Taiwan Semiconductor Corporation TSUP10M60SH S1G

Overview

TSUP10M60SH from Taiwan Semiconductor is a 10A, 60V AEC-Q101-qualified trench Schottky rectifier in TO-277A (SMPC4.6U) package, featuring VF = 0.61 V at 10A/25°C, IFSM = 220 A (8.3 ms), and TJ(max) = 175°C. It serves as a high-efficiency output rectifier in automotive DC/DC converters and industrial SMPS.

For engineers reviewing the TSUP10M60SH datasheet, TSUP10M60SH pinout, TSUP10M60SH application, or TSUP10M60SH equivalent, key selection criteria include low forward voltage at high temperature, wettable flank for solder inspection, AEC-Q101 qualification, and RθJL = 6°C/W thermal performance on PCB.

Technical Context

This single-die Schottky rectifier uses patented trench structure to reduce forward voltage and leakage while maintaining 60 V reverse blocking. Its TO-277A package integrates wettable flanks and matte tin-plated leads compliant with J-STD-002 and JESD 201 Class 2 whisker testing.

Rated for continuous 10 A forward current and 220 A surge (8.3 ms), it operates from –55°C to +175°C junction temperature. Reverse leakage is limited to 250 µA at 25°C and 15 mA at 125°C under rated VR, supporting stable performance in thermally demanding automotive environments.

Key Specifications

Pinout & Package

Package: TO-277A (SMPC4.6U) - Surface-mount, 3-terminal, single-anode/single-cathode configuration with wettable flank side terminals and cathode band polarity marking.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar Schottky rectifier applications.

Compared with VS-10E60-M3/45 and MBR1060CT, TSUP10M60SH uniquely combines AEC-Q101 compliance, wettable flank inspection capability, and lowest VF among TO-277A 10A/60V Schottkys-making it optimal for automotive and high-reliability industrial SMT designs where thermal performance and process compatibility are critical.

Availability

TSUP10M60SH is available at Aetrix Electronics and suitable for automotive on-board DC/DC converters, industrial switching mode power supplies, and LED lighting applications requiring stable component supply across multi-year production cycles.

Supply support for TSUP10M60SH includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Taiwan Semiconductor Corporation (TSC) is a vertically integrated analog and discrete semiconductor manufacturer headquartered in Hsinchu, Taiwan, serving automotive, industrial, and computing markets since 1979.

The TSUP series delivers high-reliability Schottky rectifiers optimized for automotive-grade thermal robustness, low-loss power conversion, and SMT manufacturability-designed specifically for next-generation 48 V architectures and high-frequency SMPS.

FAQ

What is the maximum junction temperature rating for TSUP10M60SH?

The TSUP10M60SH has a maximum junction temperature (TJ(max)) of +175°C, validated per AEC-Q101 stress testing. This rating allows reliable operation in under-hood automotive environments and high-ambient industrial enclosures. The device maintains specified VF and IR performance up to this limit, with thermal derating curves provided in the datasheet for design margining. TSUP10M60SH must be mounted on a PCB with appropriate copper area to achieve RθJA = 45°C/W.

Does TSUP10M60SH have AEC-Q101 qualification?

Yes, TSUP10M60SH is fully AEC-Q101 qualified, covering stress tests including high-temperature reverse bias (HTRB), temperature cycling, and unbiased highly accelerated stress test (uHAST). This qualification confirms suitability for automotive powertrain and chassis applications. The TSUP10M60SH marking code "10M60" and version "B2103" correspond to the qualified lot release. TSUP10M60SH meets all requirements without derating.

What is the forward voltage of TSUP10M60SH at 10 A and 125°C?

At 10 A forward current and 125°C junction temperature, the TSUP10M60SH exhibits a typical forward voltage (VF) of 0.56 V, with a maximum of 0.60 V. This low VF at elevated temperature directly reduces conduction losses in high-ambient applications such as automotive DC/DC converters. The datasheet specifies this value under pulse test conditions (PW = 0.3 ms), and TSUP10M60SH maintains stability across its full operating range.

Is TSUP10M60SH compatible with standard SMT reflow profiles?

Yes, TSUP10M60SH has moisture sensitivity level (MSL) 1 per J-STD-020, meaning it can be stored indefinitely at ≤30°C/60% RH and placed directly into standard Pb-free reflow without baking. Its matte tin-plated leads meet J-STD-002 solderability requirements, and the TO-277A package supports automated placement. TSUP10M60SH is designed for seamless integration into high-volume SMT lines without special handling.

What does the "wettable flank" feature enable for TSUP10M60SH?

The wettable flank on TSUP10M60SH provides solderable vertical sidewalls on the anode and cathode leads, enabling automated optical inspection (AOI) of solder fillets without X-ray. This supports zero-defect manufacturing in automotive electronics. The feature also improves mechanical anchoring and thermal transfer to the PCB. TSUP10M60SH's wettable flank complies with IPC-J-STD-020 and is verified across all production lots.