My Inquiry
My Account
Taiwan Semiconductor Corporation TST30H60C
- Part No.:
- TST30H60C
- Manufacturer:
- Taiwan Semiconductor Corporation
- Category:
- Diode Arrays
- Package:
- TO-220-3
- Datasheet:
-
TST30H60C.pdf
- Description:
- DIODE ARR SCHOTT 60V 15A TO220AB
- Quantity:
- Payment:
- Shipping:
Inventory:4,340
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
TST30H60C from Taiwan Semiconductor is a dual common-cathode trench Schottky rectifier rated for 30 A total forward current (15 A per diode), 60 V repetitive peak reverse voltage, and 150 °C maximum junction temperature, delivering low forward voltage (0.56 V at 15 A, 25 °C) and high surge capability (250 A, 8.3 ms) in SMPS and DC/DC converter applications.
For engineers reviewing the TST30H60C datasheet, TST30H60C pinout, TST30H60C application, or TST30H60C equivalent, key selection criteria include thermal resistance (RθJC = 2.0 °C/W per diode), junction capacitance (1158 pF at 4 V), and RoHS/halogen-free compliance for industrial power designs requiring high efficiency and reliability under elevated temperature stress.
Technical Context
The TST30H60C integrates two independent Schottky die in a single TO-220AB package with shared cathode terminal, enabling synchronous rectification or dual-output DC/DC topologies. Its trench-based structure ensures stable VF across -55 to +150 °C and low IR (≤55 µA at 25 °C, ≤55 mA at 125 °C).
Thermal performance is specified with mounting on a 2" × 3" × 0.25" aluminum heatsink: RθJL = 2.1 °C/W and RθJA = 10.7 °C/W per diode. The device supports high-reliability soldering per J-STD-002 and passes JESD201 Class 2 whisker testing.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Forward Current (IF) | 30 A total (15 A per diode); supports dual-channel 15 A loads without parallel devices |
| Peak Reverse Voltage (VRRM) | 60 V; suitable for 48 V bus systems with 20 % safety margin |
| Surge Current (IFSM) | 250 A (8.3 ms); withstands inrush in offline SMPS and hot-swap DC/DC stages |
| Forward Voltage (VF) | 0.56 V @ 15 A, 25 °C; reduces conduction loss vs. planar Schottky alternatives |
| Junction Temp Range (TJ) | -55 to +150 °C; enables operation in sealed industrial enclosures without derating below 125 °C |
| Junction-to-Case Rθ (RθJC) | 2.0 °C/W per diode; allows direct heatsink mounting with minimal thermal interface resistance |
| Junction Capacitance (CJ) | 1158 pF @ 1 MHz, 4 V; impacts EMI filtering design in high-frequency converters |
Pinout & Package
Package: TO-220AB - three-terminal, through-hole, insulated backside, matte tin-plated leads compliant with J-STD-002 solderability and UL 94V-0 molding compound.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Anode 1 (A1) | First diode anode | Independent input path for first channel; requires separate trace routing |
| Anode 2 (A2) | Second diode anode | Enables dual-output or interleaved rectification without external isolation |
| Cathode (K) | Common cathode node | Shared output return; must be thermally and electrically robust for combined 30 A return path |
Key Features
| Feature | Design Value |
|---|---|
| Trench Schottky technology | Reduces VF drift over temperature and improves long-term stability vs. planar structures |
| High-temperature IR performance | IR ≤ 55 mA @ 125 °C enables reliable operation in unventilated power modules |
| Low RθJC (2.0 °C/W) | Permits compact heatsink design with <10 K rise at full 15 A per diode |
| RoHS & halogen-free compliance | Fulfills IEC 61249-2-21 and environmental requirements for global industrial shipments |
| 250 A surge rating | Eliminates need for external TVS or NTC inrush limiting for typical 48 V DC/DC inputs |
Applications
| Server PSU Rectification | Industrial LED Driver |
|---|---|
Use Scenario: High-density 48 V input rectification in 1U server PSUs with forced-air cooling. IC Role / Device Role / Timing Role: Dual-channel output rectifier replacing two discrete 15 A Schottkys to reduce footprint and thermal asymmetry. Use Value: 0.56 V VF at 15 A lowers conduction loss by ~12 % versus legacy planar parts, improving 80 PLUS Titanium efficiency at 50 % load. | Use Scenario: Constant-current LED string supply in outdoor signage with wide ambient temperature range (-40 to +85 °C). IC Role / Device Role / Timing Role: Secondary-side synchronous rectifier in flyback topology, leveraging low VF and stable IR up to 125 °C junction. Use Value: Maintains <0.64 V VF at 15 A and 125 °C, minimizing thermal runaway risk in sealed enclosures. |
| Automotive On-board Charger | Telecom DC/DC Module |
Use Scenario: 48 V–12 V bidirectional DC/DC stage in mild-hybrid vehicle on-board chargers. IC Role / Device Role / Timing Role: Common-cathode dual rectifier supporting asymmetric forward/reverse power flow during regenerative braking. Use Value: 250 A IFSM handles transient surges from motor back-EMF without derating; TJ max = 150 °C meets AEC-Q101 stress margins. | Use Scenario: Input rectification in 48 V telecom brick modules operating at 300 kHz switching frequency. IC Role / Device Role / Timing Role: Low-CJ (1158 pF) rectifier minimizing switching node ringing and EMI filter size. Use Value: CJ specification enables smaller snubber networks and reduced conducted emissions in EN 55032 Class B compliance testing. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual Schottky rectifier applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Vishay VS-30CPH06-M3 | Same TO-220AB package, 60 V VRRM, but 30 A total IF with higher VF (0.65 V @ 15 A, 25 °C) | Higher conduction loss limits use in high-efficiency >94 % SMPS | Select TST30H60C when VF-limited thermal budget or 80 PLUS Titanium compliance is required |
| ON Semiconductor MBR30H60CT | Identical pinout and ratings, but uses planar Schottky; higher IR (100 mA @ 125 °C) and VF drift | Less stable under sustained high-temp operation; may require larger heatsink | Choose TST30H60C for extended life in sealed, high-ambient environments |
Compared with VS-30CPH06-M3 and MBR30H60CT, the TST30H60C delivers lower VF and superior high-temperature IR stability due to trench architecture-critical for thermally constrained, high-reliability power conversion where junction temperature routinely exceeds 125 °C.
Availability
TST30H60C is available at Aetrix Electronics and suitable for switching mode power supplies, on-board DC/DC converters, and lighting applications requiring stable component supply, consistent thermal performance, and RoHS-compliant manufacturing.
Supply support for TST30H60C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Taiwan Semiconductor Corporation (TSC) is a vertically integrated analog and power discrete manufacturer headquartered in Hsinchu, Taiwan, serving industrial, computing, and automotive markets since 1979.
The TST30H60C belongs to TSC's high-current trench Schottky rectifier product line, engineered specifically for high-efficiency, high-temperature power conversion in space-constrained 48 V and PoE-powered systems.
FAQ
What is the maximum continuous forward current rating for the TST30H60C?
The TST30H60C is rated for 30 A total average forward current, with 15 A per diode. This rating assumes proper heatsinking per the datasheet condition: mounting on a 2" × 3" × 0.25" aluminum plate. Derating is required above 25 °C ambient, as shown in Figure 1 of the TST30H60C datasheet. Operation beyond 15 A per diode without adequate thermal management risks exceeding the 150 °C maximum junction temperature.
Does the TST30H60C support surface-mount assembly?
No, the TST30H60C uses a TO-220AB package with through-hole leads and is not designed for surface-mount reflow. Its matte tin-plated leads are optimized for wave soldering or hand-soldering per J-STD-002. The device requires mechanical mounting via the tab (cathode) to a heatsink, and its weight (1.93 g) and torque limit (0.56 N·m) are specified for screw-down installation-not SMT placement.
How does the TST30H60C's junction capacitance affect EMI in high-frequency converters?
The TST30H60C exhibits 1158 pF junction capacitance per diode at 4 V reverse bias and 1 MHz. In 300–500 kHz DC/DC converters, this value influences switching node ringing amplitude and dv/dt-induced EMI. Lower CJ reduces capacitive coupling into ground planes, easing EN 55032 Class B compliance. Designers should verify snubber sizing using this measured CJ-not generic Schottky averages-to avoid overdesign.
Is the TST30H60C suitable for automotive applications?
The TST30H60C meets key automotive-environment requirements-including -55 to +150 °C junction range, JESD201 Class 2 whisker resistance, and RoHS/halogen-free compliance-but is not AEC-Q101 qualified. It has been deployed in non-safety-critical automotive subsystems like infotainment power supplies and body control modules. For ASIL-B or higher systems, formal qualification evidence must be obtained directly from Taiwan Semiconductor.
What is the marking code and date code format for the TST30H60C?
The TST30H60C is marked with "TST30H60C" as the part number, "G" indicating green molding compound, a factory code "F", and a date code "YWW" (e.g., "2422" = 2024, week 22). These markings appear on the top surface of the TO-220AB package per the official outline drawing in Revision C2012 of the TST30H60C datasheet. No additional logos or secondary identifiers are present.
TST30H60C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Taiwan Semiconductor Corporation
- Series:
- -
- Package/Case:
- TO-220-3
- Packaging:
- Tube
- Product Status:
- Active
- Diode Configuration:
- 1 Pair Common Cathode
- Technology:
- Schottky
- Voltage - DC Reverse (Vr) (Max):
- 60 V
- Current - Average Rectified (Io) (per Diode):
- 15A
- Voltage - Forward (Vf) (Max) @ If:
- 700 mV @ 15 A
- Speed:
- Fast Recovery =< 500ns, > 200mA (Io)
- Reverse Recovery Time (trr):
- -
- Current - Reverse Leakage @ Vr:
- 55 µA @ 60 V
- Operating Temperature - Junction:
- -55°C ~ 150°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Through Hole
- Supplier Device Package:
- TO-220AB
TST30H60C FAQ
1.How can I place an order for TST30H60C through Aetrix?
Please submit a Request for Quotation (RFQ) for TST30H60C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TST30H60C reliable?
The price and inventory of TST30H60C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TST30H60C is usually 5 days.
3.What payment methods are accepted for TST30H60C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TST30H60C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TST30H60C?
TST30H60C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TST30H60C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TST30H60C?
For technical support, including TST30H60C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TST30H60C requirements.
6.How does Aetrix verify that TST30H60C is sourced from the original manufacturer or authorized distributors?
All TST30H60C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TST30H60C meets industry standards.
7.What is the process for return or replacement of TST30H60C?
All TST30H60C units undergo pre-shipment inspection (PSI). If there is an issue with TST30H60C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TST30H60C part is unused and in its original packaging.
Return procedure for TST30H60C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
TST30H60C Tags
-
BAV99-7-F
Diodes Incorporated
-
BAT54C-7-F
Diodes Incorporated
-
BAV99,215
Nexperia USA Inc.
-
BAT54SLT1G
onsemi
-
BAV70LT1G
onsemi
-
BAT54CLT1G
onsemi
-
BAT54S-7-F
Diodes Incorporated
-
BAV99LT1G
onsemi
-
BAT54S,215
Nexperia USA Inc.
-
BAS40-04LT1G
onsemi
-
MMBD1503-TP
Micro Commercial Co
-
BAV99WT1G
onsemi
Tech Hub
Schmitt triggers use separate rising and falling thresholds to stabilize slow or noisy signals. This guide covers hysteresis, 74HC14 and 74HCT14 selection, comparator calculations, RC oscillators and p…
Counterfeit components can hide behind convincing markings and passing basic function tests. This engineering reference covers source traceability, external inspection, X-ray, XRF, electrical testing, …
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
