Texas Instruments UCC27282QDDARQ1

Overview

UCC27282QDDARQ1 from Texas Instruments is an AEC-Q100 Grade 1 automotive half-bridge gate driver for two N-channel MOSFETs in high-side/low-side configuration, featuring ±3-A peak output current, 16-ns typical propagation delay, 12-ns/10-ns (rise/fall) switching times with 1.8-nF load, and integrated bootstrap diode - deployed in electric power steering and on-board charger systems.

For engineers reviewing the UCC27282QDDARQ1 datasheet, UCC27282QDDARQ1 pinout, UCC27282QDDARQ1 application, or UCC27282QDDARQ1 equivalent, key selection considerations include HS voltage rating (100 V), input interlock logic, enable functionality (DRC package), UVLO thresholds (5.0 V on VDD, 3.7 V on HB–HS), and thermal performance in 3 mm × 3 mm SON10 (DRC) packaging.

Technical Context

The UCC27282QDDARQ1 implements independent TTL/CMOS-compatible HI and LI inputs with internal interlock logic that forces both HO and LO low during input overlap - preventing shoot-through without fixed dead-time insertion. Its floating high-side driver uses a robust level shifter referenced to HS, enabling operation up to 100 V with respect to VSS while maintaining tight 1-ns typical delay matching between HO and LO paths.

UVLO protection operates separately on VDD (4.5 V falling threshold) and HB–HS (3.3 V rising threshold), ensuring safe startup and fault response. The integrated bootstrap diode supports self-biased high-side drive, and EN pin (available only in DRC package) enables system-level power sequencing and fault shutdown with 18-μs enable delay and 1.5-μs disable delay.

Key Specifications

Pinout & Package

UCC27282QDDARQ1 is supplied in the SON10 (DRC) package: 3 mm × 3 mm, 10-pin very-thin small-outline no-lead with exposed thermal pad. Pin assignment is validated per TI SLUSDN5D Rev D (October 2022), Figure 5-1 and Table 5-1.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar half-bridge gate driver applications.

Compared with UCC27282QDDARQ1, UCC27289QDRQ1 offers enhanced dead-time control at the cost of EN pin omission in SOIC-8, while LM5106MMX/NOPB lacks automotive qualification, integrated bootstrap, and thermal performance - making UCC27282QDDARQ1 the optimal choice for AEC-Q100-compliant, space-constrained half-bridge designs requiring EN-based fault management.

Availability

UCC27282QDDARQ1 is available at Aetrix Electronics and suitable for automotive DC/DC converters, electric power steering systems, and on-board chargers requiring stable component supply across extended temperature and long lifecycle demands.

Supply support for UCC27282QDDARQ1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and automotive ICs, with decades of experience in high-reliability power management solutions.

The UCC27282QDDARQ1 belongs to TI's automotive-grade gate driver product line, engineered specifically for high-efficiency, high-density motor control and power conversion in ASIL-B systems - emphasizing robustness, precision timing, and functional safety readiness.

FAQ

What is the maximum allowable voltage on the HS pin of the UCC27282QDDARQ1?

The UCC27282QDDARQ1 specifies an absolute maximum HS voltage of 100 V DC and –14 V for pulses <100 ns. Operation beyond these limits risks permanent damage. The recommended operating condition is –8 V to 100 V, and the device's negative transient tolerance improves system resilience during inductive switching events in motor drives and DC/DC converters. Always observe VHB–HS ≤ 16 V to avoid overstress.

Does the UCC27282QDDARQ1 require an external bootstrap diode?

No, the UCC27282QDDARQ1 integrates a bootstrap diode with 0.85-V typical forward voltage and 2.5-Ω dynamic resistance. This eliminates the need for an external diode in most applications, reducing component count and PCB footprint. External diodes may still be used for higher-reliability redundancy or when HB current exceeds 80 mA, but TI's design assumes on-chip diode usage per datasheet recommendations.

How does the input interlock feature work in the UCC27282QDDARQ1?

The UCC27282QDDARQ1's input interlock forces both HO and LO low whenever HI and LI are simultaneously high - preventing shoot-through without introducing fixed dead time. Unlike traditional blanking-based schemes, this logic operates instantaneously with no added propagation delay, preserving the device's 1-ns delay matching. The interlock resets immediately when either input falls, enabling precise timing control in high-frequency half-bridge topologies.

Is the EN pin available on all UCC27282QDDARQ1 package variants?

No - the EN pin is only present in the SON10 (DRC) package, which corresponds to the UCC27282QDDARQ1 orderable part number. It is absent in SOIC-8 (D) and SOIC-8-PP (DDA) variants. The EN pin provides active-high enable control with 2.0-V threshold and 18-μs enable delay, supporting system-level power sequencing and fault shutdown in automotive modules where the DRC package is specified.

What thermal performance can be expected from the UCC27282QDDARQ1 in its DRC package?

In the SON10 (DRC) package, the UCC27282QDDARQ1 achieves RθJB = 21.3°C/W (junction-to-board) and RθJA = 47.3°C/W (junction-to-ambient, JEDEC standard board). With proper PCB layout - including a solid thermal pad connected to a ≥4 cm² copper pour tied to VSS - the device sustains continuous 150°C junction temperature under full ±3-A load at 12-V VDD, meeting AEC-Q100 Grade 1 requirements without forced airflow.