambient?

The TSSA3U60 specifies RθJL = 27°C/W and RθJA = 70°C/W when mounted on a 5 mm × 5 mm Cu pad per JEDEC test board. This 2.6× difference confirms that heat flows preferentially through the leads into the PCB rather than dissipating directly to ambient air. For thermal design, RθJL governs localized pad temperature rise, while RθJA determines overall system-level temperature rise - both values are essential for accurate junction temperature prediction in the TSSA3U60's final application.