Texas Instruments UCC27223PWP

Overview

UCC27223PWP from Texas Instruments is a high-speed synchronous buck gate driver IC with Predictive Gate Drive (PGD) technology, ±3-A dual high-side/low-side output capability, 6.5-V on-board VLO regulator, and thermally enhanced 14-pin PowerPAD HTSSOP package. It minimizes body-diode conduction and reverse recovery losses in multiphase and non-isolated DC-DC converters for processor power supplies.

For engineers reviewing the UCC27223PWP datasheet, UCC27223PWP pinout, UCC27223PWP application, or UCC27223PWP equivalent, key selection criteria include deadtime adjustability (±17 ns to ±54 ns), UVLO thresholds (3.82 V start / 3.70 V operating), G1/G2 sink/source resistance (0.5–1.5 Ω / 10–45 Ω), thermal resistance (2°C/W θjc), and compatibility with 3.3-V/5-V/12-V input systems using charge-pump or bias-bus configurations.

Technical Context

The UCC27223PWP implements a digital predictive delay controller that continuously adjusts tON,G1 and tON,G2 in discrete ~3-ns steps per cycle based on real-time sensing of SWS (SR drain) and G2S (SR gate) to eliminate body-diode conduction. Its closed-loop PGD system compensates for MOSFET parameter variation, temperature drift, and load-dependent propagation delays without external tuning.

It integrates a bipolar/MOSFET parallel output stage delivering ±3.3-A peak current, an internal 6.5-V LDO regulator (6.2–6.9 V output, 15–40 mV load regulation), and active-high ENBL with 110-kΩ internal pull-up. The device supports three input configurations: 12-V bus bias, 5-V-only with integrated charge pump (D3/D4/C3), and 3.3-V input with 12-V auxiliary bias.

Key Specifications

Pinout & Package

UCC27223PWP uses the thermally enhanced 14-pin PowerPAD HTSSOP (PWP) package with exposed thermal pad soldered to PCB ground plane for optimal heat transfer. θjc = 2°C/W.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous buck gate driver applications.

Compared with UCC27223PWP, UCC27211PWP offers lower cost but sacrifices adaptive deadtime and efficiency headroom, while LM5113SD provides modular timing control at the expense of BOM count and thermal optimization - making UCC27223PWP optimal for high-efficiency, thermally constrained, multiphase CPU/GPU VRMs.

Availability

UCC27223PWP is available at Aetrix Electronics and suitable for server VRM power stages, telecom point-of-load converters, industrial PLC power supplies, and AI accelerator board power requiring stable component supply, consistent thermal performance, and production-ready PGD functionality.

Supply support for UCC27223PWP includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor company specializing in analog, embedded processing, and power management technologies, with leadership in high-performance power conversion solutions.

The UCC27223PWP belongs to TI's synchronous buck gate driver product line, designed specifically to maximize efficiency in high-current, low-voltage DC-DC converters by eliminating body-diode conduction through predictive timing control.

FAQ

What is the primary function of the UCC27223PWP in a synchronous buck converter?

The UCC27223PWP serves as a dual high-side/low-side gate driver with Predictive Gate Drive (PGD) technology. It precisely controls the timing of main and synchronous rectifier MOSFETs to eliminate body-diode conduction, thereby reducing reverse recovery losses and improving overall converter efficiency. Its integrated 6.5-V VLO regulator and TrueDrive™ outputs enable robust operation in demanding power delivery applications such as CPU VRMs and telecom POL converters.

How does the Predictive Gate Drive (PGD) feature in the UCC27223PWP improve efficiency compared to fixed-deadtime drivers?

The UCC27223PWP's PGD feature uses real-time sensing of SWS (SR drain) and G2S (SR gate) to dynamically adjust tON,G1 and tON,G2 in discrete ~3-ns steps each cycle. This eliminates body-diode conduction across varying MOSFET characteristics, temperature, and load conditions - unlike fixed-deadtime drivers, which require conservative deadtime margins that cause unavoidable conduction loss. As a result, UCC27223PWP achieves up to 1.2% higher efficiency in 12-V-to-1-V VRMs.

Can the UCC27223PWP operate from a 3.3-V input supply alone?

No, the UCC27223PWP cannot operate from a 3.3-V input supply alone. Its VDD pin requires 8.5–20 V to power the internal VLO regulator. However, it supports 3.3-V PWM input when a 12-V auxiliary bias is available for VDD - enabling use in systems where the main power bus is 3.3 V but a 12-V rail exists for gate drive biasing.

What is the purpose of the SWS and G2S pins on the UCC27223PWP?

The SWS (Pin 11) and G2S (Pin 10) pins provide critical feedback to the UCC27223PWP's Predictive Gate Drive controller. SWS senses the drain voltage of the synchronous rectifier MOSFET to detect body-diode conduction onset, while G2S monitors the gate voltage to determine channel conduction status. Together, they enable the digital PGD loop to adjust deadtime in real time - ensuring zero body-diode conduction without risking shoot-through.

What thermal performance can be expected from the UCC27223PWP in continuous 3-W operation?

In continuous 3-W power dissipation, the UCC27223PWP's PowerPAD HTSSOP (PWP) package delivers θjc = 2°C/W. With proper PCB thermal design (≥4 thermal vias to solid ground plane), junction temperature rise above case is ≤6°C - well within its −55°C to 115°C operating range. This enables reliable operation in high-density power modules where thermal headroom is constrained, such as AI accelerator board VRMs.