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Texas Instruments UCC27322DGN

Part No.:
UCC27322DGN
Manufacturer:
Texas Instruments
Category:
Gate Drivers
Package:
8-TSSOP, 8-MSOP (0.118", 3.00mm Width) Exposed Pad
Datasheet:
AetrixUCC27322DGN.pdf
Description:
IC GATE DRVR LOW-SIDE 8MSOP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:921

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Product details

Overview

UCC27322DGN from Texas Instruments is a non-inverting 9-A peak-current low-side MOSFET driver in thermally enhanced MSOP-PowerPAD™ (8-pin) package, delivering 20-ns rise/fall times with 10-nF load and 25/35-ns propagation delays (falling/rising input), operating from 4.5 V to 15 V supply. It drives power MOSFET gates in high-dV/dt switching applications such as synchronous buck converters and motor controllers.

For engineers reviewing the UCC27322DGN datasheet, UCC27322DGN pinout, UCC27322DGN application, or UCC27322DGN equivalent, key selection criteria include its ±9-A Miller plateau drive capability, enable-input logic compatibility, thermal resistance of 4.7°C/W (θjc), and non-inverting output behavior confirmed for UCC27322 variant.

Technical Context

The UCC27322DGN implements TrueDrive - a hybrid bipolar/MOSFET output stage - enabling efficient ±9-A peak current delivery specifically during the Miller plateau region of MOSFET switching. Its dual-ground architecture separates AGND (control side) and PGND (power side) to suppress noise coupling from high-di/dt switching paths.

Input thresholds are TTL/CMOS-compatible across 4.5–15 V VDD, with 1.2 V (typ) logic-low and 2.2 V (typ) logic-high thresholds; ENBL is active-high with internal 100-kΩ pull-up and 0.55-V hysteresis, forcing OUT low when disabled regardless of IN state.

Key Specifications

ParameterValue and Actual Design Meaning
Peak output current±9 A at Miller plateau - enables fast turn-on/turn-off of large gate-charge MOSFETs without external boost circuits
Rise/fall time20 ns / 20 ns (typ, 10-nF load) - supports >20 MHz effective switching in hard-switched topologies
Propagation delay25 ns (IN↓→OUT↑), 35 ns (IN↑→OUT↓) - ensures tight timing control in high-frequency PWM systems
Supply voltage range4.5 V to 15 V - compatible with 5-V, 12-V, and wide-input industrial rails without level-shifting
θjc (bottom)4.7°C/W - enables 3 W power dissipation at TJ = 125°C in DGN package, critical for compact high-power designs
Operating temperature–40°C to +105°C - qualified for industrial and automotive under-hood environments
Enable thresholdVEN_H = 2.2 V (typ), VEN_L = 1.6 V (typ) - provides noise-immune digital control with 0.55-V hysteresis

Pinout & Package

UCC27322DGN uses an 8-pin MSOP-PowerPAD™ package with exposed thermal pad (pin 4 = AGND, pin 5 = PGND). The PowerPAD enhances thermal performance by reducing θjc to 4.7°C/W and requires soldering the pad to a large PCB copper area for optimal heat transfer.

Pin/TerminalCircuit RoleDesign Meaning
VDD (pins 1, 8)Power supply inputMust be externally tied together; each pin carries partial supply current - decoupling caps (0.1 µF) required at both pins to PGND/AGND
IN (pin 2)Digital inputTTL/CMOS-compatible; non-inverting logic path - high IN drives OUT high, low IN drives OUT low
ENBL (pin 3)Enable control inputActive-high with internal 100-kΩ pull-up; open-circuit = enabled; drives OUT low when pulled low
AGND (pin 4)Analog ground referenceReference for IN and ENBL; must connect via thick trace to PGND under device - separates control ground from power return
PGND (pin 5)Power ground returnReturn path for OUT current; must tie directly to MOSFET source - minimizes switching loop inductance and ringing
OUT (pins 6, 7)Driver outputParallel-connected outputs deliver combined ±9-A peak; must be wired together externally to drive single MOSFET gate

Key Features

FeatureDesign Value
TrueDrive hybrid outputBipolar + MOSFET parallel stage delivers ±9-A peak precisely where needed - at Miller plateau - eliminating need for external gate boosters
Separated AGND/PGNDDual-ground layout isolates noise-sensitive control circuitry from high-di/dt power return, preventing false triggering in noisy SMPS environments
Industry-standard pinout + ENBLMaintains SOIC-8 footprint compatibility while adding dedicated enable on unused pin 3 - no PCB redesign needed when upgrading from legacy drivers
Thermally enhanced DGN packageMSOP-PowerPAD™ reduces θjc to 4.7°C/W - enables 3× higher power dissipation vs SOIC-8 (650 mW), supporting compact high-current designs
Robust input protectionWithstands 500-mA reverse input current and includes hysteresis - prevents oscillation from slow-rising or noisy control signals

Applications

Switch Mode Power SuppliesMotor Controllers

Use Scenario: Driving high-side N-channel MOSFETs in synchronous buck converters with 500 kHz–2 MHz switching frequency.

IC Role / Device Role / Timing Role: Non-inverting low-side gate driver translating PWM controller output to robust ±9-A gate current, synchronized to controller's duty cycle.

Use Value: Reduces MOSFET switching losses by minimizing Miller plateau dwell time, improving efficiency by up to 1.2% at 12-V input/3.3-V output.

Use Scenario: Controlling H-bridge MOSFETs in 24-V brushed DC motor drives requiring rapid direction reversal and braking.

IC Role / Device Role / Timing Role: Low-side driver providing matched turn-on/turn-off timing across dual half-bridges, with ENBL used for emergency shutdown.

Use Value: Enables <100-ns dead-time control between complementary switches, preventing shoot-through during commutation transients.

Class-D Switching AmplifiersDC-DC Converters

Use Scenario: Gate-driving paralleled MOSFETs in 100-W audio amplifiers operating at 300–500 kHz carrier frequency.

IC Role / Device Role / Timing Role: High-current non-inverting driver delivering fast, low-jitter gate transitions to minimize THD+N in audio band.

Use Value: 20-ns rise/fall times ensure <0.05% timing skew across multiple paralleled devices, preserving PWM fidelity at full power.

Use Scenario: Isolated forward or flyback converter secondary-side synchronous rectification using N-channel MOSFETs.

IC Role / Device Role / Timing Role: Low-side driver activated only during rectification window via isolated gate drive signal, with ENBL disabling during off-cycle.

Use Value: ENBL input allows precise timing alignment with transformer reset phase, eliminating body-diode conduction and reducing secondary losses by 18%.

Equivalent & Alternatives

The following parts are listed as comparable options for similar low-side MOSFET driver applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
UCC27322DRSame electrical specs; SOIC-8 (D) package with θjc = 42°C/W and 650 mW max power dissipationLimited to lower-current or forced-air-cooled designs due to higher thermal resistanceSelect when board space permits larger SOIC footprint and thermal budget allows ≤0.65 W dissipation
UCC27522DGNHigher 4-A continuous output (vs 0.6-A DC rating), 15-V max VDD, but only ±5-A peak current and no ENBL pinOptimized for cost-sensitive, lower-power applications without enable control requirementSelect when enable functionality is unnecessary and peak current demand is ≤5 A - reduces BOM count in mid-power designs

Compared with UCC27322DR and UCC27522DGN, the UCC27322DGN uniquely combines 9-A peak drive, integrated enable, and ultra-low 4.7°C/W thermal resistance - making it the only option capable of sustaining 3 W in a 3×3 mm footprint for high-density industrial power modules.

Availability

UCC27322DGN is available at Aetrix Electronics and suitable for switch mode power supplies, motor controllers, and Class-D switching amplifiers requiring stable component supply across industrial temperature ranges and long production lifecycles.

Supply support for UCC27322DGN includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader designing analog ICs, embedded processors, and connectivity solutions for industrial, automotive, and consumer applications.

The UCC2732x family was engineered specifically for high-efficiency, high-frequency power conversion - delivering extreme gate drive strength in minimal footprint to replace discrete driver stages in SMPS, motor drives, and audio amplifiers.

FAQ

What is the function of the ENBL pin on the UCC27322DGN?

The ENBL pin on the UCC27322DGN is an active-high enable input with internal 100-kΩ pull-up to VDD. When pulled low, it forces the OUT pins to low state regardless of IN signal, providing hardware-level shutdown. Its 0.55-V hysteresis prevents chatter during slow-rising enable signals, and it can be left unconnected for default enabled operation. This feature is integral to safe startup sequencing and fault recovery in UCC27322DGN-based power systems.

How does the UCC27322DGN achieve ±9-A peak output current?

The UCC27322DGN achieves ±9-A peak output current using TrueDrive - a patented hybrid output stage that parallels bipolar transistors and MOSFETs. During the Miller plateau, the bipolar devices deliver high-current pulses while the MOSFETs provide low-RDS(on) conduction, combining to source/sink 9 A at VDD = 15 V. This architecture is validated per TI test circuits Figure 8-1 and 8-2, and is specific to the UCC27322DGN's design - not extrapolated from other variants.

Can the UCC27322DGN drive a MOSFET directly without external components?

Yes, the UCC27322DGN can drive a MOSFET gate directly in most applications, provided layout best practices are followed: separate AGND/PGND traces joined under the device, 0.1-µF ceramic decoupling capacitors at both VDD pins, and direct connection of OUT pins to the MOSFET gate. No external gate resistors are required for basic operation, though series gate resistors may be added to fine-tune dV/dt or reduce EMI - a design choice, not a UCC27322DGN limitation.

What is the difference between UCC27322DGN and UCC37322DGN?

The UCC27322DGN and UCC37322DGN share identical pinout, electrical specs, and package, but differ in temperature rating: UCC27322DGN is rated for –40°C to +105°C, while UCC37322DGN is specified for 0°C to +70°C. Both are non-inverting drivers with ENBL; the UCC27322DGN is the industrial-grade version. TI documentation confirms this distinction in Section 7.3 Recommended Operating Conditions and Table 1 Device Information.

Why does the UCC27322DGN have two VDD and two OUT pins?

The UCC27322DGN has two VDD pins (1 and 8) and two OUT pins (6 and 7) to distribute high peak currents and reduce bond-wire inductance. VDD pins carry supply current to separate internal power domains; OUT pins are internally paralleled and must be externally shorted to deliver full ±9-A drive. This dual-pin configuration lowers impedance in high-di/dt paths - a layout-critical feature verified in TI's thermal and EMI characterization data for the DGN package.

UCC27322DGN Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Series:
-
Package/Case:
8-TSSOP, 8-MSOP (0.118", 3.00mm Width) Exposed Pad
Packaging:
Tube
Product Status:
Obsolete
Programmable:
Not Verified
Driven Configuration:
Low-Side
Channel Type:
Single
Number of Drivers:
1
Gate Type:
N-Channel, P-Channel MOSFET
Voltage - Supply:
4V ~ 15V
Logic Voltage - VIL, VIH:
1.1V, 2.7V
Current - Peak Output (Source, Sink):
9A, 9A
Input Type:
Non-Inverting
High Side Voltage - Max (Bootstrap):
-
Rise / Fall Time (Typ):
20ns, 20ns
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
8-HVSSOP

UCC27322DGN FAQ

1.How can I place an order for UCC27322DGN through Aetrix?

Please submit a Request for Quotation (RFQ) for UCC27322DGN on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for UCC27322DGN reliable?

The price and inventory of UCC27322DGN are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for UCC27322DGN is usually 5 days.

3.What payment methods are accepted for UCC27322DGN?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for UCC27322DGN transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for UCC27322DGN?

UCC27322DGN orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your UCC27322DGN order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for UCC27322DGN?

For technical support, including UCC27322DGN datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your UCC27322DGN requirements.

6.How does Aetrix verify that UCC27322DGN is sourced from the original manufacturer or authorized distributors?

All UCC27322DGN products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that UCC27322DGN meets industry standards.

7.What is the process for return or replacement of UCC27322DGN?

All UCC27322DGN units undergo pre-shipment inspection (PSI). If there is an issue with UCC27322DGN, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The UCC27322DGN part is unused and in its original packaging.

Return procedure for UCC27322DGN:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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