Texas Instruments UCC27324P

Overview

UCC27324P from Texas Instruments is a dual noninverting low-side MOSFET driver IC delivering ±4-A peak output current at the Miller plateau region, with 20-ns rise and 15-ns fall times into 1.8-nF load, operating from 4.5 V to 15 V supply, and designed for high-efficiency switching in DC-DC converters and solar inverters.

For engineers reviewing the UCC27324P datasheet, UCC27324P pinout, UCC27324P application, or UCC27324P equivalent, this page delivers verified electrical specs, thermal performance data, SOIC-8 package layout, dual-channel gate drive behavior, and real-world selection guidance for power stage design.

Technical Context

The UCC27324P implements a Bi-CMOS hybrid output stage-parallel bipolar and MOSFET transistors-to sustain ±4-A peak sourcing/sinking even at low VDD (4.5 V), minimizing Miller plateau transition time. Its TTL/CMOS-compatible inputs feature wide hysteresis and are supply-voltage independent, ensuring noise immunity across industrial temperature range (–40°C to +125°C).

Unlike standard CMOS drivers, the UCC27324P's constant-current drive architecture maintains high slew rate under capacitive loading, and its dual noninverting logic configuration enables synchronous control of two N-channel MOSFETs without signal inversion-critical for half-bridge topologies requiring matched timing and polarity.

Key Specifications

Pinout & Package

UCC27324P uses an 8-pin SOIC (D) package measuring 4.90 mm × 3.91 mm, with exposed pad not connected internally. The PowerPAD variant (DGN) is thermally enhanced but UCC27324P specifically uses the standard SOIC-8 footprint.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual noninverting gate driver applications.

Compared with UCC27324D, the UCC27324P offers identical performance in through-hole format but higher thermal resistance; compared with LM5113SD, it provides true dual-channel noninverting logic and superior noise immunity, making it preferable for multi-MOSFET synchronous control without added complexity.

Availability

UCC27324P is available at Aetrix Electronics and suitable for switch-mode power supplies, DC-DC converters, and solar inverters requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for UCC27324P includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and power management technologies, with over 90 years of innovation in industrial, automotive, and communications markets.

The UCC2732x family was engineered specifically for high-current, high-speed gate driving in power conversion systems-emphasizing Miller plateau current delivery, thermal robustness, and logic flexibility across diverse topologies.

FAQ

What is the maximum capacitive load the UCC27324P can drive while maintaining specified rise/fall times?

The UCC27324P is characterized for 20 ns rise / 15 ns fall times into a 1.8-nF load per channel. At higher capacitance (e.g., 10 nF), rise/fall times increase to ~40 ns, but ±4-A peak current capability remains intact. For loads exceeding 5 nF, external gate resistors may be added to manage EMI without compromising switching speed.

Can the UCC27324P drive both high-side and low-side N-MOSFETs in a half-bridge configuration?

The UCC27324P is a low-side-only driver with ground-referenced outputs. It cannot directly drive high-side N-MOSFETs without external level-shifting circuitry. For half-bridge applications, pair UCC27324P with a dedicated high-side driver like UCC27201 or use bootstrap-based alternatives such as IRS2007.

Does the UCC27324P require external pull-up or pull-down resistors on INA and INB inputs?

No-UCC27324P inputs have built-in hysteresis and rail-to-rail compatibility. However, unused inputs must be hard-wired to either VDD or GND; floating inputs risk undefined output states and increased EMI susceptibility. External resistors are unnecessary unless interfacing with open-drain logic sources.

How does the UCC27324P's Bi-CMOS output stage improve efficiency versus standard CMOS drivers?

The Bi-CMOS hybrid stage combines bipolar transistors (for high current at low V_CE(sat)) and MOSFETs (for low R_DS(on) at high V_GS), enabling ±4-A drive down to 4.5-V supply. This avoids the current droop seen in pure CMOS drivers below 6 V, sustaining Miller plateau current and reducing switching energy loss by up to 30% in 12-V systems.

Is the UCC27324P pin-compatible with earlier UCC2732x variants like UCC27323P or UCC27325P?

Yes-UCC27324P shares identical SOIC-8 pinout and package dimensions with UCC27323P and UCC27325P. Only logic function differs: UCC27323P is dual-inverting, UCC27325P is mixed inverting/noninverting. Swapping requires verifying input signal polarity and updating firmware or control logic accordingly.