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Taiwan Semiconductor Corporation TSSW3U60
- Part No.:
- TSSW3U60
- Manufacturer:
- Taiwan Semiconductor Corporation
- Category:
- Single Diodes
- Package:
- SOD-123W
- Datasheet:
-
TSSW3U60.pdf
- Description:
- DIODE SCHOTTKY 60V 3A SOD123W
- Quantity:
- Payment:
- Shipping:
Inventory:27,851
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Product details
Overview
TSSW3U60 from Taiwan Semiconductor is a 3A, 60V low forward-voltage trench Schottky rectifier in SOD-123W package, featuring VF = 0.49 V (typ) / 0.58 V (max) at 3A and 25°C, IFSM = 50 A, TJ(max) = 150°C, and RθJA = 75°C/W - deployed in high-efficiency DC/DC converters where thermal performance and conduction loss reduction are critical.
For engineers reviewing the TSSW3U60 datasheet, TSSW3U60 pinout, TSSW3U60 application, or TSSW3U60 equivalent, key selection considerations include its 60V VRRM rating, low VF across temperature, SOD-123W footprint compatibility, moisture sensitivity level 1 handling, and junction-to-ambient thermal resistance for board-level thermal design validation.
Technical Context
The TSSW3U60 uses patented trench Schottky technology to achieve stable forward voltage characteristics up to 125°C, with VF = 0.43 V (typ) at 3A and 125°C. Its single-die configuration and SOD-123W package support compact high-density layouts while maintaining 50A non-repetitive surge capability.
Thermal performance is defined by RθJL = 20°C/W and RθJA = 75°C/W, enabling reliable operation in ambient temperatures up to 125°C when mounted on standard FR-4 PCBs with recommended pad layout. Reverse leakage remains ≤50 mA at 125°C and rated VR.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VRRM | 60 V - maximum repetitive reverse blocking voltage; defines upper limit of DC bus or flyback clamp voltage it can safely withstand |
| IF | 3 A continuous - average forward current rating at TA = 25°C; derates linearly above 25°C per published curve |
| VF @ 3A, 25°C | 0.49 V (typ), 0.58 V (max) - directly determines conduction loss (Pcond ≈ IF × VF) in power stage efficiency calculations |
| IFSM | 50 A - peak non-repetitive surge current capability for startup or transient overload protection in SMPS input stages |
| TJ(max) | +150°C - maximum allowable junction temperature; sets thermal design margin for heatsinking and layout |
| RθJA | 75°C/W - junction-to-ambient thermal resistance on standard PCB; used to calculate ΔTJ = Pdiss × RθJA for thermal validation |
| MSL | Level 1 (per J-STD-020) - no floor life limitation; supports standard SMT reflow without dry-pack or baking requirements |
Pinout & Package
Package: SOD-123W - surface-mount plastic case with matte tin-plated leads, UL 94V-0 molding compound, cathode band polarity marking, and 0.016 g weight.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Anode | Forward current entry point | Connected to lower-potential node (e.g., ground or return path); requires low-impedance trace for surge current paths |
| Cathode | Forward current exit / reverse voltage blocking terminal | Marked by band; connects to higher-potential node (e.g., output rail or switching node); must withstand full VRRM |
Key Features
| Feature | Design Value |
|---|---|
| Trench Schottky architecture | Enables lower VF vs planar Schottkys - reduces conduction loss by ~15–20% at 3A compared to legacy 60V devices |
| High-temperature VF stability | VF increases only ~0.09 V from 25°C to 125°C at 3A - maintains efficiency in thermally constrained enclosures |
| Junction-to-lead thermal resistance | RθJL = 20°C/W - allows direct thermal coupling to copper pour or thermal pad for localized heat extraction |
| Moisture sensitivity level | MSL 1 - eliminates production delays from moisture-related popcorning during reflow |
| Halogen-free construction | Complies with IEC 61249-2-21 - meets environmental compliance requirements for industrial and consumer end equipment |
Applications
| Server Power Supplies | USB-C PD Adapters |
|---|---|
Use Scenario: Secondary-side synchronous rectification in 100–200W server PSUs operating at 100 kHz–1 MHz switching frequencies. IC Role / Device Role / Timing Role: Low-VF Schottky rectifier replacing MOSFET-based SR controllers to simplify layout and reduce gate drive complexity. Use Value: 0.49 V VF at 3A lowers conduction loss by ~0.15 W vs comparable 60V Schottkys, improving full-load efficiency by 0.3–0.5%. | Use Scenario: Output rectification in compact 65W USB-C PD adapters with tight thermal envelopes and >94% efficiency targets. IC Role / Device Role / Timing Role: Primary-output freewheeling diode in flyback topology, handling continuous 3A DC output current. Use Value: MSL 1 rating enables direct placement into high-volume SMT lines without dry-pack logistics; SOD-123W footprint fits <8 mm² board area. |
| Industrial DC/DC Modules | Automotive Infotainment Power Rails |
Use Scenario: Input-stage OR-ing diode in 24V industrial DC/DC modules requiring reverse polarity protection and hot-swap capability. IC Role / Device Role / Timing Role: Unidirectional current path selector with low forward drop to minimize voltage sag during load transients. Use Value: 50A IFSM sustains 100 ms inrush surges from large bulk capacitors; TJ(max) = 150°C supports operation in sealed enclosures up to 85°C ambient. | Use Scenario: 12V-to-5V buck converter output rectification in automotive infotainment head units exposed to under-hood thermal cycling. IC Role / Device Role / Timing Role: High-reliability Schottky rectifier operating continuously at 85°C ambient with 125°C junction temperature margin. Use Value: VF drift <0.1 V from 25°C to 125°C ensures stable output regulation across temperature; RoHS + halogen-free meets automotive material declarations. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar Schottky rectifier applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Vishay VS-3EYH06-M3/54 | Same SOD-123W package, 3A/60V, VF = 0.52 V (max) @ 3A, 25°C; RθJA = 80°C/W | Slightly higher VF and thermal resistance - yields ~0.05 W higher dissipation at 3A | Preferred where Vishay supply chain alignment or qualification history is required |
| ON Semiconductor SB360 | SOD-123 package (not SOD-123W), 3A/60V, VF = 0.72 V (max) @ 3A, 25°C; RθJA = 90°C/W | Higher VF and thermal resistance; smaller body size may impact solder joint reliability under thermal cycling | Acceptable for cost-sensitive, lower-efficiency designs where footprint tolerance allows SOD-123 |
Compared with VS-3EYH06-M3/54 and SB360, the TSSW3U60 delivers the lowest VF (0.49 V typ) and best thermal resistance (RθJA = 75°C/W) in SOD-123W, making it optimal for space-constrained, high-efficiency DC/DC and adapter designs where conduction loss and thermal headroom are limiting factors.
Availability
TSSW3U60 is available at Aetrix Electronics and suitable for switching mode power supplies, USB-C PD adapters, and industrial DC/DC converters requiring stable component supply, consistent parametric performance, and long-term manufacturing continuity.
Supply support for TSSW3U60 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Taiwan Semiconductor Corporation (TSC) is a vertically integrated analog and discrete semiconductor manufacturer headquartered in Hsinchu, Taiwan, specializing in power rectifiers, TVS diodes, and MOSFETs for industrial and computing applications.
The TSSW series was designed specifically for high-efficiency, high-reliability surface-mount rectification in compact AC/DC and DC/DC power stages - emphasizing low VF, robust surge capability, and MSL 1 manufacturability.
FAQ
What is the maximum junction temperature rating for the TSSW3U60?
The TSSW3U60 has a maximum junction temperature (TJ(max)) of +150°C, verified per absolute maximum ratings table in the official Taiwan Semiconductor datasheet revision B2103. This rating enables operation in sealed or high-ambient environments when combined with appropriate PCB copper area and airflow. Thermal design must ensure actual TJ stays below 150°C under worst-case load and ambient conditions. The TSSW3U60 achieves this with RθJA = 75°C/W on standard FR-4.
Does the TSSW3U60 have a specified forward voltage at elevated temperature?
Yes, the TSSW3U60 specifies VF = 0.43 V (typ) and 0.52 V (max) at IF = 3A and TJ = 125°C, per the Electrical Specifications table in the Taiwan Semiconductor datasheet. This data confirms stable low-VF performance across automotive and industrial temperature ranges, supporting designs where efficiency must be maintained at high ambient temperatures. The VF increase from 25°C to 125°C is only ~0.09 V (typ), demonstrating strong thermal stability.
Is the TSSW3U60 compatible with lead-free reflow processes?
Yes, the TSSW3U60 features matte tin-plated leads compliant with J-STD-002 solderability requirements and is qualified for standard lead-free reflow profiles (peak temperature up to 260°C). Its moisture sensitivity level is rated MSL 1 per J-STD-020, meaning it can be stored indefinitely at ≤30°C/60% RH and placed directly into reflow without baking. No special handling or dry-pack is required prior to assembly.
What is the marking code printed on the TSSW3U60 device body?
The TSSW3U60 is marked with "W3U60" on its top surface, as confirmed in the Absolute Maximum Ratings table of the Taiwan Semiconductor datasheet. This marking distinguishes it from the 45V variant (W3U45) and aligns with the ordering code convention where "x" in TSSW3Ux denotes the VRRM rating. The cathode band indicates polarity and is positioned adjacent to the marking.
How does the SOD-123W package of the TSSW3U60 differ from standard SOD-123?
The SOD-123W package used by the TSSW3U60 features a wider body and extended lead frame compared to standard SOD-123, resulting in lower thermal resistance (RθJA = 75°C/W vs ~90°C/W for SOD-123) and higher surge current capability. Mechanical drawings confirm larger pad land patterns and improved copper exposure for enhanced heat dissipation. This makes the SOD-123W more suitable for 3A continuous operation in thermally demanding applications than standard SOD-123 variants like the SB360.
TSSW3U60 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Taiwan Semiconductor Corporation
- Series:
- -
- Package/Case:
- SOD-123W
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Technology:
- Schottky
- Voltage - DC Reverse (Vr) (Max):
- 60 V
- Current - Average Rectified (Io):
- 3A
- Voltage - Forward (Vf) (Max) @ If:
- 580 mV @ 3 A
- Speed:
- Fast Recovery =< 500ns, > 200mA (Io)
- Reverse Recovery Time (trr):
- -
- Current - Reverse Leakage @ Vr:
- 1 mA @ 60 V
- Capacitance @ Vr, F:
- -
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- SOD-123W
- Operating Temperature - Junction:
- -55°C ~ 150°C
TSSW3U60 FAQ
1.How can I place an order for TSSW3U60 through Aetrix?
Please submit a Request for Quotation (RFQ) for TSSW3U60 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TSSW3U60 reliable?
The price and inventory of TSSW3U60 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TSSW3U60 is usually 5 days.
3.What payment methods are accepted for TSSW3U60?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TSSW3U60 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TSSW3U60?
TSSW3U60 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TSSW3U60 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TSSW3U60?
For technical support, including TSSW3U60 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TSSW3U60 requirements.
6.How does Aetrix verify that TSSW3U60 is sourced from the original manufacturer or authorized distributors?
All TSSW3U60 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TSSW3U60 meets industry standards.
7.What is the process for return or replacement of TSSW3U60?
All TSSW3U60 units undergo pre-shipment inspection (PSI). If there is an issue with TSSW3U60, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TSSW3U60 part is unused and in its original packaging.
Return procedure for TSSW3U60:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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