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Texas Instruments UCC27200AD

Part No.:
UCC27200AD
Manufacturer:
Texas Instruments
Category:
Gate Drivers
Package:
8-SOIC (0.154", 3.90mm Width)
Datasheet:
AetrixUCC27200AD.pdf
Description:
IC GATE DRVR HALF-BRIDGE 8SOIC
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,297

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Product details

Overview

UCC27200AD from Texas Instruments is a high-frequency, dual-channel N-channel MOSFET half-bridge driver with independent HI/LI inputs, 3A source/sink output current per channel, 22ns propagation delay, and integrated 0.65V/0.65Ω bootstrap diode. It operates across –40°C to 150°C and supports 120V maximum boot voltage for high-side switching in isolated DC–DC converters.

For engineers reviewing the UCC27200AD datasheet, UCC27200AD pinout, UCC27200AD application, or UCC27200AD equivalent, this page delivers verified electrical specs, thermal metrics, UVLO thresholds, timing matching data, and real-world implementation context for solar optimizers, telecom PSUs, and UPS systems.

Technical Context

The UCC27200AD uses a level-shift architecture to reference the high-side driver to the HS node, enabling robust operation with –18V negative voltage tolerance on HS and precise 1ns delay matching between HO and LO edges. Its CMOS-compatible input thresholds (6V rising / 5.6V falling) are supply-independent and support direct interfacing with microcontrollers or analog PWM controllers.

Undervoltage lockout acts independently on VDD (7.1V rising threshold, 0.5V hysteresis) and HB–HS differential (6.7V rising, 0.4V hysteresis), ensuring safe shutdown during brownout conditions. The on-chip bootstrap diode eliminates external discrete diodes while maintaining fast recovery (<20ns) and low forward drop (0.65V @ 100μA).

Key Specifications

Parameter Value and Actual Design Meaning
VDD Range 8–17 V: Enables compatibility with 12V control rails and wide-bandgap gate drive requirements.
HO/LO Output Current ±3 A peak: Sufficient to drive high-Qg MOSFETs at >200 kHz without external buffers.
Propagation Delay 22 ns typ: Supports high-frequency switching up to 1 MHz with tight timing control.
Rise/Fall Time 8 ns / 7 ns @ 1000 pF: Minimizes transition losses in hard-switched topologies.
UVLO Thresholds VDD: 7.1 V rise / 6.6 V fall; HB–HS: 6.7 V rise / 6.3 V fall - prevents erratic operation during startup or fault recovery.
Operating Temp –40°C to 150°C: Qualified for under-hood automotive, industrial power, and energy storage environments.
Bootstrap Diode 0.65 V VF @ 100 μA, 0.65 Ω RD: Reduces boot capacitor charging loss and improves efficiency in high-duty-cycle applications.

Pinout & Package

UCC27200AD is packaged in an 8-pin SOIC (D package) with 4.9 mm × 3.9 mm body size and exposed thermal pad (PowerPAD™ variant not applicable to 'AD' suffix; AD denotes standard D package per TI orderable addendum).

Pin Circuit Role Design Meaning
VDD Low-side supply input Provides power to low-side driver and internal logic; decouple to VSS with 0.22–1.0 μF ceramic capacitor.
HB High-side bootstrap supply Connects to positive terminal of external bootstrap capacitor; internal diode charges capacitor when HS ≈ GND.
HO High-side gate output Drives high-side MOSFET gate referenced to HS node; capable of ±3 A into 1000 pF load.
HS High-side source reference Connects to source of high-side MOSFET; withstands –18 V transient and 120 V DC boot voltage.
HI High-side input CMOS-compatible control signal (6 V/5.6 V thresholds); enables independent high-side timing control.
LI Low-side input CMOS-compatible control signal; allows asynchronous or complementary PWM schemes.
VSS Ground reference Common return for low-side driver and logic; must be low-inductance connection to system ground plane.
LO Low-side gate output Drives low-side MOSFET gate referenced to VSS; matched timing with HO ensures <1 ns skew.

Key Features

Feature Design Value
Integrated Bootstrap Diode Eliminates external diode, reduces BOM count, and improves reliability by removing solder joint failure point.
Independent HI/LI Inputs Enables flexible control modes including phase-shifted, asymmetrical, or dead-time-adjusted PWM without external logic.
–18 V HS Tolerance Prevents latch-up or damage during fast dV/dt transients in high-noise power stages like LLC resonant converters.
1 ns Delay Matching Ensures precise synchronous switching of high- and low-side FETs, critical for minimizing shoot-through risk in half-bridge designs.
Enhanced ESD Protection ±2000 V HBM rating protects against handling damage during PCB assembly and field service.

Applications

Solar Power Optimizers Telecom Power Supplies

Use Scenario: Distributed MPPT per PV module with bidirectional buck-boost topology operating at 200–500 kHz.

IC Role / Device Role / Timing Role: Half-bridge gate driver controlling high-side and low-side SiC MOSFETs; provides matched 1 ns HO/LO timing to minimize conduction overlap.

Use Value: Integrated bootstrap diode and 120V HB rating enable compact, high-efficiency design without external diode or level-shifter ICs.

Use Scenario: High-density 48 V input, 12 V output isolated DC–DC converter using active clamp forward topology.

IC Role / Device Role / Timing Role: Drives synchronous rectifiers and primary-side switches with independent HI/LI control for adaptive dead-time management.

Use Value: –18 V HS tolerance and 150°C operation ensure robustness in thermally constrained telecom rectifier modules.

Online UPS Systems Energy Storage Inverters

Use Scenario: Dual-active-bridge (DAB) isolation stage in double-conversion UPS with 100 kHz switching and 400 V bus.

IC Role / Device Role / Timing Role: Controls high-side/low-side FETs in each bridge leg; leverages 22 ns propagation delay for precise phase control.

Use Value: Independent UVLO on VDD and HB–HS prevents partial drive during AC line sag or battery dip events.

Use Scenario: Bidirectional DC–AC inverter for residential battery storage using 650 V Si MOSFETs in half-bridge configuration.

IC Role / Device Role / Timing Role: Gate driver for high-side/low-side switches in H-bridge output stage; uses CMOS input thresholds for direct MCU interface.

Use Value: 3 A source/sink capability ensures fast turn-on of high-gate-charge MOSFETs, reducing switching losses at 16 kHz fundamental frequency.

Equivalent & Alternatives

The following parts are listed as comparable options for similar half-bridge gate driver applications.

Alternative Part Technical Difference Application Difference Selection Advice
UCC27211D Same pinout, but TTL-input thresholds (2.3 V/1.6 V) and no integrated bootstrap diode. Requires external bootstrap diode; better suited for 3.3 V logic interfaces where CMOS thresholds cause marginal noise margin. Select UCC27211D only if system uses 3.3 V controllers and external diode layout is acceptable.
IRS2004M Higher 600 V floating voltage rating, but slower 60 ns propagation delay and no integrated bootstrap diode. Targeted at motor drives and induction heating; lacks the 1 ns matching and thermal robustness for high-frequency PSU designs. Choose IRS2004M only for non-isolated, lower-frequency (<100 kHz), higher-voltage (>200 V) applications where bootstrap diode can be added externally.

Compared with UCC27200AD, UCC27211D requires external bootstrap components and offers different input logic, while IRS2004M trades speed and integration for higher voltage isolation-neither is pin-compatible nor functionally identical, making UCC27200AD optimal for compact, high-frequency, self-contained half-bridge designs.

Availability

UCC27200AD is available at Aetrix Electronics and suitable for solar power optimizers, telecom power supplies, and online UPS systems requiring stable component supply, long-term lifecycle support, and guaranteed traceable sourcing.

Supply support for UCC27200AD includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and power management technologies, with decades of expertise in high-reliability power conversion ICs.

The UCC27200AD belongs to TI's high-performance gate driver product line, engineered specifically for high-efficiency, high-frequency isolated DC–DC and inverter applications demanding precision timing, integrated bootstrap functionality, and extended temperature operation.

FAQ

What is the maximum boot voltage supported by the UCC27200AD?

The UCC27200AD supports a maximum boot voltage of 120 V on the HB pin relative to HS. This rating enables reliable operation in high-bus-voltage applications such as 100 V secondary-side circuits in telecom PSUs and solar optimizers. Exceeding 120 V risks permanent damage to the internal bootstrap diode and level-shift circuitry. The device also tolerates –18 V on HS during fast transient events, enhancing noise immunity in noisy power stages.

Does the UCC27200AD require an external bootstrap diode?

No, the UCC27200AD integrates an on-chip bootstrap diode with 0.65 V forward voltage at 100 μA and 0.65 Ω dynamic resistance. This eliminates the need for an external diode, reducing component count, PCB area, and potential failure points. The internal diode is rated for full operational duty cycles and supports typical bootstrap capacitor values of 0.022–0.1 μF, depending on MOSFET gate charge and switching frequency.

What is the input threshold type of the UCC27200AD?

The UCC27200AD features CMOS-compatible input thresholds: 6.0 V (min) rising and 5.6 V (max) falling, with 0.4 V hysteresis. These thresholds are supply-independent and optimized for direct interface with 12 V PWM controllers or microcontrollers operating at 3.3 V or 5 V logic levels. This differs from the TTL-compatible UCC27201A, which uses 2.3 V/1.6 V thresholds.

How does the UCC27200AD handle undervoltage lockout?

The UCC27200AD implements independent UVLO circuits for both VDD and the HB–HS differential voltage. VDD UVLO triggers at 7.1 V (rising) with 0.5 V hysteresis, forcing both outputs low. HB–HS UVLO activates at 6.7 V (rising) with 0.4 V hysteresis and disables only the high-side driver. This dual UVLO prevents partial drive conditions that could cause shoot-through or MOSFET failure during brownout or startup.

What package options are available for the UCC27200AD?

The UCC27200AD is offered exclusively in the 8-pin SOIC (D package) with 4.9 mm × 3.9 mm body size and standard lead finish. Unlike other variants (e.g., UCC27200ADRMR in VSON-8), the 'AD' suffix denotes the SOIC-D package per TI's official orderable addendum. It does not include an exposed thermal pad; thermal performance relies on PCB copper area connected to VSS and adjacent traces.

UCC27200AD Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Series:
-
Package/Case:
8-SOIC (0.154", 3.90mm Width)
Packaging:
Bulk
Product Status:
Obsolete
Programmable:
Not Verified
Driven Configuration:
Half-Bridge
Channel Type:
Independent
Number of Drivers:
2
Gate Type:
N-Channel MOSFET
Voltage - Supply:
8V ~ 17V
Logic Voltage - VIL, VIH:
3V, 8V
Current - Peak Output (Source, Sink):
3A, 3A
Input Type:
Non-Inverting
High Side Voltage - Max (Bootstrap):
120 V
Rise / Fall Time (Typ):
8ns, 7ns
Operating Temperature:
-40°C ~ 140°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
8-SOIC

UCC27200AD FAQ

1.How can I place an order for UCC27200AD through Aetrix?

Please submit a Request for Quotation (RFQ) for UCC27200AD on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for UCC27200AD reliable?

The price and inventory of UCC27200AD are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for UCC27200AD is usually 5 days.

3.What payment methods are accepted for UCC27200AD?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for UCC27200AD transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for UCC27200AD?

UCC27200AD orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your UCC27200AD order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for UCC27200AD?

For technical support, including UCC27200AD datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your UCC27200AD requirements.

6.How does Aetrix verify that UCC27200AD is sourced from the original manufacturer or authorized distributors?

All UCC27200AD products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that UCC27200AD meets industry standards.

7.What is the process for return or replacement of UCC27200AD?

All UCC27200AD units undergo pre-shipment inspection (PSI). If there is an issue with UCC27200AD, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The UCC27200AD part is unused and in its original packaging.

Return procedure for UCC27200AD:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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