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Taiwan Semiconductor Corporation TSSE3U60 RVG
- Part No.:
- TSSE3U60 RVG
- Manufacturer:
- Taiwan Semiconductor Corporation
- Category:
- Single Diodes
- Package:
- SOD-123H
- Datasheet:
-
TSSE3U60 RVG.pdf
- Description:
- DIODE SCHOTTKY 60V 3A SOD123HE
- Quantity:
- Payment:
- Shipping:
Inventory:12,592
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Product details
Overview
TSSE3U60 RVG from Taiwan Semiconductor is a 3A, 60V low forward-voltage trench Schottky rectifier in SOD-123HE package, featuring VF = 0.49 V (typ) at 3A/25°C and 0.43 V (typ) at 3A/125°C, with 80A peak surge capability and 150°C max junction temperature - used in high-efficiency DC-DC converters and AC-DC adapters.
For engineers reviewing the TSSE3U60 RVG datasheet, TSSE3U60 RVG pinout, TSSE3U60 RVG application, or TSSE3U60 RVG equivalent, key selection criteria include reverse voltage rating, thermal resistance (RθJL = 23°C/W), moisture sensitivity level (MSL 1), forward voltage at elevated temperature, and SOD-123HE footprint compatibility.
Technical Context
This single-die Schottky rectifier uses patented trench architecture to achieve stable VF performance across -55°C to +150°C operating range and suppress thermal runaway under high-current transient conditions. Its low RθJA = 70°C/W and RθJL = 23°C/W support compact board layouts without forced airflow.
The device exhibits <1 mA reverse leakage at 60 V and 25°C, rising to ≤50 mA at 125°C - enabling reliable operation in thermally constrained SMPS secondary-side rectification where leakage-induced standby loss must be minimized.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VRRM | 60 V - maximum repetitive reverse blocking voltage; defines usable input/output voltage margin in 48 V bus systems. |
| IF | 3 A continuous - rated average forward current at TL = 75°C; supports sustained 36 W conduction in 12 V output rails. |
| IFSM | 80 A (8.3 ms sine) - surge withstand enables robust startup and fault recovery in unregulated DC-DC stages. |
| VF @ 3A, 25°C | 0.49 V (typ), 0.58 V (max) - directly reduces conduction loss vs. planar Schottkys; improves efficiency by ~0.5% at full load. |
| TJMAX | +150°C - allows operation in sealed enclosures or near heat sources without derating below full current. |
| RθJL | 23°C/W - enables direct thermal coupling to PCB copper; 3A load raises junction temp only ~70°C above lead temp. |
| MSL Level | Level 1 (per J-STD-020) - zero bake requirement before reflow; compatible with standard SMT assembly lines. |
Pinout & Package
Package: SOD-123HE - surface-mount plastic case with matte tin-plated leads, UL 94V-0 molding compound, cathode band polarity marking, and 0.022 g mass.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Anode | Forward current entry node | Connected to lower-potential side (e.g., transformer secondary center-tap or buck converter switch node). |
| Cathode | Forward current exit node | Connected to output rail; cathode band marks this terminal for automated optical inspection and placement verification. |
Key Features
| Feature | Design Value |
|---|---|
| Trench Schottky technology | Enables 0.43 V VF at 3A/125°C - maintains low conduction loss in high-ambient industrial power supplies. |
| High-temperature IR stability | ≤50 mA reverse leakage at 60 V/125°C - prevents excessive standby power in always-on adapter designs. |
| J-STD-002 solderability | Matte tin-plated leads ensure consistent wetting during reflow, eliminating voiding risk in fine-pitch SOD-123HE pads. |
| JESD 201 Class 2 whisker resistance | Prevents tin whisker growth over 10+ year field life - critical for telecom and industrial control applications. |
| Halogen-free (IEC 61249-2-21) | Meets RoHS and ELV requirements without compromising thermal or electrical performance. |
Applications
| Server PSU Secondary Rectification | USB-C PD Adapter Output Stage |
|---|---|
Use Scenario: 12 V/3 A output rectification in 80 PLUS Titanium server PSUs with tight thermal constraints. IC Role / Device Role / Timing Role: Primary synchronous rectifier replacement; conducts during low-side MOSFET on-time. Use Value: 0.43 V VF at 125°C reduces conduction loss by 0.36 W vs. legacy 0.55 V Schottky, lowering heatsink size by 25%. |
Use Scenario: 20 V output rectification in compact 65 W USB-C PD adapters with no-fan cooling. IC Role / Device Role / Timing Role: Uncontrolled freewheeling diode in flyback secondary; handles 3 A continuous plus 80 A surge during short-circuit events. Use Value: MSL 1 rating eliminates pre-bake step; SOD-123HE footprint fits <8 mm² board area while sustaining 150°C junction temp. |
| Industrial DC-DC Converter Input Protection | Automotive Infotainment Power Rail Clamp |
Use Scenario: Reverse-polarity protection and OR-ing function in 24 V/3 A isolated DC-DC modules for PLC I/O cards. IC Role / Device Role / Timing Role: Low-loss series rectifier blocking reverse current during hot-swap insertion. Use Value: 23°C/W RθJL allows direct thermal path to copper pour - keeps TJ <125°C at full load without thermal vias. |
Use Scenario: Load-dump transient clamping and reverse-battery protection in 12 V infotainment head units. IC Role / Device Role / Timing Role: Freewheeling path for inductive loads (e.g., display backlight drivers); absorbs 80 A surge per ISO 7637-2 Pulse 5a. Use Value: 80 A IFSM withstands automotive load-dump spikes without degradation; halogen-free construction meets OEM material specs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar Schottky rectifier applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Vishay VS-3EY60-M3/5BT | Same 60 V VRRM, 3 A IF, but VF = 0.55 V (max) at 3A/25°C; RθJA = 90°C/W. | Higher conduction loss and poorer thermal dissipation limit use in >70°C ambient environments. | Select when cost priority outweighs efficiency and thermal margin; verify layout cooling for same power density. |
| ON Semiconductor SB360 | 60 V VRRM, 3 A IF, but VF = 0.72 V (max) at 3A/25°C; SOD-123 package (not HE variant). | Higher VF increases loss by ~1.1 W at full load; standard SOD-123 has higher RθJA and no MSL 1 rating. | Acceptable only in low-temperature, non-automated assembly contexts where efficiency loss is tolerable. |
Compared with VS-3EY60-M3/5BT and SB360, TSSE3U60 RVG delivers 12–28% lower conduction loss at operating temperature, superior thermal coupling via SOD-123HE, and guaranteed MSL 1 compliance - making it preferred for high-density, thermally constrained, or high-reliability production.
Availability
TSSE3U60 RVG is available at Aetrix Electronics and suitable for switching mode power supplies, USB-C PD adapters, and industrial DC-DC converters requiring stable component supply, long-term lifecycle assurance, and J-STD-020-compliant assembly readiness.
Supply support for TSSE3U60 RVG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Taiwan Semiconductor Corporation (TSC) is a vertically integrated analog and discrete semiconductor manufacturer headquartered in Hsinchu, Taiwan, serving global power management and industrial markets since 1979.
The TSSE3Uxx series targets high-efficiency, surface-mount Schottky rectification in space-constrained power supplies - engineered specifically for low VF stability across temperature and robust surge handling in commercial and industrial applications.
FAQ
What is the maximum junction temperature rating for TSSE3U60 RVG?
The TSSE3U60 RVG has a maximum junction temperature (TJMAX) of +150°C, verified per absolute maximum ratings table. This allows uninterrupted 3 A operation in environments up to 75°C ambient when mounted on ≥1 cm² 2-oz copper with minimal thermal resistance. The TSSE3U60 RVG maintains specified VF and leakage performance within this range.
Does TSSE3U60 RVG have a halogen-free construction?
Yes, TSSE3U60 RVG complies with IEC 61249-2-21 for halogen-free materials and is RoHS compliant. The molding compound contains no brominated flame retardants or chlorine-based additives, confirmed in TSC's material declaration report Rev. I2103. This ensures compatibility with strict environmental requirements in EU and automotive supply chains.
What is the marking code printed on the TSSE3U60 RVG device body?
The TSSE3U60 RVG is marked with "E3U60" on its top surface, per the ordering information table. This distinguishes it from the TSSE3U45 variant (marked "E3U45") and confirms its 60 V VRRM rating. The marking is laser-etched and visible under 20× magnification for automated optical inspection.
Is TSSE3U60 RVG suitable for reflow soldering without pre-baking?
Yes, TSSE3U60 RVG is rated MSL Level 1 per J-STD-020, meaning it may be stored indefinitely at ≤30°C/60% RH and placed directly into standard Pb-free reflow profiles (peak 260°C) without baking. This eliminates process steps and moisture-related defects - a key advantage over MSL 3+ discretes in high-mix SMT lines.
How does the forward voltage of TSSE3U60 RVG compare at 125°C versus 25°C?
At 3 A, TSSE3U60 RVG's typical forward voltage drops from 0.49 V at 25°C to 0.43 V at 125°C - a 12% reduction due to negative temperature coefficient of Schottky barrier height. This behavior is documented in the Electrical Specifications table and improves thermal stability in high-ambient applications like enclosed adapters.
TSSE3U60 RVG Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Taiwan Semiconductor Corporation
- Series:
- -
- Package/Case:
- SOD-123H
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Technology:
- Schottky
- Voltage - DC Reverse (Vr) (Max):
- 60 V
- Current - Average Rectified (Io):
- 3A
- Voltage - Forward (Vf) (Max) @ If:
- 580 mV @ 3 A
- Speed:
- Fast Recovery =< 500ns, > 200mA (Io)
- Reverse Recovery Time (trr):
- -
- Current - Reverse Leakage @ Vr:
- 1 mA @ 60 V
- Capacitance @ Vr, F:
- -
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- SOD-123HE
- Operating Temperature - Junction:
- -55°C ~ 150°C
TSSE3U60 RVG FAQ
1.How can I place an order for TSSE3U60 RVG through Aetrix?
Please submit a Request for Quotation (RFQ) for TSSE3U60 RVG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TSSE3U60 RVG reliable?
The price and inventory of TSSE3U60 RVG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TSSE3U60 RVG is usually 5 days.
3.What payment methods are accepted for TSSE3U60 RVG?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TSSE3U60 RVG transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TSSE3U60 RVG?
TSSE3U60 RVG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TSSE3U60 RVG order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TSSE3U60 RVG?
For technical support, including TSSE3U60 RVG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TSSE3U60 RVG requirements.
6.How does Aetrix verify that TSSE3U60 RVG is sourced from the original manufacturer or authorized distributors?
All TSSE3U60 RVG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TSSE3U60 RVG meets industry standards.
7.What is the process for return or replacement of TSSE3U60 RVG?
All TSSE3U60 RVG units undergo pre-shipment inspection (PSI). If there is an issue with TSSE3U60 RVG, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TSSE3U60 RVG part is unused and in its original packaging.
Return procedure for TSSE3U60 RVG:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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