Taiwan Semiconductor Corporation TSUP8M45SH
- Part No.:
- TSUP8M45SH
- Manufacturer:
- Taiwan Semiconductor Corporation
- Category:
- Single Diodes
- Package:
- TO-277, 3-PowerDFN
- Datasheet:
-
TSUP8M45SH.pdf
- Description:
- DIODE SCHOTTKY 45V 8A SMPC4.6U
- Quantity:
- Payment:

- Shipping:

Inventory:5,301
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Product details
Overview
TSUP8M45SH from Taiwan Semiconductor is an AEC-Q101-qualified 8A, 45V trench Schottky rectifier in TO-277A (SMPC4.6U) package, featuring VF = 0.54 V at 8A/25°C, IFSM = 150 A, TJ(max) = 175°C, and RθJL = 7°C/W - deployed in automotive on-board DC/DC converters for high-efficiency power conversion.
For engineers reviewing the TSUP8M45SH datasheet, TSUP8M45SH pinout, TSUP8M45SH application, or TSUP8M45SH equivalent, key selection criteria include its wettable flank terminals for solder-joint inspection, J-STD-020 Level 1 moisture sensitivity, and 0.46 V forward voltage at 8A/125°C for thermal-stable operation in compact SMPS designs.
Technical Context
This device uses patented trench Schottky technology to achieve low conduction loss and high switching speed without reverse recovery charge. Its 45 V VRRM rating and 150 A IFSM surge capability support robust operation in 12 V/24 V automotive power rails.
The TO-277A (SMPC4.6U) package provides enhanced thermal performance with RθJL = 7°C/W and RθJC = 12°C/W when mounted on a 16 mm × 16 mm Cu pad, enabling high-power density in space-constrained automotive modules.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VRRM | 45 V - Maximum repetitive reverse blocking voltage; defines safe operating range in 24 V automotive systems. |
| IF | 8 A - Continuous forward current rating at TA = 25°C; supports sustained output in mid-power DC/DC stages. |
| VF @ 8A/25°C | 0.54 V - Low forward drop reduces conduction loss and improves system efficiency over silicon diodes. |
| IFSM | 150 A - Peak non-repetitive surge current (8.3 ms); withstands load dump and cold-crank transients. |
| TJ(max) | +175°C - Maximum junction temperature; enables operation in under-hood environments without derating. |
| RθJL | 7°C/W - Junction-to-lead thermal resistance; allows direct thermal path to PCB copper for passive cooling. |
Pinout & Package
Package: TO-277A (SMPC4.6U), surface-mount, single-anode/single-cathode configuration with cathode band polarity marking and wettable flank leads for automated optical inspection.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Anode | Current entry point | Connected to input rail (e.g., battery or boost stage output); low-resistance metal interface supports 8 A continuous flow. |
| Cathode | Current exit point | Connected to output node (e.g., buck converter input); marked by visible cathode band for assembly verification. |
| Lead (Anode side) | Thermal & electrical path | Wettable flank design enables solder fillet inspection; primary heat conduction path to PCB copper pad. |
| Lead (Cathode side) | Thermal & electrical path | Matte tin-plated per J-STD-002; supports reflow and wave soldering while meeting JESD201 Class 2 whisker resistance. |
Key Features
| Feature | Design Value |
|---|---|
| AEC-Q101 qualification | Validated for automotive-grade reliability including temperature cycling, HTRB, and ESD testing per stress test plan. |
| Trench Schottky architecture | Eliminates minority-carrier storage, enabling zero reverse recovery time and reduced EMI in high-frequency SMPS. |
| Wettable flank leads | Enables automated X-ray and AOI of solder joints - critical for zero-defect manufacturing in automotive electronics. |
| J-STD-020 Level 1 MSL | No floor life limitation; eliminates bake requirements before SMT assembly, reducing production cost and cycle time. |
| Halogen-free & RoHS compliant | Meets IEC 61249-2-21 and EU RoHS Directive 2011/65/EU - required for global automotive OEM supply chains. |
Applications
| Automotive On-Board DC/DC Converter | Industrial SMPS Secondary Side |
|---|---|
Use Scenario: Step-down conversion from 48 V or 24 V battery to 12 V/5 V for infotainment and ADAS ECUs. IC Role / Device Role / Timing Role: Output rectifier in synchronous or quasi-resonant flyback topology. Use Value: 0.46 V VF at 8A/125°C maintains >92% efficiency across full temperature range without active cooling. | Use Scenario: High-density AC-DC adapter for industrial control panels requiring compact footprint and high reliability. IC Role / Device Role / Timing Role: Secondary-side freewheeling diode in LLC resonant converter. Use Value: 150 A IFSM handles line surges and startup inrush without degradation; TO-277A enables 2× board area reduction vs. TO-220. |
| LED Driver Power Stage | Telecom DC/DC Module |
Use Scenario: Constant-current LED driver for commercial lighting with 24 V input and PWM dimming. IC Role / Device Role / Timing Role: Output rectifier in buck-derived constant-current regulator. Use Value: Low VF minimizes self-heating in sealed luminaires; 175°C TJ(max) prevents thermal shutdown during ambient + self-heat accumulation. | Use Scenario: Intermediate bus converter (IBC) in 48 V telecom rack power distribution. IC Role / Device Role / Timing Role: Isolation-side rectifier in phase-shifted full-bridge topology. Use Value: RθJL = 7°C/W enables direct mounting to copper plane for thermal management without heatsink - critical for 1U chassis constraints. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar Schottky rectifier applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Vishay VS-MBR845 | Same 8A/45V rating but TO-277 package (non-wettable flank); VF = 0.57 V @ 8A/25°C; no AEC-Q101 certification. | Not qualified for automotive use; suitable for industrial adapters where MSL Level 1 not required. | Select when AEC-Q101 is unnecessary and cost is prioritized over solder-joint inspection capability. |
| ON Semiconductor MBR845CT | Dual-die TO-220AB package; higher RθJA (60°C/W); VF = 0.55 V @ 8A/25°C; AEC-Q101 qualified only for discrete variants, not this dual version. | Requires heatsink for 8 A continuous operation; larger footprint limits use in space-constrained modules. | Choose only if dual-output rectification is needed and board space permits TO-220 mounting. |
Compared with VS-MBR845 and MBR845CT, the TSUP8M45SH uniquely combines AEC-Q101 qualification, wettable flank leads for automated inspection, and superior thermal resistance (RθJL = 7°C/W), making it the preferred choice for automotive and high-reliability industrial DC/DC converters where solder integrity and thermal headroom are design-critical.
Availability
TSUP8M45SH is available at Aetrix Electronics and suitable for automotive on-board DC/DC converters, industrial SMPS secondary-side rectification, and LED driver power stages requiring stable component supply, long-term lifecycle support, and traceable sourcing.
Supply support for TSUP8M45SH includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Taiwan Semiconductor Corporation (TSC) is a vertically integrated analog and power semiconductor manufacturer headquartered in Hsinchu, Taiwan, serving automotive, industrial, and consumer markets since 1979.
The TSUP series is designed specifically for high-efficiency, high-reliability power conversion in automotive and industrial applications - emphasizing AEC-Q101 compliance, trench Schottky performance, and surface-mount thermal optimization.
FAQ
What is the maximum junction temperature rating for TSUP8M45SH?
The TSUP8M45SH has a maximum junction temperature (TJ(max)) of +175°C, verified per AEC-Q101 stress testing. This rating allows uninterrupted operation in under-hood automotive environments where ambient temperatures exceed 105°C, provided thermal design meets RθJL = 7°C/W and PCB copper pad guidelines. The TSUP8M45SH's thermal margin supports extended lifetime in high-temperature DC/DC modules without forced cooling.
Is TSUP8M45SH qualified for automotive applications?
Yes, the TSUP8M45SH is fully AEC-Q101 qualified, having passed temperature cycling, high-temperature reverse bias (HTRB), and ESD tests per the standard's stress test plan. Its TO-277A package, wettable flank leads, and J-STD-020 Level 1 moisture sensitivity make it suitable for automotive power modules including on-board chargers and ADAS domain controllers. The TSUP8M45SH is explicitly listed in TSC's automotive product roadmap.
What is the forward voltage of TSUP8M45SH at 8A and 125°C?
The TSUP8M45SH exhibits a typical forward voltage of 0.46 V at IF = 8 A and TJ = 125°C, with a maximum of 0.54 V under those conditions. This low, temperature-stable VF ensures minimal conduction loss and consistent efficiency across wide operating ranges - a key advantage over conventional silicon rectifiers. The TSUP8M45SH's trench Schottky architecture contributes directly to this performance.
Does TSUP8M45SH have wettable flank leads?
Yes, the TSUP8M45SH features wettable flank leads as specified in its mechanical data, enabling reliable solder fillet formation and automated optical inspection (AOI) of solder joints. This feature is critical for zero-defect manufacturing in automotive electronics and supports IPC-A-610 Class 3 acceptance criteria. The TSUP8M45SH's wettable flank design is integral to its TO-277A (SMPC4.6U) package and confirmed in TSC's official package outline documentation.
What is the surge current rating for TSUP8M45SH?
The TSUP8M45SH has a non-repetitive peak forward surge current (IFSM) rating of 150 A for t = 8.3 ms (half-sine wave), validated per JEDEC standards. This enables robust handling of automotive load dump and cold-crank events without parametric shift or failure. The TSUP8M45SH's surge capability is supported by its trench Schottky structure and thermal design, ensuring reliability in harsh transient environments.
TSUP8M45SH Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Taiwan Semiconductor Corporation
- Series:
- -
- Package/Case:
- TO-277, 3-PowerDFN
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Technology:
- Schottky
- Voltage - DC Reverse (Vr) (Max):
- 45 V
- Current - Average Rectified (Io):
- 8A
- Voltage - Forward (Vf) (Max) @ If:
- 600 mV @ 8 A
- Speed:
- Fast Recovery =< 500ns, > 200mA (Io)
- Reverse Recovery Time (trr):
- -
- Current - Reverse Leakage @ Vr:
- 200 µA @ 45 V
- Capacitance @ Vr, F:
- 932pF @ 4V, 1MHz
- Grade:
- Automotive
- Qualification:
- AEC-Q101
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- SMPC4.6U
- Operating Temperature - Junction:
- -55°C ~ 175°C
TSUP8M45SH FAQ
1.How can I place an order for TSUP8M45SH through Aetrix?
Please submit a Request for Quotation (RFQ) for TSUP8M45SH on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TSUP8M45SH reliable?
The price and inventory of TSUP8M45SH are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TSUP8M45SH is usually 5 days.
3.What payment methods are accepted for TSUP8M45SH?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TSUP8M45SH transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TSUP8M45SH?
TSUP8M45SH orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TSUP8M45SH order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TSUP8M45SH?
For technical support, including TSUP8M45SH datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TSUP8M45SH requirements.
6.How does Aetrix verify that TSUP8M45SH is sourced from the original manufacturer or authorized distributors?
All TSUP8M45SH products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TSUP8M45SH meets industry standards.
7.What is the process for return or replacement of TSUP8M45SH?
All TSUP8M45SH units undergo pre-shipment inspection (PSI). If there is an issue with TSUP8M45SH, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TSUP8M45SH part is unused and in its original packaging.
Return procedure for TSUP8M45SH:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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