Texas Instruments UCC27323D

Overview

UCC27323D from Texas Instruments is a dual low-side MOSFET driver IC with dual-inverting logic configuration, ±4-A peak output current at the Miller plateau region, 20-ns rise / 15-ns fall time (1.8-nF load), and SOIC-8 (D) package. It operates from 4.5 V to 15 V supply voltage and delivers high-speed gate drive for synchronous rectification in DC-DC converters.

For engineers reviewing the UCC27323D datasheet, UCC27323D pinout, UCC27323D application, or UCC27323D equivalent, this page provides verified technical context, real-world switching performance data, thermal resistance metrics (R_θJA = 107.3°C/W), input threshold behavior across V_DD, and validated alternative options for dual-inverting gate drive requirements.

Technical Context

The UCC27323D implements a Bi-CMOS hybrid output stage-parallel bipolar and MOSFET transistors-that sustains ±4-A peak sourcing/sinking capability even at low V_DD (4.5 V), enabling robust Miller plateau drive. Its TTL/CMOS-compatible inputs feature wide hysteresis (VIN_H = 1.6–2.5 V, VIN_L = 0.8–1.5 V) and are supply-voltage independent.

As a dual-inverting driver, both OUTA and OUTB invert their respective inputs (INA, INB); unused inputs must be tied to V_DD or GND-not left floating. The device supports paralleling of OUTA/OUTB for 8-A aggregate drive, with strict layout guidance requiring short trace lengths between INA/INB and OUTA/OUTB to minimize channel mismatch.

Key Specifications

Pinout & Package

UCC27323D uses the SOIC-8 (D) package: 4.90 mm × 3.91 mm, surface-mount, gull-wing leads. Thermal resistance R_θJA = 107.3°C/W; R_θJB = 47.3°C/W. PowerPAD not present-only standard SOIC variant.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-inverting gate drive applications.

Compared with TC4427ACOA, UCC27323D delivers twice the Miller-region current for faster turn-on of high-gate-charge devices; compared with UCC27323DGN, it trades thermal performance for SOIC-8 compatibility and broader board-level reuse.

Availability

UCC27323D is available at Aetrix Electronics and suitable for switch-mode power supplies, DC-DC converters, and solar microinverters requiring stable component supply across industrial temperature ranges and multi-year production cycles.

Supply support for UCC27323D includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor company headquartered in Dallas, Texas, specializing in analog, embedded processing, and power management ICs for industrial, automotive, and communications markets.

The UCC27323D belongs to the UCCx732x family of high-speed low-side MOSFET drivers, designed specifically to replace discrete transistor-based gate buffers in high-frequency, high-efficiency power conversion systems.

FAQ

What is the maximum operating junction temperature for UCC27323D?

The UCC27323D is rated for junction temperatures from –40°C to +125°C under recommended operating conditions. Absolute maximum junction temperature is +150°C, but sustained operation above +125°C requires derating per TI's thermal guidelines. The SOIC-8 package has R_θJA = 107.3°C/W, so at 100-mA average output current and 12-V supply, junction rise is ~1.3°C-well within limits. Always verify actual T_J using measured board temperatures and power dissipation models.

Can UCC27323D drive N-channel MOSFETs in high-side configurations?

No-UCC27323D is a low-side driver only and lacks bootstrap or isolated supply capability required for high-side N-MOSFET drive. Its dual-inverting outputs are optimized for low-side N-MOSFETs (with inverted logic) or high-side P-MOSFETs. For high-side N-MOSFETs, use a dedicated high-side driver like UCC27714 or a bootstrap-based IC such as IR2110. Attempting to use UCC27323D in high-side N-MOSFET roles will result in incomplete turn-on and excessive conduction loss.

Does UCC27323D require external gate resistors?

UCC27323D does not require external gate resistors for basic functionality, but they are strongly recommended for EMI control, ringing suppression, and shoot-through prevention. TI advises using matched 5–10-Ω resistors in series with OUTA/OUTB when driving high-dV/dt loads. If paralleling outputs, split the resistor equally (e.g., 5 Ω on each output) to balance channel currents. Omitting gate resistors may cause oscillation in layouts with >10-nH trace inductance, especially with >1000-pF gate loads.

How does UCC27323D handle input noise or slow-rising signals?

UCC27323D features wide input hysteresis (≈700 mV) and TTL/CMOS-compatible thresholds independent of V_DD, providing strong immunity to digital noise up to ±1 V. However, it is not designed for slow-rising inputs: signals with slew rates <20 V/µs may cause metastability or multiple toggles at the output. TI explicitly warns against shaping input edges to control output timing-instead, use external RC networks on the output side. For noisy environments, add a 100-pF capacitor from INA/INB to GND to filter RF interference without degrading edge speed.

Is UCC27323D pin-compatible with UCC27324D or UCC27325D?

Yes-UCC27323D, UCC27324D, and UCC27325D share identical SOIC-8 (D) packaging and pinout (INA, INB, GND, OUTB, VDD, OUTA, N/C, N/C). The only functional difference is logic configuration: UCC27323D is dual-inverting, UCC27324D is dual-noninverting, and UCC27325D is mixed (inverting A, noninverting B). Swapping them requires updating input signal polarity in firmware or hardware; no PCB change is needed. All three support identical electrical specs, thermal ratings, and paralleling capability.