Texas Instruments UCC27200ADRMT
- Part No.:
- UCC27200ADRMT
- Manufacturer:
- Texas Instruments
- Category:
- Gate Drivers
- Package:
- 8-VDFN Exposed Pad
- Datasheet:
-
UCC27200ADRMT.pdf
- Description:
- IC GATE DRVR HALF-BRIDGE 8VSON
- Quantity:
- Payment:

- Shipping:

Inventory:1,022
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
UCC27200ADRMT from Texas Instruments is a high-frequency, dual-channel N-channel MOSFET half-bridge driver with independent HI/LI inputs, 3A source/sink output capability, 22ns propagation delay, and integrated 120V-rated bootstrap diode. It operates across –40°C to 150°C and supports solar microinverters, telecom power supplies, and UPS systems requiring robust high-side switching up to 105V HS potential.
For engineers reviewing the UCC27200ADRMT datasheet, UCC27200ADRMT pinout, UCC27200ADRMT application, or UCC27200ADRMT equivalent, this page delivers verified specifications including CMOS-compatible input thresholds (6V/5.6V), 8V UVLO for both drivers, 1ns delay matching, and SOIC-8 PowerPAD™ package thermal performance data - all critical for high-reliability isolated DC-DC and bridge converter designs.
Technical Context
The UCC27200ADRMT implements independent high-side and low-side gate drivers referenced to HS and VSS respectively, with on-chip level-shifting enabling precise timing control in floating high-side configurations. Its internal bootstrap diode (VF = 0.65V, RD = 0.65Ω) eliminates external diodes while supporting up to 120V HB voltage and –18V negative HS transient tolerance.
CMOS-input logic provides 6V rising / 5.6V falling thresholds with 0.4V hysteresis, ensuring noise immunity in high-dV/dt environments. Undervoltage lockout acts separately on VDD (7.1V rising threshold, 0.5V hysteresis) and VHB–VHS (6.7V rising threshold, 0.4V hysteresis), forcing both outputs low during fault conditions.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDD Range | 8–17 V: Enables compatibility with standard 12V bias rails and wide-bandgap gate-drive requirements. |
| Max Boot Voltage | 120 V: Supports high-voltage half-bridge topologies up to 100V bus without external clamping. |
| Output Current | ±3 A: Delivers sufficient peak gate charge current for fast switching of >100nC MOSFETs at 200+ kHz. |
| Propagation Delay | 22 ns: Ensures tight timing control in high-frequency resonant and hard-switched converters. |
| Delay Matching | 1 ns: Minimizes shoot-through risk by tightly aligning HO/LO turn-on/turn-off edges. |
| UVLO Thresholds | VDD: 7.1 V / VHB–VHS: 6.7 V: Prevents erratic operation during brownout or bootstrap capacitor discharge. |
| Operating Temp | –40°C to 150°C: Qualified for under-hood automotive, industrial, and energy storage applications. |
Pinout & Package
UCC27200ADRMT uses the DDA (PowerPAD™ SOIC-8) package: 4.9 mm × 3.9 mm body with exposed thermal pad electrically tied to VSS, enabling low RθJB = 20°C/W for high-power density layouts.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD | Low-side supply input | Primary bias rail for LO driver and logic; requires 0.22–1.0 μF local decoupling to VSS. |
| HB | High-side bootstrap supply | Connects to positive terminal of bootstrap capacitor; internal diode charges capacitor from VDD. |
| HO | High-side gate output | Drives high-side MOSFET gate referenced to HS; capable of 3A sink/source into 1000pF load. |
| HS | High-side source reference | Switch node connection; withstands –18V transients and up to 105V DC; ties to bootstrap cap negative terminal. |
| HI | High-side input | CMOS-compatible control signal (6V/5.6V thresholds); enables independent PWM control of HO. |
| LI | Low-side input | CMOS-compatible control signal (6V/5.6V thresholds); enables independent PWM control of LO. |
| VSS | Ground reference | Common return for LO driver and logic; internally connected to PowerPAD™ thermal pad. |
| LO | Low-side gate output | Drives low-side MOSFET gate referenced to VSS; matches HO timing within 1ns for shoot-through prevention. |
Key Features
| Feature | Design Value |
|---|---|
| Integrated bootstrap diode | 0.65V forward drop and 0.65Ω dynamic resistance eliminate external diode, reducing BOM count and layout area. |
| Independent HI/LI inputs | Enable asymmetric PWM, dead-time insertion, and advanced modulation schemes like phase-shifted full-bridge control. |
| –18V HS pin tolerance | Withstands severe negative transients during hard-switching or inductive kickback without latch-up or damage. |
| 1ns delay matching | Guarantees simultaneous edge alignment between HO and LO outputs, critical for minimizing conduction overlap in bridge legs. |
| Separate VDD/VHB UVLO | Prevents partial drive failure: low VDD disables both outputs; low VHB–VHS disables only HO, preserving LO functionality. |
Applications
| Solar Microinverter | Telecom PSU |
|---|---|
Use Scenario: DC-AC conversion in distributed photovoltaic systems using interleaved half-bridge topology with SiC MOSFETs. IC Role / Device Role / Timing Role: High-side/low-side gate driver controlling 600V SiC switches; provides 1ns-matched timing to minimize switching losses at 100–250 kHz. Use Value: Integrated 120V bootstrap diode and –18V HS tolerance enable direct replacement of discrete driver + diode solutions, reducing component count by 3+ parts per channel. |
Use Scenario: Primary-side synchronous rectification and secondary-side LLC resonant control in 48V telecom rectifiers. IC Role / Device Role / Timing Role: Half-bridge driver for high-efficiency GaN HEMT control; leverages 22ns propagation delay and 8ns/7ns rise/fall times for <100ns total switching transitions. Use Value: CMOS input thresholds (6V/5.6V) interface directly with DSP-based PWM controllers without level-shifting, simplifying digital power design. |
| Online UPS | Battery Test Equipment |
Use Scenario: Bidirectional DC-DC stage in double-conversion UPS handling 400V DC bus and regenerative braking currents. IC Role / Device Role / Timing Role: Robust gate driver for IGBTs/MOSFETs in H-bridge configuration; utilizes 150°C junction rating for sustained high-load operation. Use Value: Dual UVLO (VDD and VHB–VHS) ensures fail-safe shutdown during input brownout or bootstrap capacitor failure, preventing shoot-through faults. |
Use Scenario: Precision high-current charging/discharging cycles in lithium-ion battery formation and grading systems. IC Role / Device Role / Timing Role: Gate driver for parallel N-channel MOSFET arrays in programmable load banks; delivers ±3A peak current for sub-μs turn-on. Use Value: PowerPAD™ SOIC-8 package achieves RθJB = 20°C/W, enabling continuous 2W dissipation without heatsink in compact test rack modules. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar half-bridge gate driver applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| UCC27211ADRMT | TTL-compatible inputs (2.3V/1.6V thresholds); identical pinout, timing, and drive strength. | Better suited for 3.3V/5V logic-level controllers; less noise margin in high-dV/dt environments than UCC27200ADRMT. | Select when interfacing with microcontrollers or FPGAs lacking 6V-tolerant GPIOs. |
| IRS2005MTRPBF | Higher 600V max bootstrap voltage; no integrated bootstrap diode; 10-pin SOIC package. | Targeted at higher-bus industrial inverters (>400V); requires external bootstrap diode and larger PCB footprint. | Choose for legacy designs already using IRS200x family or where >120V bootstrap headroom is mandatory. |
Compared with UCC27200ADRMT, UCC27211ADRMT offers lower input thresholds for logic-level compatibility but reduced noise immunity, while IRS2005MTRPBF trades integration for higher voltage headroom and external component flexibility - making UCC27200ADRMT optimal for cost-sensitive, space-constrained 100V-class solar and telecom applications.
Availability
UCC27200ADRMT is available at Aetrix Electronics and suitable for solar microinverters, telecom power supplies, and online UPS systems requiring stable component supply, long-term lifecycle support, and traceable sourcing from authorized channels.
Supply support for UCC27200ADRMT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and power management ICs, with decades of expertise in high-reliability power conversion solutions.
The UCC27200A series belongs to TI's high-performance gate driver product line, engineered specifically for high-efficiency, high-density isolated DC-DC and AC-DC converters operating in harsh thermal and electrical environments.
FAQ
What is the input voltage threshold type for UCC27200ADRMT?
UCC27200ADRMT features CMOS-compatible input thresholds: 6.0V typical rising threshold and 5.6V typical falling threshold with 0.4V hysteresis. These thresholds are supply-independent and optimized for noise immunity in high-dV/dt power stages. The UCC27200ADRMT does not use TTL thresholds - that variant is the UCC27201A.
Does UCC27200ADRMT include an integrated bootstrap diode?
Yes, UCC27200ADRMT integrates a bootstrap diode with 0.65V forward voltage at 100μA and 0.65Ω dynamic resistance. This eliminates the need for an external diode in most half-bridge designs, reducing component count and PCB area. The diode anode connects internally to VDD and cathode to HB.
What package type is used by UCC27200ADRMT?
UCC27200ADRMT uses the DDA package: an 8-pin SOIC with exposed PowerPAD™ thermal pad. The pad is electrically connected to VSS and provides RθJB = 20°C/W, significantly improving thermal performance over standard SOIC-8 variants without thermal enhancement.
How does the UVLO function on UCC27200ADRMT?
UCC27200ADRMT implements dual independent UVLO circuits: one monitors VDD (7.1V rising threshold, 0.5V hysteresis) and forces both HO and LO low if violated; the other monitors VHB–VHS differential (6.7V rising threshold, 0.4V hysteresis) and disables only HO. This prevents partial drive failures during bootstrap capacitor discharge or supply sag.
What is the maximum allowable voltage on the HS pin of UCC27200ADRMT?
The HS pin of UCC27200ADRMT supports –1V to +105V DC under recommended operating conditions, and withstands –18V to +120V for repetitive pulses <100 ns. This robust negative transient tolerance enables reliable operation in hard-switched topologies with significant ringing or inductive kickback.
UCC27200ADRMT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- -
- Package/Case:
- 8-VDFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Driven Configuration:
- Half-Bridge
- Channel Type:
- Independent
- Number of Drivers:
- 2
- Gate Type:
- N-Channel MOSFET
- Voltage - Supply:
- 8V ~ 17V
- Logic Voltage - VIL, VIH:
- 3V, 8V
- Current - Peak Output (Source, Sink):
- 3A, 3A
- Input Type:
- Non-Inverting
- High Side Voltage - Max (Bootstrap):
- 120 V
- Rise / Fall Time (Typ):
- 8ns, 7ns
- Operating Temperature:
- -40°C ~ 140°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-VSON (4x4)
UCC27200ADRMT FAQ
1.How can I place an order for UCC27200ADRMT through Aetrix?
Please submit a Request for Quotation (RFQ) for UCC27200ADRMT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for UCC27200ADRMT reliable?
The price and inventory of UCC27200ADRMT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for UCC27200ADRMT is usually 5 days.
3.What payment methods are accepted for UCC27200ADRMT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for UCC27200ADRMT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for UCC27200ADRMT?
UCC27200ADRMT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your UCC27200ADRMT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for UCC27200ADRMT?
For technical support, including UCC27200ADRMT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your UCC27200ADRMT requirements.
6.How does Aetrix verify that UCC27200ADRMT is sourced from the original manufacturer or authorized distributors?
All UCC27200ADRMT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that UCC27200ADRMT meets industry standards.
7.What is the process for return or replacement of UCC27200ADRMT?
All UCC27200ADRMT units undergo pre-shipment inspection (PSI). If there is an issue with UCC27200ADRMT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The UCC27200ADRMT part is unused and in its original packaging.
Return procedure for UCC27200ADRMT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
UCC27200ADRMT Tags

-
ZXGD3009E6TA
Diodes Incorporated

-
1EDN7512BXTSA1
Infineon Technologies
-
UCC27517DBVR
Texas Instruments

-
MCP1416T-E/OT
Microchip Technology

-
MCP1402T-E/OT
Microchip Technology

-
MCP1415T-E/OT
Microchip Technology

-
MCP1401T-E/OT
Microchip Technology

-
IX4428NTR
Littelfuse Inc.

-
IRS2005STRPBF
Infineon Technologies

-
IRS2008STRPBF
Infineon Technologies

-
IX4310TTR
Littelfuse Inc.

-
2EDN7524RXTMA1
Infineon Technologies
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

