Taiwan Semiconductor Corporation TSUP5M45SH S1G

Overview

TSUP5M45SH from Taiwan Semiconductor is a 5 A, 45 V AEC-Q101-qualified trench Schottky rectifier in TO-277A (SMPC4.6U) package, featuring 0.54 V forward voltage at 5 A/25°C, 110 A surge rating, and wettable flank terminals for automated optical inspection. It serves as a high-efficiency output rectifier in automotive DC/DC converters and industrial SMPS.

For engineers reviewing the TSUP5M45SH datasheet, TSUP5M45SH pinout, TSUP5M45SH application, or TSUP5M45SH equivalent, key selection criteria include its AEC-Q101 qualification, low R_θJL of 5 °C/W, 175 °C max junction temperature, wettable flank geometry, and J-STD-020 Level 1 moisture sensitivity - critical for automotive and high-reliability board assembly.

Technical Context

This single-die Schottky rectifier uses patented trench architecture to reduce forward voltage and leakage while maintaining stable performance across -55 °C to +175 °C operating range. Its 589 pF junction capacitance at 4 V reverse bias and 6 mA reverse current at 125 °C support fast-switching, low-noise operation in high-frequency DC/DC topologies.

The TO-277A (SMPC4.6U) package integrates matte tin-plated leads compliant with J-STD-002 solderability, JESD 201 Class 2 whisker resistance, and UL 94V-0 molding compound - enabling robust thermal transfer (R_θJC = 9 °C/W) and reliable reflow attachment in automotive under-hood environments.

Key Specifications

Pinout & Package

TO-277A (SMPC4.6U) surface-mount package with cathode-indicated band, wettable flank side terminals, and 0.104 g mass. Designed for high-density placement and AOI-compatible solder joint inspection.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar Schottky rectifier applications.

Compared with VS-5EY45HM3 and NSR5T45CT1G, the TSUP5M45SH uniquely combines AEC-Q101 qualification, wettable flank terminals, and 5 °C/W R_θJL - making it the only option qualified for under-hood automotive DC/DC converters requiring both reliability and manufacturability assurance.

Availability

TSUP5M45SH is available at Aetrix Electronics and suitable for automotive on-board DC/DC converters, industrial SMPS secondary rectification, and LED driver power stages requiring stable component supply and long-term lifecycle continuity.

Supply support for TSUP5M45SH includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Taiwan Semiconductor Corporation (TSC) is a vertically integrated analog and discrete semiconductor manufacturer headquartered in Hsinchu, Taiwan, specializing in power devices, protection components, and automotive-qualified products.

The TSUP series targets high-reliability automotive and industrial power conversion, with TSUP5M45SH specifically engineered to replace legacy planar Schottkys in AEC-Q101-compliant 45 V rectification applications demanding low VF, high surge tolerance, and process-robust packaging.

FAQ

What is the maximum junction temperature rating for TSUP5M45SH?

The TSUP5M45SH has a maximum junction temperature (T_J) of +175 °C, verified per AEC-Q101 stress testing. This rating allows uninterrupted operation in engine compartment environments and high-ambient industrial settings. The device maintains stable forward voltage and leakage characteristics up to this limit, as confirmed in the thermal derating curve (Fig.1) of the official TSC datasheet revision B2103.

Does TSUP5M45SH support automated optical inspection (AOI)?

Yes, TSUP5M45SH features wettable flank terminals designed explicitly for AOI compatibility. The side-terminal geometry enables full 3D solder fillet inspection during SMT post-reflow verification. This capability is documented in the mechanical data section and supported by J-STD-002 solderability validation - a key advantage over standard TO-277 variants without flank plating.

Is TSUP5M45SH pin-compatible with other TO-277A Schottky rectifiers?

TSUP5M45SH uses the standard TO-277A (SMPC4.6U) footprint and pinout: anode, cathode, and exposed cathode-connected thermal pad. It is mechanically compatible with other TO-277A rectifiers such as VS-5EY45HM3 and SB540, but functional equivalence requires verification of VF, IFSM, and qualification status - TSUP5M45SH remains distinct due to its AEC-Q101 certification and trench architecture.

What is the moisture sensitivity level (MSL) of TSUP5M45SH?

TSUP5M45SH is rated MSL Level 1 per J-STD-020, meaning it may be stored indefinitely at ≤30 °C/60% RH without baking prior to reflow. This eliminates pre-bake steps in high-volume SMT lines and reduces handling risk - a benefit confirmed in the mechanical data section of the TSC datasheet and validated through JEDEC-standard preconditioning tests.

How does the trench Schottky technology in TSUP5M45SH improve efficiency?

Trench Schottky technology in TSUP5M45SH reduces forward voltage drop to 0.54 V max at 5 A/25°C - approximately 50 mV lower than comparable planar Schottky rectifiers. This directly lowers conduction loss (P_LOSS = I_F × V_F) and improves system efficiency, especially in high-duty-cycle DC/DC converters. The architecture also suppresses leakage rise at elevated temperatures, maintaining stable performance up to 175 °C.