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Taiwan Semiconductor Corporation TST30U60C
- Part No.:
- TST30U60C
- Manufacturer:
- Taiwan Semiconductor Corporation
- Category:
- Single Diodes
- Package:
- TO-220-3
- Datasheet:
-
TST30U60C.pdf
- Description:
- DIODE SCHOTTKY 60V 15A TO220AB
- Quantity:
- Payment:
- Shipping:
Inventory:3,035
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Product details
Overview
TST30U60C from Taiwan Semiconductor is a 30A, 60V trench Schottky rectifier in TO-220AB package, featuring 0.48V typical forward voltage at 15A/25°C and 0.43V at 15A/125°C, with 250A surge capability and 4°C/W junction-to-case thermal resistance - deployed in high-efficiency SMPS output stages.
For engineers reviewing the TST30U60C datasheet, TST30U60C pinout, TST30U60C application, or TST30U60C equivalent, key selection criteria include VF vs. temperature stability, VRRM margin for 48V bus designs, thermal derating above 100°C, and dual-die configuration for parallel conduction paths.
Technical Context
This device uses patented trench Schottky technology to achieve low VF while maintaining high-temperature reverse leakage control (≤60mA at 125°C) and robust dv/dt immunity (10,000 V/μs). Its dual-die construction enables symmetrical current sharing and supports high-reliability DC–DC converter outputs where thermal cycling and surge resilience are critical.
The TO-220AB package provides direct heatsink mounting with 0.56 N·m max torque and UL 94V-0 molding compound. Matte tin-plated leads ensure J-STD-002 solderability, and the device meets JESD 201 Class 2 whisker resistance.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VRRM | 60 V - Maximum non-repetitive reverse blocking voltage; sets safe operating margin for 48V nominal systems with transient spikes. |
| IF | 30 A - Continuous average forward current at case temperature ≤75°C; defines steady-state power stage rating. |
| VF (TJ=25°C) | 0.48 V typ @ 15A - Directly reduces conduction loss in high-current output rectification; lowers heat sink requirements. |
| VF (TJ=125°C) | 0.43 V typ @ 15A - Improves efficiency retention under thermal stress, enabling stable operation in compact enclosures. |
| IFSM | 250 A - Peak non-repetitive surge current (8.3ms half-sine); withstands inrush and fault transients without failure. |
| RθJC | 4 °C/W - Enables precise thermal design: ΔT = 4 × Ploss; supports >20W dissipation with modest heatsinking. |
| IR (TJ=125°C) | 60 mA max - Reverse leakage at elevated temperature; impacts standby power and thermal runaway risk in parallel configurations. |
Pinout & Package
TO-220AB package with center-tab cathode configuration; matte tin-plated leads; polarity marked on device body; 1.88g mass; UL 94V-0 compliant molding compound.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Anode (Lead 1) | Input current entry point | Connected to transformer secondary or switching node; carries full load current with minimal resistive drop. |
| Cathode (Tab) | Output current exit point / thermal path | Electrically and thermally tied to heatsink; requires insulating washer if heatsink is grounded. |
| Anode (Lead 2) | Second anode terminal | Enables dual-die parallel connection; improves current handling and thermal distribution vs. single-die devices. |
Key Features
| Feature | Design Value |
|---|---|
| Trench Schottky architecture | Enables lower VF than planar Schottky counterparts while retaining high-temperature IR stability. |
| High dv/dt rating (10,000 V/μs) | Prevents false turn-on during fast-switching transitions in synchronous rectifier or LLC resonant topologies. |
| Junction temperature range (−55°C to +150°C) | Supports operation in automotive under-hood or industrial ambient environments without derating below −40°C. |
| Dual-die configuration | Provides inherent current balancing and redundancy; reduces localized heating versus single-die 30A equivalents. |
Applications
| Server Power Supply Output Rectification | Industrial 48V DC–DC Converter |
|---|---|
Use Scenario: High-density 1U server PSU delivering 12V/200A output using multiphase buck topology with synchronous rectification. IC Role / Device Role / Timing Role: Primary output freewheeling rectifier replacing MOSFETs in cost-sensitive designs where gate drive complexity must be minimized. Use Value: 0.43V VF at 125°C reduces conduction loss by ~1.8W per device vs. legacy 0.55V Schottkys, lowering heatsink mass by 35%. | Use Scenario: 48V input to 12V isolated DC–DC module for PLC I/O modules operating in factory-floor cabinets (70°C ambient). IC Role / Device Role / Timing Role: Secondary-side rectifier in forward converter, mounted directly to aluminum chassis for passive cooling. Use Value: 4°C/W RθJC allows full 30A load at 75°C case temp without forced air, eliminating fan dependency and improving MTBF. |
| Telecom AC–DC Adapter | Renewable Energy Battery Charger |
Use Scenario: 60W universal-input adapter for 5G small cell baseband units requiring high efficiency across 90–264VAC input range. IC Role / Device Role / Timing Role: Output rectifier in active-clamp forward topology, operating at 100kHz switching frequency. Use Value: Low 0.48V VF at room temperature cuts no-load losses by 12%, helping meet DoE Level VI efficiency requirements. | Use Scenario: 3kW off-grid solar battery charger converting 100V PV array output to 48V LiFePO4 bank with bidirectional capability. IC Role / Device Role / Timing Role: Unidirectional rectifier in boost-stage output, handling intermittent 30A surges during cloud-edge irradiance transitions. Use Value: 250A IFSM rating absorbs 100ms 60A surges without degradation, extending service life beyond 15-year field deployment. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar Schottky rectifier applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Vishay VS-30CPH06-M3 | 60V VRRM, 30A IF, VF = 0.52V typ @ 15A/25°C; TO-247AC package; RθJC = 2.5°C/W | Higher thermal performance but larger footprint; requires different mounting hardware and PCB cutout. | Preferred when board space permits and thermal budget is tighter than mechanical constraints. |
| ON Semiconductor MBR3060CT | 60V VRRM, 30A IF, VF = 0.72V typ @ 15A/25°C; TO-220AB package; dual common-cathode configuration | Higher VF increases conduction loss by ~0.24V; same footprint but inferior efficiency and thermal rise. | Acceptable only in cost-driven, low-ambient-temperature applications where 5–7% efficiency loss is tolerable. |
Compared with VS-30CPH06-M3 and MBR3060CT, the TST30U60C delivers superior VF/temperature coefficient and identical TO-220AB fit, making it optimal for space-constrained, thermally aggressive 48V–60V output rectification where efficiency and reliability are balanced.
Availability
TST30U60C is available at Aetrix Electronics and suitable for server power supplies, industrial DC–DC converters, telecom adapters, and renewable energy battery chargers requiring stable component supply and long-term production continuity.
Supply support for TST30U60C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Taiwan Semiconductor Corporation (TSC) is a vertically integrated analog and discrete semiconductor manufacturer headquartered in Hsinchu, Taiwan, specializing in power rectifiers, TVS diodes, and MOSFETs for industrial and computing markets.
The TST30U60C belongs to TSC's low-VF trench Schottky rectifier product line, engineered specifically for high-efficiency, high-reliability output rectification in 48V–60V intermediate bus architectures.
FAQ
What is the maximum junction temperature rating for the TST30U60C?
The TST30U60C has a maximum junction temperature (TJ) of +150°C and a minimum of −55°C. This wide range supports operation in harsh environments such as industrial motor drives and outdoor telecom equipment. The device maintains specified electrical parameters within this range, and thermal design must ensure TJ does not exceed 150°C under worst-case load and ambient conditions. The TST30U60C datasheet confirms this rating across all absolute maximum ratings tables.
Does the TST30U60C have a center-tab cathode configuration?
Yes, the TST30U60C uses a TO-220AB package with center-tab cathode configuration - the metal tab is electrically connected to the cathode and serves as the primary thermal path. Leads 1 and 2 are anodes. This configuration requires electrical isolation (e.g., mica washer + shoulder washer) when mounting to a grounded heatsink. Polarity is marked on the device body per TSC's standard marking diagram for the TST30U60C.
What is the typical forward voltage of the TST30U60C at 15A and 125°C?
The typical forward voltage of the TST30U60C is 0.43 V at 15 A and 125°C, as specified in the Electrical Specifications table of the official TSC datasheet (Version E2104). This value reflects improved conduction efficiency at elevated temperatures compared to room-temperature performance (0.48 V), a key advantage of its trench Schottky architecture. The TST30U60C maintains this low VF across its rated junction temperature range.
Is the TST30U60C RoHS compliant and halogen-free?
Yes, the TST30U60C is RoHS compliant and halogen-free in accordance with IEC 61249-2-21. These compliance attributes are explicitly stated in the FEATURES section of the TSC datasheet (Version E2104) and verified through material declarations. The molding compound meets UL 94V-0 flammability rating, and the matte tin-plated leads satisfy J-STD-002 solderability requirements - all confirmed for the TST30U60C ordering code.
How does the dual-die structure of the TST30U60C improve reliability?
The dual-die structure in the TST30U60C distributes current and thermal stress across two independent Schottky junctions, reducing localized hot spots and improving surge current handling. It enhances reliability during repetitive IFSM events and extends lifetime in thermally cycled applications like solar inverters. Unlike single-die 30A rectifiers, the TST30U60C's dual-die layout provides inherent current balancing and redundancy - a design feature confirmed in the KEY PARAMETERS and MECHANICAL DATA sections for the TST30U60C.
TST30U60C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Taiwan Semiconductor Corporation
- Series:
- -
- Package/Case:
- TO-220-3
- Packaging:
- Tube
- Product Status:
- Active
- Technology:
- Schottky
- Voltage - DC Reverse (Vr) (Max):
- 60 V
- Current - Average Rectified (Io):
- 15A
- Voltage - Forward (Vf) (Max) @ If:
- 570 mV @ 15 A
- Speed:
- Fast Recovery =< 500ns, > 200mA (Io)
- Reverse Recovery Time (trr):
- -
- Current - Reverse Leakage @ Vr:
- 500 µA @ 60 V
- Capacitance @ Vr, F:
- -
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Through Hole
- Supplier Device Package:
- TO-220AB
- Operating Temperature - Junction:
- -55°C ~ 150°C
TST30U60C FAQ
1.How can I place an order for TST30U60C through Aetrix?
Please submit a Request for Quotation (RFQ) for TST30U60C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TST30U60C reliable?
The price and inventory of TST30U60C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TST30U60C is usually 5 days.
3.What payment methods are accepted for TST30U60C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TST30U60C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TST30U60C?
TST30U60C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TST30U60C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TST30U60C?
For technical support, including TST30U60C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TST30U60C requirements.
6.How does Aetrix verify that TST30U60C is sourced from the original manufacturer or authorized distributors?
All TST30U60C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TST30U60C meets industry standards.
7.What is the process for return or replacement of TST30U60C?
All TST30U60C units undergo pre-shipment inspection (PSI). If there is an issue with TST30U60C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TST30U60C part is unused and in its original packaging.
Return procedure for TST30U60C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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