Texas Instruments UCC27212AQDDARQ1
- Part No.:
- UCC27212AQDDARQ1
- Manufacturer:
- Texas Instruments
- Category:
- Gate Drivers
- Package:
- 8-PowerSOIC (0.154", 3.90mm Width)
- Datasheet:
-
UCC27212AQDDARQ1.pdf
- Description:
- IC GATE DRVR HALF-BRIDGE 8SOPWR
- Quantity:
- Payment:

- Shipping:

Inventory:5,978
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
UCC27212AQDDARQ1 from Texas Instruments is an AEC-Q100 Grade 1 automotive half-bridge gate driver IC designed to control high-side and low-side N-channel MOSFETs in synchronous buck, half-bridge, and DC/DC converter topologies. It delivers 3.7A source / 4.5A sink peak output current, supports 120V maximum boot voltage, features independent TTL-compatible HI/LI inputs, and incorporates an on-chip 120V-rated bootstrap diode. It is deployed in electric power steering (EPS) and on-board chargers (OBC).
For engineers reviewing the UCC27212AQDDARQ1 datasheet, UCC27212AQDDARQ1 pinout, UCC27212AQDDARQ1 application, or UCC27212AQDDARQ1 equivalent, key selection considerations include its 5V UVLO turn-off threshold, 20ns typical propagation delay, 4ns typical delay matching between HO/LO channels, –40°C to +150°C junction temperature rating, and SOIC-8 PowerPAD™ package with thermal pad.
Technical Context
The UCC27212AQDDARQ1 integrates independent high-side and low-side drivers referenced to HS and VSS respectively, with a level-shift circuit enabling robust floating operation up to 120V DC on the HB pin and –(24V – VDD) negative tolerance on HS. Its input structure tolerates –10V to +20V regardless of VDD, enabling direct interface to gate-drive transformers without external rectification diodes.
It implements dual independent UVLO circuits - one for VDD (5.7V turn-on, 0.4V hysteresis) and one for VHB–VHS differential (5.3V turn-on, 0.3V hysteresis) - ensuring symmetric shutdown behavior. The on-chip bootstrap diode eliminates external discrete diodes while supporting fast recovery (20ns turnoff) and low dynamic resistance (0.3–0.85Ω).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDD Range | 7V to 17V operating; 20V absolute max - enables compatibility with 12V automotive systems and supports transient margin. |
| Peak Output Current | 3.7A source / 4.5A sink - sufficient to rapidly charge/discharge large gate capacitances and minimize Miller plateau dwell time. |
| Propagation Delay | 20ns typical - ensures precise timing alignment in high-frequency switching converters (e.g., >500kHz OBCs). |
| Delay Matching | 4ns typical between HO and LO - prevents shoot-through and transformer volt-second imbalance in bridge configurations. |
| Rise/Fall Time | 7.2ns rise / 5.5ns fall (1000pF load) - reduces switching transition losses and EMI generation. |
| UVLO Thresholds | VDD: 5.7V turn-on (0.4V hysteresis); VHB–VHS: 5.3V turn-on (0.3V hysteresis) - guarantees coordinated disable of both drivers during brownout. |
| Input Voltage Range | –10V to +20V on HI/LI - provides immunity to ground bounce and enables direct transformer coupling without rectifiers. |
| Thermal Resistance | RθJB = 21.3°C/W - enables high-power operation with PCB copper pour thermal management via exposed PowerPAD™. |
Pinout & Package
UCC27212AQDDARQ1 is housed in an 8-pin SOIC package with PowerPAD™ (DDA), featuring a thermally enhanced exposed copper pad electrically tied to VSS and requiring connection to a large GND plane for optimal thermal performance. Body size is 4.9mm × 3.9mm.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 - VDD | Low-side supply input | Provides bias for low-side driver and internal logic; must be decoupled to VSS with 0.22–4.7µF capacitor. |
| 2 - HB | High-side bootstrap supply | Connects to positive terminal of external bootstrap capacitor; internal 120V diode charges capacitor during LO conduction. |
| 3 - HO | High-side gate drive output | Drives gate of high-side N-MOSFET; referenced to HS pin; capable of 3.7A source / 4.5A sink. |
| 4 - HS | High-side source reference | Connects to source of high-side MOSFET and negative terminal of bootstrap capacitor; withstands –(24V – VDD) transients. |
| 5 - HI | High-side input | TTL-compatible digital input (1.7–2.55V high threshold); independent of VDD; tolerates –10V undershoot. |
| 6 - LI | Low-side input | TTL-compatible digital input (1.7–2.55V high threshold); independent of VDD; tolerates –10V undershoot. |
| 7 - VSS | Ground reference | Common return for low-side driver and internal circuitry; electrically tied to thermal pad. |
| 8 - LO | Low-side gate drive output | Drives gate of low-side N-MOSFET; referenced to VSS; capable of 3.7A source / 4.5A sink. |
Key Features
| Feature | Design Value |
|---|---|
| On-chip 120V bootstrap diode | Eliminates external diode, reduces BOM count, and improves reliability in high-voltage automotive DC/DC stages. |
| Independent HI/LI inputs with –10V tolerance | Enables direct connection to gate-drive transformers or isolated controllers without rectifier diodes or level shifters. |
| Symmetric dual UVLO (VDD & VHB–VHS) | Forces both HO and LO low during undervoltage conditions, preventing shoot-through and ensuring safe startup/shutdown. |
| 4ns typical delay matching | Minimizes dead-time uncertainty and avoids transformer core saturation in phase-shifted or resonant topologies. |
| Enhanced input hysteresis (0.7V) | Improves noise immunity against dV/dt-induced glitches in high-noise automotive environments like EPS motor drives. |
| PowerPAD™ thermal package (RθJB = 21.3°C/W) | Supports continuous 3.7A/4.5A drive capability at TJ ≤ 150°C with standard PCB copper area, no heatsink required. |
Applications
| Electric Power Steering (EPS) | Automotive On-Board Charger (OBC) |
|---|---|
|
Use Scenario: Driving dual N-channel MOSFETs in a 3-phase inverter stage supplying brushless DC motor in column-assist EPS system. IC Role / Device Role / Timing Role: Half-bridge gate driver providing independent, matched HO/LO outputs synchronized to PWM controller; handles 100V+ bus transients and –10V ground bounce. Use Value: 4ns delay matching prevents shoot-through during high-dV/dt commutation; 150°C junction rating supports under-hood placement near motor controller. |
Use Scenario: Controlling high-side/low-side switches in a 6.6kW bidirectional AC/DC PFC + LLC stage in BEV OBC. IC Role / Device Role / Timing Role: Isolated gate driver interface translating controller PWM to 120V-capable half-bridge outputs; integrated bootstrap diode simplifies high-voltage bootstrap design. Use Value: 120V HB rating and –(24V – VDD) HS tolerance withstand 100V surge events per ISO 7637-2; 20ns propagation delay enables >500kHz switching. |
| 2-/3-Wheeler Traction Inverter | Wireless Charging Transmitter |
|
Use Scenario: Gate driving in compact traction inverter for e-scooter or e-rickshaw, operating from 48–72V battery with space-constrained layout. IC Role / Device Role / Timing Role: High-current half-bridge driver replacing discrete driver + bootstrap diode solution; SOIC-8 PowerPAD™ minimizes footprint and thermal resistance. Use Value: RθJB = 21.3°C/W allows full 4.5A sink capability with only PCB copper; 7–17V VDD range accommodates wide battery voltage swing. |
Use Scenario: Driving resonant half-bridge in Qi-compliant 15W wireless charging transmitter operating at 110–205kHz. IC Role / Device Role / Timing Role: Precision-matched gate driver ensuring zero-voltage switching (ZVS) by minimizing HO/LO timing skew across temperature. Use Value: 4ns typical delay matching maintained over –40°C to +150°C ensures consistent ZVS margin; 5.5ns fall time reduces switching loss in high-frequency operation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar half-bridge gate driver applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| UCC27201AQDDARQ1 | Lacks integrated bootstrap diode; requires external diode; identical 3.7A/4.5A drive and 20ns delay. | Higher BOM count and layout complexity; less suitable for space-constrained OBC modules. | Select when cost sensitivity outweighs integration benefit and external diode routing is feasible. |
| LM5109BMAX/NOPB | Lower peak current (1.5A/2A); no integrated bootstrap diode; wider VDD range (8–100V); non-automotive grade. | Not AEC-Q100 qualified; unsuitable for safety-critical EPS or OBC; limited to industrial auxiliary supplies. | Consider only for non-automotive, lower-power applications where qualification is not required. |
Compared with UCC27212AQDDARQ1, UCC27201AQDDARQ1 trades integration for marginal cost reduction but increases design complexity, while LM5109BMAX/NOPB lacks automotive qualification and drive strength - making UCC27212AQDDARQ1 the optimal choice for AEC-Q100-compliant, high-current, space-constrained half-bridge systems.
Availability
UCC27212AQDDARQ1 is available at Aetrix Electronics and suitable for electric power steering (EPS), on-board chargers (OBC), and 2-/3-wheeler traction inverters requiring stable component supply across extended temperature and automotive qualification requirements.
Supply support for UCC27212AQDDARQ1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company specializing in analog and embedded processing technologies, with leadership in automotive-grade power management and interface solutions.
The UCC27212AQDDARQ1 belongs to TI's automotive-qualified gate driver product line, engineered specifically for high-reliability, high-efficiency motor control and power conversion in demanding vehicle subsystems including EPS, OBC, and traction drives.
FAQ
What is the maximum boot voltage rating of the UCC27212AQDDARQ1?
The UCC27212AQDDARQ1 supports a maximum boot voltage (VHB) of 120V DC, verified per absolute maximum ratings. This enables reliable operation in 100V-class automotive DC/DC converters and on-board chargers where transient surges exceed nominal bus voltage. The internal bootstrap diode is rated for this voltage, eliminating need for external high-voltage diodes.
Does the UCC27212AQDDARQ1 have independent UVLO for high-side and low-side drivers?
Yes, the UCC27212AQDDARQ1 implements two independent UVLO circuits: one monitors VDD (5.7V turn-on, 0.4V hysteresis) and disables both drivers, while the other monitors the VHB–VHS differential (5.3V turn-on, 0.3V hysteresis) and disables only the high-side driver. This ensures safe, asymmetric fault response and prevents unintended high-side conduction during bootstrap capacitor discharge.
What is the purpose of the HS pin on the UCC27212AQDDARQ1?
The HS (high-side source) pin on the UCC27212AQDDARQ1 serves as the local ground reference for the high-side driver stage and connects directly to the source terminal of the high-side N-channel MOSFET. It also forms the negative terminal of the external bootstrap capacitor. The pin is rated for –(24V – VDD) transient voltage, providing protection against negative spikes caused by parasitic inductance during fast switching transitions.
Can the UCC27212AQDDARQ1 drive GaN FETs?
The UCC27212AQDDARQ1 can drive enhancement-mode GaN FETs in half-bridge configurations, provided gate voltage requirements (typically 0–6V) and layout constraints (minimized loop inductance) are met. Its 3.7A/4.5A peak current, 7.2ns rise time, and 20ns propagation delay support GaN switching up to ~1MHz, though gate resistor tuning and careful PCB layout are essential to avoid oscillation and overshoot.
Is the thermal pad of the UCC27212AQDDARQ1 electrically connected to VSS?
Yes, the exposed thermal pad on the UCC27212AQDDARQ1 (DDA package) is electrically connected to VSS and must be soldered to a PCB ground plane or large copper pour. This connection provides both thermal dissipation (RθJB = 21.3°C/W) and electrical grounding for the internal substrate, improving noise immunity and enabling full-rated output current capability at high junction temperatures.
UCC27212AQDDARQ1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- -
- Package/Case:
- 8-PowerSOIC (0.154", 3.90mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Driven Configuration:
- Half-Bridge
- Channel Type:
- Independent
- Number of Drivers:
- 2
- Gate Type:
- N-Channel MOSFET
- Voltage - Supply:
- 7V ~ 17V
- Logic Voltage - VIL, VIH:
- 1.6V, 2.3V
- Current - Peak Output (Source, Sink):
- 4A, 4A
- Input Type:
- Non-Inverting
- High Side Voltage - Max (Bootstrap):
- -
- Rise / Fall Time (Typ):
- 7.8ns, 6ns
- Operating Temperature:
- -40°C ~ 140°C (TJ)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-SO PowerPad
UCC27212AQDDARQ1 FAQ
1.How can I place an order for UCC27212AQDDARQ1 through Aetrix?
Please submit a Request for Quotation (RFQ) for UCC27212AQDDARQ1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for UCC27212AQDDARQ1 reliable?
The price and inventory of UCC27212AQDDARQ1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for UCC27212AQDDARQ1 is usually 5 days.
3.What payment methods are accepted for UCC27212AQDDARQ1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for UCC27212AQDDARQ1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for UCC27212AQDDARQ1?
UCC27212AQDDARQ1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your UCC27212AQDDARQ1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for UCC27212AQDDARQ1?
For technical support, including UCC27212AQDDARQ1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your UCC27212AQDDARQ1 requirements.
6.How does Aetrix verify that UCC27212AQDDARQ1 is sourced from the original manufacturer or authorized distributors?
All UCC27212AQDDARQ1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that UCC27212AQDDARQ1 meets industry standards.
7.What is the process for return or replacement of UCC27212AQDDARQ1?
All UCC27212AQDDARQ1 units undergo pre-shipment inspection (PSI). If there is an issue with UCC27212AQDDARQ1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The UCC27212AQDDARQ1 part is unused and in its original packaging.
Return procedure for UCC27212AQDDARQ1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
UCC27212AQDDARQ1 Tags

-
ZXGD3009E6TA
Diodes Incorporated

-
1EDN7512BXTSA1
Infineon Technologies
-
UCC27517DBVR
Texas Instruments

-
MCP1416T-E/OT
Microchip Technology

-
MCP1402T-E/OT
Microchip Technology

-
MCP1415T-E/OT
Microchip Technology

-
MCP1401T-E/OT
Microchip Technology

-
IX4428NTR
Littelfuse Inc.

-
IRS2005STRPBF
Infineon Technologies

-
IRS2008STRPBF
Infineon Technologies

-
IX4310TTR
Littelfuse Inc.

-
2EDN7524RXTMA1
Infineon Technologies
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

