Texas Instruments UCC27324DGN

Overview

UCC27324DGN from Texas Instruments is a dual-channel, noninverting low-side MOSFET driver IC in an 8-pin MSOP-PowerPAD™ package, delivering ±4-A peak gate drive current at the Miller plateau region, with 20-ns rise and 15-ns fall times into 1.8-nF load, operating from 4.5 V to 15 V supply, and rated for –40°C to +125°C junction temperature. It serves as a high-speed buffer between PWM controllers and power MOSFETs in DC-DC converters.

For engineers reviewing the UCC27324DGN datasheet, UCC27324DGN pinout, UCC27324DGN application, or UCC27324DGN equivalent, this page delivers verified electrical specs, thermal performance data, real-world switching behavior under Miller plateau conditions, and validated alternatives for gate-drive optimization in industrial power supplies.

Technical Context

The UCC27324DGN implements a Bi-CMOS hybrid output stage-parallel bipolar and MOSFET transistors-that sustains ±4-A peak sourcing/sinking capability even at low VDD (4.5 V), enabling robust gate charging during the Miller plateau where dV/dt is highest. Its TTL/CMOS-compatible inputs feature wide hysteresis (VIN_H = 1.6–2.5 V, VIN_L = 0.8–1.5 V) and are supply-voltage independent, ensuring noise immunity across input transitions.

Each channel operates independently with noninverting logic: INA drives OUTA, INB drives OUTB. The device supports output paralleling (OUTA + OUTB) for up to ±8-A combined drive, provided inputs are shorted at the IC pad and external gate resistors are balanced. No internal shoot-through protection is implemented-the truth table confirms simultaneous high/low outputs only occur when inputs match logic states.

Key Specifications

Pinout & Package

UCC27324DGN uses an 8-pin MSOP-PowerPAD™ package (3.00 mm × 3.00 mm), featuring an exposed thermal pad electrically connected to GND and optimized for low junction-to-board thermal resistance (θ_JB = 32.6°C/W).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual noninverting low-side gate driver applications.

Compared with UCC27324D and LM5113SDX, the UCC27324DGN uniquely combines dual noninverting logic, ±4-A Miller plateau drive, supply-independent inputs, and thermally optimized PowerPAD packaging-making it the only option supporting paralleled outputs and industrial temperature range in a 3-mm² footprint.

Availability

UCC27324DGN is available at Aetrix Electronics and suitable for switch-mode power supplies, solar inverters, and motor control systems requiring stable component supply, full industrial temperature support, and high-reliability gate drive performance.

Supply support for UCC27324DGN includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor company headquartered in Dallas, Texas, designing analog ICs, embedded processors, and system solutions for industrial, automotive, and communications markets.

The UCC27324DGN belongs to TI's UCCx732x family of high-speed low-side MOSFET drivers, engineered specifically for high-efficiency, high-frequency power conversion where precise gate timing, Miller plateau current delivery, and thermal resilience are critical.

FAQ

What is the maximum continuous output current rating for UCC27324DGN?

The UCC27324DGN is rated for ±4-A peak current during the Miller plateau region (transient, ~100 ns), not continuous DC. Its DC output current limit is 0.2 A per channel (per Absolute Maximum Ratings). For sustained gate drive, average current is determined by MOSFET gate charge (Q_g) and switching frequency: I_AVG = Q_g × f. At 300 kHz and Q_g = 100 nC, UCC27324DGN delivers ~30 mA average per channel-well within its thermal limits when properly heatsinked via the PowerPAD™.

Can UCC27324DGN drive high-side N-channel MOSFETs directly?

No, UCC27324DGN is a dedicated low-side driver with ground-referenced outputs and cannot drive high-side N-channel MOSFETs directly. It lacks a floating high-side supply or level-shifting capability. To drive high-side N-MOSFETs, UCC27324DGN must be paired with a bootstrap circuit, isolated gate driver transformer, or high-voltage level shifter. Its outputs swing only between GND and VDD-never above the input rail.

Is UCC27324DGN pin-compatible with UCC27323DGN?

Yes, UCC27324DGN and UCC27323DGN share identical 8-pin MSOP-PowerPAD™ footprints and pinouts, including N/C on Pins 1 and 8, INA/INB on Pins 2/4, OUTA/OUTB on Pins 7/5, GND on Pin 3, and VDD on Pin 6. The only functional difference is logic configuration: UCC27324DGN has dual noninverting outputs, while UCC27323DGN has dual inverting outputs. Swapping them requires inverting the input signals or redesigning the control logic.

What bypass capacitor values are recommended for UCC27324DGN VDD?

Texas Instruments specifies two mandatory VDD bypass capacitors for UCC27324DGN: a 0.1-μF X7R ceramic capacitor placed as close as possible to Pin 6 (VDD) and Pin 3 (GND), plus a ≥1-μF low-ESR bulk capacitor (e.g., 2.2-μF tantalum or polymer) in parallel. This dual-capacitor network maintains low impedance across 100 kHz–100 MHz, ensuring stable 4-A transient current delivery during Miller plateau transitions without supply droop or ringing.

Does UCC27324DGN include built-in overcurrent or thermal shutdown protection?

No, UCC27324DGN does not include overcurrent detection, thermal shutdown, or fault reporting circuitry. It is a bare-bones high-speed gate driver designed for simplicity and speed-not system protection. External current-sense resistors, comparators, or microcontroller-based monitoring must be added for overcurrent or overtemperature response. Its Absolute Maximum Ratings define safe operating limits (e.g., 150°C junction), but no internal circuit enforces them.