Taiwan Semiconductor Corporation TSSE3U60

Overview

TSSE3U60 from Taiwan Semiconductor is a 60 V, 3 A low-forward-voltage trench Schottky rectifier in SOD-123HE package, designed for high-efficiency DC/DC conversion and SMPS secondary-side rectification with VF = 0.49 V (typ) at 3 A and 25°C. It delivers 80 A surge capability, operates up to 150°C junction temperature, and features moisture sensitivity level 1 per J-STD-020.

For engineers reviewing the TSSE3U60 datasheet, TSSE3U60 pinout, TSSE3U60 application, or TSSE3U60 equivalent, key selection factors include its 60 V VRRM rating, 0.49 V forward voltage at rated current, thermal resistance of 23°C/W (junction-to-lead), SOD-123HE footprint compatibility, and 50 mA reverse leakage at 125°C.

Technical Context

This device implements a single-die trench Schottky architecture optimized for low conduction loss in compact surface-mount power rectification. Its 60 V VRRM rating targets mid-voltage secondary-side applications where higher blocking voltage than 45 V variants is required without sacrificing VF performance.

The SOD-123HE package provides enhanced thermal dissipation over standard SOD-123 via extended leadframe exposure, enabling RθJL = 23°C/W and supporting continuous 3 A operation with appropriate PCB copper area. Reverse leakage remains tightly controlled at ≤50 mA at 125°C under rated VR.

Key Specifications

Pinout & Package

SOD-123HE is a surface-mount plastic package with cathode-indicated band marking, matte tin-plated leads compliant with J-STD-002 solderability, and UL 94V-0 molding compound. Weight: 0.022 g.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar Schottky rectifier applications.

Compared with SS3P6L and SB360, TSSE3U60 offers the lowest VF among 60 V/3 A Schottkys in SOD-123HE, with verified 23°C/W RθJL enabling superior board-level thermal management-critical for high-power-density designs where space and efficiency are co-constrained.

Availability

TSSE3U60 is available at Aetrix Electronics and suitable for switching mode power supplies, laptop adapters, and industrial DC/DC converters requiring stable component supply with tight VF consistency and high-temperature reliability.

Supply support for TSSE3U60 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Taiwan Semiconductor Corporation (TSC) is a vertically integrated analog and discrete semiconductor manufacturer headquartered in Hsinchu, Taiwan, serving global power management and industrial markets since 1979.

The TSSE3Uxx series is part of TSC's low-VF trench Schottky rectifier product line, engineered specifically for high-efficiency, high-reliability secondary-side rectification in space-constrained AC/DC and isolated DC/DC converters.

FAQ

What is the maximum junction temperature rating for TSSE3U60?

The TSSE3U60 has a maximum junction temperature (TJ max) of +150°C, as specified in its absolute maximum ratings table. This rating enables operation in high-ambient environments such as enclosed power supplies or industrial enclosures. Derating curves confirm usable current capacity down to 0 A at 150°C ambient when mounted on standard FR-4 with minimum copper, making TSSE3U60 suitable for thermally demanding deployments where thermal headroom is limited.

Does TSSE3U60 have a defined pinout or polarity marking?

Yes, TSSE3U60 uses standard SOD-123HE polarity: the cathode is marked by a visible band on the package body, and the anode is the unmarked end. The device is a two-terminal unidirectional rectifier-no internal connections beyond anode and cathode. This polarity marking aligns with IPC-7351 standards and ensures correct orientation during automated placement and visual inspection of TSSE3U60 on PCBs.

How does the forward voltage of TSSE3U60 compare at elevated temperature?

At 3 A and 125°C, TSSE3U60 exhibits VF = 0.43 V (typ) and ≤0.52 V (max), representing a reduction from its 25°C value of 0.49 V (typ). This negative temperature coefficient improves thermal stability in parallel configurations and reduces conduction loss under real-world operating conditions. Data confirms VF remains below 0.55 V across full temperature range, distinguishing TSSE3U60 from conventional Schottkys with higher VF drift.

Is TSSE3U60 compliant with RoHS and halogen-free standards?

Yes, TSSE3U60 is RoHS compliant and halogen-free per IEC 61249-2-21. The device uses matte tin-plated leads and UL 94V-0 molding compound, satisfying environmental compliance requirements for CE, UKCA, and other regional directives. These attributes are explicitly stated in the official Taiwan Semiconductor datasheet revision I2103 and verified through TSC's material declarations, ensuring TSSE3U60 meets sustainability and safety mandates for commercial and industrial end equipment.

What is the moisture sensitivity level (MSL) for TSSE3U60 and how does it affect assembly?

TSSE3U60 has a moisture sensitivity level (MSL) of Level 1 per J-STD-020, meaning it may be stored indefinitely at ≤30°C/60% RH without baking prior to surface-mount reflow. This eliminates pre-reflow bake steps, reduces floor life management overhead, and avoids potential damage from moisture-induced popcorning. MSL Level 1 directly supports high-yield, low-cost manufacturing for TSSE3U60 in high-volume consumer and industrial production lines.