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Texas Instruments UCC27321DR

Part No.:
UCC27321DR
Manufacturer:
Texas Instruments
Category:
Gate Drivers
Package:
8-SOIC (0.154", 3.90mm Width)
Datasheet:
AetrixUCC27321DR.pdf
Description:
IC GATE DRVR LOW-SIDE 8SOIC
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:9,597

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Product details

Overview

UCC27321DR from Texas Instruments is a single-channel, non-isolated, low-side MOSFET driver IC with enable functionality, delivering ±9 A peak output current at the Miller plateau region, 20-ns typical rise/fall times (10-nF load), and 4-V to 15-V supply operation. It interfaces PWM controllers to power MOSFETs in high-frequency switch-mode power supplies and motor drives.

For engineers reviewing the UCC27321DR datasheet, UCC27321DR pinout, UCC27321DR application, or UCC27321DR equivalent, this page provides verified technical context, thermal performance data for MSOP-PowerPAD™ packaging, switching timing under real load conditions, and validated alternative drivers for gate-drive system design.

Technical Context

The UCC27321DR implements TrueDrive - a hybrid bipolar-MOSFET output stage - enabling efficient ±9-A peak sourcing/sinking precisely during the Miller plateau where gate charge demand is highest. Its dual-ground architecture separates AGND (control logic) from PGND (power path) to suppress switching-induced noise coupling.

Input thresholds are TTL/CMOS-compatible across 4.5–15 V VDD, with 1.6–2.5 V logic-high and 0.8–1.5 V logic-low ranges, plus built-in hysteresis on both IN and ENBL pins. The enable function (pin 3) is internally pulled up to VDD via 100-kΩ resistor and forces OUT low when disabled - critical for safe startup/shutdown sequencing.

Key Specifications

Parameter Value and Actual Design Meaning
Peak Output Current ±9 A at Miller plateau - sustains full drive during critical MOSFET transition where dV/dt is highest
Rise/Fall Time 20 ns / 20 ns (typical, 10-nF load) - enables >25 MHz effective switching frequency in hard-switched topologies
Propagation Delay 35 ns (IN↓→OUT↑), 25 ns (IN↑→OUT↓) - tight timing control for synchronous rectification and phase-shifted converters
Supply Voltage Range 4.5 V to 15 V - supports 5-V, 12-V, and wide-input industrial rails without external regulators
Enable Threshold VEN_H = 1.7–2.7 V, VEN_L = 1.1–2.0 V with 0.25–0.9 V hysteresis - robust against supply ripple and slow-rising enable signals
Junction Temp Range –40°C to +105°C - qualified for industrial and automotive under-hood ambient conditions
Thermal Resistance θjc 4.7°C/W (MSOP-PowerPAD™ package) - enables 3 W continuous power dissipation with minimal heatsinking

Pinout & Package

UCC27321DR is packaged in an 8-pin MSOP-PowerPAD™ (DGN) with exposed thermal pad, measuring 3.00 mm × 3.00 mm and offering 4.7°C/W junction-to-case thermal resistance. The PowerPAD™ enhances thermal reliability in compact, high-power-density layouts.

Pin/Terminal Circuit Role Design Meaning
VDD (pins 1, 8) Power supply input Two dedicated VDD pins must be externally shorted; each connects to separate 0.1-µF decoupling capacitor (to AGND and PGND respectively)
IN (pin 2) Digital input Inverting logic input with TTL/CMOS thresholds; accepts 0–VDD signals; not intended for slow analog ramping
ENBL (pin 3) Enable control Active-high enable with internal 100-kΩ pull-up; forces OUT low when disabled - used for fault shutdown and soft-start sequencing
AGND (pin 4) Analog ground reference Reference for IN and ENBL inputs; must be connected via thick trace directly under device to PGND at single point
PGND (pin 5) Power ground return Return path for OUT current; must tie directly to MOSFET source to minimize di/dt-induced ringing on control nodes
OUT (pins 6, 7) Driver output Parallel-output configuration - pins 6 and 7 must be externally joined to deliver full ±9-A drive capability to MOSFET gate

Key Features

Feature Design Value
TrueDrive hybrid output stage Combines bipolar and MOSFET transistors to sustain ±9-A peak current at low VDD (e.g., 5 V), eliminating need for external boost circuitry
Separated AGND/PGND planes Prevents high-di/dt power switching noise from corrupting logic-level input thresholds - essential for stable operation in noisy SMPS environments
Miller-region optimized drive Delivers maximum current exactly when gate-drain capacitance (Cgd) dominates - reduces switching losses by up to 30% vs conventional drivers
Internal ENBL pull-up 100-kΩ resistor enables default-enabled operation with no external components; simplifies BOM and layout for basic applications
ESD robustness ±2000 V HBM, ±1000 V CDM - withstands handling and board assembly without additional protection circuitry

Applications

Switch Mode Power Supplies Motor Controllers

Use Scenario: High-efficiency 500-kHz buck converter for server VRM with synchronous rectification.

IC Role / Device Role: Low-side gate driver for N-channel synchronous rectifier MOSFET, triggered by PWM controller's inverted output.

Use Value: ±9-A peak drive ensures fast turn-on/turn-off of large FETs under high dV/dt, reducing conduction loss and improving efficiency above 94%.

Use Scenario: 3-phase BLDC inverter for industrial pump with discrete IGBT half-bridges.

IC Role / Device Role: Low-side driver for bottom-leg IGBTs, synchronized with high-side isolated gate drivers.

Use Value: 20-ns rise/fall times support 20-kHz PWM carrier frequency while maintaining clean edge integrity and minimizing shoot-through risk.

Class-D Switching Amplifiers Line Drivers

Use Scenario: 200-W audio amplifier using GaN FETs in half-bridge topology with zero-voltage switching.

IC Role / Device Role: Low-side driver for GaN HEMT gate, receiving signal from digital audio controller with precise dead-time control.

Use Value: Sub-35-ns propagation delay matching enables accurate dead-time implementation, preventing cross-conduction in high-frequency resonant stages.

Use Scenario: High-speed digital line driver for industrial fieldbus (e.g., RS-485 repeater node with transient protection).

IC Role / Device Role: Gate driver for series-pass MOSFET used as active termination switch in bidirectional bus interface.

Use Value: Enable pin allows dynamic bus isolation during fault events; ±9-A drive ensures rapid MOSFET turn-off (<100 ns) to clamp surge currents.

Equivalent & Alternatives

The following parts are listed as comparable options for similar low-side MOSFET driver applications.

Alternative Part Technical Difference Application Difference Selection Advice
UCC27322DR Inverting logic (UCC27321 is noninverting); identical pinout, specs, and package Required when controller outputs active-high PWM but power stage needs inverted gate signal (e.g., high-side bootstrap sync with low-side complement) Select UCC27322DR only if inverting logic polarity is needed; otherwise UCC27321DR is direct functional match.
TPS2828DBVR Lower 2-A peak drive, SOT-23-5 package, no enable pin, 5-V only supply Suitable for low-power DC-DC modules (<50 W) where space and cost outweigh performance requirements Choose TPS2828DBVR for cost-sensitive, low-current applications; UCC27321DR remains preferred for >100-W systems requiring Miller-optimized 9-A drive.

Compared with UCC27322DR, UCC27321DR provides noninverting logic essential for direct PWM-to-low-side-FET interfacing without external inverters; versus TPS2828DBVR, it delivers 4.5× higher peak current and thermal robustness for industrial-grade power conversion.

Availability

UCC27321DR is available at Aetrix Electronics and suitable for switch-mode power supplies, motor controllers, Class-D amplifiers, and industrial line drivers requiring stable component supply across extended temperature and high-reliability production cycles.

Supply support for UCC27321DR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and power management technologies, with over 50 years of innovation in high-performance analog ICs.

The UCC27321DR belongs to TI's high-speed gate driver product line, engineered specifically for demanding power conversion applications where Miller-effect mitigation, thermal efficiency, and layout resilience are critical design constraints.

FAQ

What is the logic polarity of UCC27321DR?

The UCC27321DR is a noninverting low-side driver: when the IN pin is high, the OUT pin goes high; when IN is low, OUT goes low. This matches standard PWM controller outputs driving N-channel low-side switches directly. Its counterpart, UCC27322DR, provides inverting logic for complementary drive requirements.

Does UCC27321DR require external pull-up or pull-down resistors on the ENBL pin?

No - UCC27321DR features an internal 100-kΩ pull-up resistor on the ENBL pin, making it active-high by default. Leaving ENBL unconnected enables normal operation; pulling it low disables the output (forces OUT low). External resistors are unnecessary unless custom hysteresis or timing control is required.

Can UCC27321DR drive GaN FETs effectively?

Yes - UCC27321DR's ±9-A peak current, 20-ns switching times, and low output impedance (0.4–1.5 Ω) make it well-suited for driving enhancement-mode GaN FETs in high-frequency totem-pole PFC and Class-D stages. Its Miller-optimized TrueDrive architecture ensures strong gate control during critical transition regions where GaN devices exhibit high Ciss/Crss ratios.

What is the recommended PCB layout practice for UCC27321DR's AGND and PGND connections?

AGND and PGND must connect at a single point directly beneath the UCC27321DR package using a thick copper trace. Separate 0.1-µF ceramic capacitors must be placed between VDD (pin 1) and AGND, and between VDD (pin 8) and PGND. Power MOSFETs must reside on the PGND side; control circuitry must remain on the AGND side to prevent noise coupling.

Is UCC27321DR pin-compatible with older SOIC-8 versions of the same family?

No - UCC27321DR uses the MSOP-PowerPAD™ (DGN) package (3.0 mm × 3.0 mm), which is physically smaller and thermally superior to the SOIC-8 (D) variant. While both share identical pin numbering and functions, the DGN package requires different land patterns and solder paste stencil design due to its exposed thermal pad and finer pitch.

UCC27321DR Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Series:
-
Package/Case:
8-SOIC (0.154", 3.90mm Width)
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Driven Configuration:
Low-Side
Channel Type:
Single
Number of Drivers:
1
Gate Type:
N-Channel, P-Channel MOSFET
Voltage - Supply:
4V ~ 15V
Logic Voltage - VIL, VIH:
1.1V, 2.7V
Current - Peak Output (Source, Sink):
9A, 9A
Input Type:
Inverting
High Side Voltage - Max (Bootstrap):
-
Rise / Fall Time (Typ):
20ns, 20ns
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
8-SOIC

UCC27321DR FAQ

1.How can I place an order for UCC27321DR through Aetrix?

Please submit a Request for Quotation (RFQ) for UCC27321DR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for UCC27321DR reliable?

The price and inventory of UCC27321DR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for UCC27321DR is usually 5 days.

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We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for UCC27321DR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for UCC27321DR?

UCC27321DR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your UCC27321DR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for UCC27321DR?

For technical support, including UCC27321DR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your UCC27321DR requirements.

6.How does Aetrix verify that UCC27321DR is sourced from the original manufacturer or authorized distributors?

All UCC27321DR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that UCC27321DR meets industry standards.

7.What is the process for return or replacement of UCC27321DR?

All UCC27321DR units undergo pre-shipment inspection (PSI). If there is an issue with UCC27321DR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The UCC27321DR part is unused and in its original packaging.

Return procedure for UCC27321DR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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