Texas Instruments UCC27322P

Overview

UCC27322P from Texas Instruments is a non-inverting, single-channel, low-side MOSFET driver delivering ±9 A peak output current at the Miller plateau region, operating from 4.5 V to 15 V supply, with 20 ns typical rise/fall times into 10 nF load, and integrated enable (ENBL) functionality - used in high-frequency switch-mode power supplies to drive N-channel MOSFET gates with minimal propagation delay (35 ns rising, 25 ns falling).

For engineers reviewing the UCC27322P datasheet, UCC27322P pinout, UCC27322P application, or UCC27322P equivalent, key selection criteria include its true-drive hybrid output stage, thermally enhanced SOIC-8 package (θ_jc = 42°C/W), logic-compatible input thresholds independent of V_DD, and active-high ENBL with internal 100 kΩ pull-up - all critical for reliable gate driving in high-dV/dt environments.

Technical Context

The UCC27322P implements a non-inverting logic function with dedicated enable control, where ENBL (pin 3) overrides IN (pin 2) to force OUT low when disabled. Its TrueDrive output stage combines bipolar and MOSFET transistors in parallel to deliver 9 A sourcing/sinking capability precisely during the Miller plateau, minimizing switching losses in high-speed power stages.

Input thresholds are TTL/CMOS compatible across the full 4.5–15 V V_DD range (V_{IN_H} = 2.2 V typ, V_{IN_L} = 1.2 V typ), and the dual V_DD pins (1 & 8) and separated AGND/PGND grounds support noise-immune layout - PGND ties directly to MOSFET source, while AGND references control circuitry.

Key Specifications

Pinout & Package

UCC27322P is supplied in an 8-pin SOIC (D) package with exposed thermal pad (not PowerPAD™ - that applies only to DGN variant). Pin 1 and Pin 8 are both V_DD inputs requiring external connection; Pins 6 and 7 are paralleled outputs (OUT); Pin 3 is active-high ENBL with internal 100 kΩ pull-up to V_DD; Pin 4 is AGND (control ground); Pin 5 is PGND (power ground); Pin 2 is logic input (IN).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar low-side MOSFET driver applications.

Compared with UCC27321P and TPS2828DBVR, the UCC27322P uniquely balances 9 A drive strength, non-inverting logic, enable control, and SOIC-8 thermal performance - making it the optimal choice for industrial-grade power conversion where reliability and timing precision are critical.

Availability

UCC27322P is available at Aetrix Electronics and suitable for switch-mode power supplies, motor controllers, and Class-D audio amplifiers requiring stable component supply, long-term lifecycle support, and consistent parametric performance across temperature and voltage ranges.

Supply support for UCC27322P includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and power management technologies, with decades of expertise in high-reliability power conversion solutions.

The UCC27322P belongs to TI's UCC2732x family of high-speed low-side gate drivers, designed specifically for demanding industrial and computing power applications where fast, robust, and thermally efficient MOSFET gate driving is essential.

FAQ

What is the logic configuration of the UCC27322P?

The UCC27322P is a non-inverting low-side MOSFET driver: when the IN pin is high, the OUT pins go high; when IN is low, OUT goes low. This matches standard PWM controller outputs driving N-channel MOSFETs directly. The UCC27322P differs from the inverting UCC27321P, which complements controller outputs of opposite polarity.

Does the UCC27322P require external pull-up resistors on the ENBL pin?

No - the UCC27322P includes an internal 100 kΩ pull-up resistor from ENBL (pin 3) to V_DD, enabling active-high operation by default. Leaving ENBL unconnected results in enabled operation; tying it to GND disables the output (forces OUT low). External pull-ups are unnecessary and may interfere with enable timing.

Can the UCC27322P drive a 1000 V, 100 A SiC MOSFET?

The UCC27322P can drive high-capacitance SiC MOSFETs, but only within its absolute maximum ratings: V_DD ≤ 15 V, peak output current ≤ ±9 A, and junction temperature ≤ 150°C. For 1000 V SiC devices, verify gate charge (Q_g) and Miller charge (Q_gd) - if Q_gd exceeds ~100 nC, consider adding a gate resistor to limit di/dt and prevent oscillation, as the UCC27322P itself does not regulate slew rate.

What is the recommended PCB layout practice for UCC27322P's AGND and PGND pins?

AGND (pin 4) and PGND (pin 5) must be connected by a single, wide, low-inductance copper trace directly beneath the UCC27322P package. Decoupling capacitors (0.1 µF ceramic) must be placed between V_DD (pins 1/8) and AGND, and separately between V_DD and PGND. Control circuitry grounds connect to AGND; MOSFET source connects exclusively to PGND - preventing noise coupling into input logic.

Is the UCC27322P pin-compatible with older TI drivers like UC3709?

Yes - the UCC27322P uses the industry-standard 8-pin SOIC pinout and adds ENBL on pin 3 (previously NC on UC3709), making it a functional upgrade. All other pins (V_DD, IN, OUT, GND) retain identical mapping and electrical behavior. No PCB changes are required to replace UC3709 with UCC27322P, though ENBL should be tied high or left floating for legacy compatibility.